DMG3415U
Document number: DS31735 Rev. 11 - 2
February 2014
© Diodes Incorporated
Description
This new generation MOSFET has been designed to minimize the onstate resistance (R
DS(ON)
) and yet maintain superior switching
performance, making it ideal for high efficiency power management
applications.
Applications
DC-DC Converters
Power management functions
Features
Low On-Resistance
Low Input Capacitance
Fast Switching Speed
Low Input/Output Leakage
ESD Protected Up To 3kV
Totally Lead-Free & Fully RoHS compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
Case: SOT23
Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Finish ⎯ Matte Tin annealed over Copper leadframe.
Solderable per MIL-STD-202, Method 208
Terminals Connections: See Diagram Below
Weight: 0.008 grams (approximate)
Top View
Internal Schematic
So urce
G ate
P ro te ctio n
D iod e
G ate
Dra in
34P = Product Type Marking Code
YM = Date Code Marking for SAT (Shanghai Assembly/ Test site)
= Date Code Marking for CAT (Chengdu Assembly/ Test site)
Y or = Year (ex: A = 2013)
M = Month (ex: 9 = September)
P-CHANNEL ENHANCEMENT MODE MOSFET
Ordering Information (Note 4)
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
Date Code Key
DMG3415U
Document number: DS31735 Rev. 11 - 2
February 2014
© Diodes Incorporated
Continuous Drain Current (Note 5) VGS = -4.5V
Pulsed Drain Current (10μs pulse, duty cycle = 1%)
Total Power Dissipation (Note 5)
Thermal Resistance, Junction to Ambient (Note 5)
Thermal Resistance, Junction to case (Note 5)
Operating and Storage Temperature Range
OFF CHARACTERISTICS (Note 6)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
ON CHARACTERISTICS (Note 6)
Static Drain-Source On-Resistance
Forward Transfer Admittance
DYNAMIC CHARACTERISTICS (Note 7)
VDS = -10V, VGS = 0V
f = 1.0MHz
Reverse Transfer Capacitance
V
DS
= 0V, VGS = 0V, f = 1.0MHz
SWITCHING CHARACTERISTICS (Note 7)
VGS = -4.5V, VDS = -10V
ID = -4A
VDS = -10V, VGS = -4.5V,
RD = 2.5Ω, RG = 3.0Ω, ID = -1A
Maximum Ratings (@T
= +25°C, unless otherwise specified.)
A
Thermal Characteristics (@T
= +25°C, unless otherwise specified.)
A
Electrical Characteristics (@T
= +25°C, unless otherwise specified.)
A
Notes: 5. Device mounted on FR-4 substrate PC board, with minimum recommended pad layout.
7. Guaranteed by design. Not subject to production testing.
6. Short duration pulse test used to minimize self-heating effect.