Diodes DMG4406LSS User Manual

DMG4406LSS
N-CHANNEL ENHANCEMENT MODE MOSFET
Product Summary
I
D
TA = +25°C
10.3A
V
(BR)DSS
30V
R
11m @ V
15m @ VGS = 4.5V
DS(ON)
max
= 10V
GS
Description
This MOSFET has been designed to minimize the on-state resistance
) and yet maintain superior switching performance, making it
(R
DS(ON)
ideal for high efficiency power management applications.
Applications
Backlighting
Power Management Functions
DC-DC Converters
ADVANCE INFORMATION
SO-8
Top View
max
9.3A
S
S
G
Features and Benefits
100% Unclamped Inductive Switch (UIS) test in production
Low On-Resistance
Low Input Capacitance
Fast Switching Speed
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
Case: SO-8
Case Material: Molded Plastic, "Green" Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminal Connections Indicator: See diagram
Terminals: Finish Matte Tin annealed over Copper leadframe.
Solderable per MIL-STD-202, Method 208
Weight: 0.008 grams (approximate)
Top View
Internal Schematic
DS
D
D
D
G
Equivalent Circuit
e3
D
S
Ordering Information (Note 4)
Part Number Case Packaging
DMG4406LSS-13 SO-8 2,500/Tape & Reel
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
8 5
G4406LS
WWYY
1 4
Chengdu A/T Site Shanghai A/T Site
DMG4406LSS
Document number: DS35539 Rev. 8 - 2
8 5
G4406LS
WWYY
1 4
= Manufacturer’s Marking G4406LS = Product Type Marking Code YYWW = Date Code Marking YY or YY = Year (ex: 13 = 2013) WW = Week (01 - 53) YY = Date Code Marking for SAT (Shanghai Assembly/ Test site) YY = Date Code Marking for CAT (Chengdu Assembly/ Test site)
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)
g
g
g
)
r
)
r
r
DMG4406LSS
Maximum Ratings (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Value Units
Drain-Source Voltage Gate-Source Voltage
Steady
Continuous Drain Current (Note 6) VGS = 10V
State
t<10s
Steady
Continuous Drain Current (Note 6) VGS = 4.5V
State
t<10s
Maximum Continuous Body Diode Forward Current (Note 6) Pulsed Drain Current (10µs pulse, duty cycle = 1%) Avalanche Current (Note 7) L = 0.1mH Repetitive Avalanche Energy (Note 7) L = 0.1mH
Thermal Characteristics (@T
= +25°C, unless otherwise specified.)
A
T
= +25°C
A
= +70°C
T
A
T
= +25°C
A
T
= +70°C
A
= +25°C
T
A
T
= +70°C
A
= +25°C
T
A
= +70°C
T
A
V
DSS
V
GSS
I
D
I
D
I
D
I
D
I
S
I
DM
I
AR
E
AR
30 V
±20 V
10.3
8.3
13.4
10.6
9.3
7.3
12.0
9.5
A
A
A
A
2.5 A 90 A 22 A 24 mJ
Characteristic Symbol Value Units
Total Power Dissipation (Note 5)
Thermal Resistance, Junction to Ambient (Note 5)
ADVANCE INFORMATION
Total Power Dissipation (Note 6)
Thermal Resistance, Junction to Ambient (Note 6)
Thermal Resistance, Junction to Case Operating and Storage Temperature Range
P
Steady State
t<10s 48 °C/W
Steady State
t<10s 37 °C/W
R
P
R
R
T
J, TSTG
JA
JC
D
JA
D
1.5 W 80 °C/W
2.0 W 61 °C/W
6.4 °C/W
-55 to 150 °C
Electrical Characteristics (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 8)
Drain-Source Breakdown Voltage Zero Gate Voltage Drain Current Gate-Source Leakage
BV
I
DSS
I
GSS
DSS
30 — — V — — — —
1 A
±100 nA
VGS = 0V, ID = 250A VDS = 30V, VGS = 0V
VGS = ±20V, VDS = 0V ON CHARACTERISTICS (Note 8) Gate Threshold Voltage
Static Drain-Source On-Resistance
Forward Transfer Admittance Diode Forward Voltage
V
GS(th
R
DS (ON)
|Y V
SD
|
fs
1.4 — 2.0 V — — — —
8 11 12 15 32 - S
0.70 1.0 V
VDS = VGS, ID = 250A
= 10V, ID = 12A
V
m
GS
V
= 4.5V, ID = 10A
GS
VDS = 5V, ID = 12A
VGS = 0V, IS = 1A DYNAMIC CHARACTERISTICS (Note 9) Input Capacitance Output Capacitance Reverse Transfer Capacitance Gate resistance
C
iss
C
oss
C
rss
R Total Gate Charge (VGS = 4.5V) Qg Total Gate Charge (VGS = 10V) Qg Gate-Source Charge Gate-Drain Charge Turn-On Delay Time Turn-On Rise Time Turn-Off Delay Time Turn-Off Fall Time Reverse Recovery Time Reverse Recovery Charge
Notes: 5. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate.
7. I
and EAR rating are based on low frequency and duty cycles to keep TJ = +25°C
AR
8. Short duration pulse test used to minimize self-heating effect.
9. Guaranteed by design. Not subject to product testing.
Q Q
t
D(on
t
D(off
s
d
t
t
f
t
r
Q
r
DMG4406LSS
Document number: DS35539 Rev. 8 - 2
— — — — — — — — — — — — — —
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1281
145 125
1.2
12.5
26.7
3.6
4.4
5.2
21.2
22.3
5.1
8.5
7.0
— — — — — — — — — — — — — —
= 15V, VGS = 0V,
V
pF
nC
ns
ns nC
DS
f = 1.0MHz
VDS = 0V, VGS = 0V, f = 1.0MHz
V
= 15V, ID = 12A
DS
= 15V, VGS = 10V,
V
DD
= 1.25, RG = 3,
R
L
IF=12A, di/dt=500A/µs
September 2013
© Diodes Incorporated
R
CUR
RENT
RAIN
C
URR
N
T
R,DR
OUR
ON-R
R
R
OUR
ON-R
R
RAIN
OUR
C
R
R
OUR
C
ON-R
TANC
DMG4406LSS
30
V= 10V
25
(A)
20
GS
V = 4.5VGS
V = 4.0VGS
V = 3.5VGS
V = 3.0VGS
15
30
V = 5.0VDS
25
(A)
20
E
15
AIN
10
D
I, D
5
0
0 0.5 1.0 1.5 2.0
V , DRAIN -SOURCE VOLTAGE(V)
DS
V = 2.5VGS
Fig. 1 Typical Output Characteristics
0.04
10
D
I, D
5
0
01 234
V , GATE-SOURCE VOLTAGE (V)
GS
T = 150CA
T = 125CA
T = 85CA
T = 25CA
T = -55CA
Fig. 2 Typical Transfer Characteristics
0.04
V = 4.5VGS
ADVANCE INFORMATION
0.03
ESISTANCE( )
0.02
CE
AIN-S
0.01
DS(ON)
0
0 5 10 15 20 25 30
I , DRAIN SOURCE CURRENT (A)
D
Fig. 3 Typical On-Resistance vs.
Drain Current and Gate Voltage
0.03
ESISTANCE( )
CE
AIN-S
0.02
0.01
T = 125 CA
T = 150 CA
, D
DS(ON)
0
0 5 10 15 20 25 30
I , DRAIN SOURCE CURRENT (A)
D
Fig. 4 Typical On-Resistance vs.
Drain Current and Temperature
T = 85CA
T = 25CA
T = -55CA
E ( )
E
ESIS
-S (NORMALIZED)
E
V=.5V
4
GS
I=A
5
D
, D
DS(ON)
ON-RESISTANCE
-50 -25 0 25 50 75 100 125 150 T , JUNCTION TEMPERATURE ( C)
J
Fig. 5 On-Resistance Variation with Temperature
AIN-S
, D
DS(ON)
-50 -25 0 25 50 75 100 125 150
T , JUNCTION TEMPERATURE ( C)
J
Fig. 6 On-Resistance Variation with Temperature
V = 10V
GS
I= A
10
D
DMG4406LSS
Document number: DS35539 Rev. 8 - 2
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© Diodes Incorporated
GATE THRESH
O
O
TAG
OUR
CE CUR
REN
T
C
UNC
TIO
N CAPACITAN
C
F
GE CUR
REN
T
GAT
O
URC
OLTAG
R
N
C
URREN
T
DMG4406LSS
30
E(V)
L
25
(A)
20
LD V
15
10
S
I, S
5
GS(TH)
V,
0
-50 -25 0 25 50 75 100 125 150 T , AMBIENT TEMPERATURE (°C)
A
Fig. 7 Gate Threshold Variation vs. Ambient Temperature
2,000
1,800
ADVANCE INFORMATION
)
E (p
1,600
f = 1MHz
1,400
1,200
C
iss
1,000
0 0.2 0.4 0.6 0.8 1.0 1.2
V , SOURCE-DRAIN VOLTAGE (V)
SD
Fig. 8 Diode Forward Voltage vs. Current
10,000
T =150°C
A
1,000
(nA)
T =125°C
A
100
800
T =85°C
A
600
, J
400
T
C
200
0
0 5 10 15 20 25 30
V , DRAIN-SOURCE VOLTAGE (V)
DS
oss
C
rss
Fig. 9 Typical Junction Capacitance
10
10
DSS
I, LEAKA
T = 25°C
A
1
0102030
V , DRAIN-SOURCE VOLTAGE(V)
DS
Fig. 10 Typical Drain-Source Leakage Current vs. Voltage
1,000
9
8
E (V)
f = 1MHz
7
6
E V
5
4
E-S
3
2
GS
V,
1
0
0 5 10 15 20 25 30
Q , TOTAL GATE CHARGE (nC)
g
Fig. 11 Gate-Charge Characteristics
100
R
DS(on)
(A)
Limited
10
DC
P = 10s
1
AI
D
I, D
0.1
0.01
0.01 0.1 1 10 100
W
P = 1s
W
P = 100ms
W
P = 10ms
W
P = 1ms
W
P = 100µs
W
P = 10µs
W
V , DRAIN-SOURCE VOLTAGE (V)
DS
Fig. 12 SOA, Safe Operation Area
DMG4406LSS
Document number: DS35539 Rev. 8 - 2
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T
R
T T
HER
R
T
C
Package Outline Dimensions
ADVANCE INFORMATION
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
1
D = 0.7
E
D = 0.5
AN
D = 0.3
ESIS
0.1
D = 0.1
MAL
D = 0.05
D = 0.02
0.01
D = 0.01
ANSIEN
D = 0.005
r(t),
Single Pulse
0.001
0.00001 0.0001 0.001 0.01 0.1 1 10 100 1,000 t1, PULSE DURATION TIMES (sec)
Fig. 13 Transient Thermal Resistance
E1
E
A1
Detail ‘A’
L
0.254 Gauge Plane
Seating Plane
7°~9
°
Detail ‘A’
A3
h
°
45
e
b
D
A2
A
D = 0.9
R (t) = r(t) * R

JA JA
R = 60°C/W
JA
Duty Cycle, D = t1/ t2
Dim Min Max
SO-8
A - 1.75 A1 0.10 0.20 A2 1.30 1.50 A3 0.15 0.25
b 0.3 0.5 D 4.85 4.95 E 5.90 6.10
E1 3.85 3.95
e 1.27 Typ
h - 0.35
L 0.62 0.82
0 8

All Dimensions in mm
DMG4406LSS
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for latest version.
X
C2
Y
DMG4406LSS
Document number: DS35539 Rev. 8 - 2
C1
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Dimensions Value (in mm)
X 0.60
Y 1.55 C1 5.4 C2 1.27
September 2013
© Diodes Incorporated
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages.
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Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
ADVANCE INFORMATION
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2013, Diodes Incorporated
www.diodes.com
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
IMPORTANT NOTICE
LIFE SUPPORT
DMG4406LSS
DMG4406LSS
Document number: DS35539 Rev. 8 - 2
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