Diodes DMG302PU User Manual

Product Summary

V

R

(BR)DSS

-25V

10Ω @ V
13Ω @ VGS = -2.7V -0.15A

DS(ON)

= -4.5V -0.17A

GS

TA = +25°C

Description

This new generation MOSFET has been designed to minimize the on-

state resistance (R

performance, making it ideal for high efficiency power management

applications.

) and yet maintain superior switching

DS(ON)

Applications

• DC-DC Converters

• Power Management Functions

NEW PRODUCT

ESD HBM >6kV

Top View

Ordering Information (Note 4)

DMG302PU

25V P-CHANNEL ENHANCEMENT MODE MOSFET

Features

I

D

• Low On-Resistance

• Low Gate Threshold Voltage

• Low Input Capacitance

• Fast Switching Speed

• Small Surfaced Mount Package

• ESD Protected Gate (>6kV Human Body Model)

• Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)

• Halogen and Antimony Free. “Green” Device (Note 3)

• Qualified to AEC-Q101 Standards for High Reliability

Mechanical Data

• Case: SOT23

• Case Material: Molded Plastic. UL Flammability Classification

Rating 94V-0

• Moisture Sensitivity: Level 1 per J-STD-020

• Terminals: Solderable per MIL-STD-202, Method 208

• Lead Free Plating (Matte Tin Finish annealed over Alloy 42

leadframe).

• Terminal Connections: See Diagram

• Weight: 0.008 grams (approximate)

D

G

G

Top View

Pin Configuration

S

Gate Protect ion

Diode

Equivalent Circuit

e3

D

S

Part Number Compliance Case Packaging

DMG302PU-7 Standard SOT23 3,000/Tape & Reel

DMG302PU-13 Standard SOT23 10,000/Tape & Reel

Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.

2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.

3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.

4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.

Marking Information

Date Code Key

Year 2011 2012 2013 2014 2015 2016 2017

Code Y Z A B C D E

Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec

Code 1 2 3 4 5 6 7 8 9 O N D

13P

DMG302PU

Document number: DS36227 Rev. 2 - 2

13P

www.diodes.com

13P = Product Type Marking Code
YM = Date Code Marking for SAT (Shanghai Assembly/ Test site)
YM = Date Code Marking for CAT (Chengdu Assembly/ Test site)
Y or Y = Year (ex: A = 2013)
M = Month (ex: 9 = September)

1 of 6

May 2014

© Diodes Incorporated

Maximum Ratings (@T

= +25°C, unless otherwise specified.)

A

Characteristic Symbol Value Units

Drain-Source Voltage

Gate-Source Voltage

T

Continuous Drain Current (Note 6) VGS = -4.5V

Continuous Drain Current (Note 6) VGS = -2.7V

Steady

State

Steady

State

= +25°C

A

= +70°C

T

A

= +25°C

T

A

= +70°C

T

A

Pulsed Drain Current TP ≤ 300µs, Duty Cycle = 2%) IDM

Thermal Characteristics

Characteristic Symbol Value Units

Total Power Dissipation

Thermal Resistance, Junction to Ambient

NEW PRODUCT

Thermal Resistance, Junction to Case

(Note 5)

(Note 6) 0.45

(Note 5)

(Note 6) 275

(Note 6)

Operating and Storage Temperature Range

Electrical Characteristics (@T

= +25°C, unless otherwise specified.)

A

Characteristic Symbol Min Typ Max Unit Test Condition

OFF CHARACTERISTICS (Note 7)

Drain-Source Breakdown Voltage

Zero Gate Voltage Drain Current

Gate-Source Leakage

BV

I

DSS

I

GSS

DSS

-25

⎯ ⎯

⎯ ⎯

⎯ ⎯

ON CHARACTERISTICS (Note 7)

Gate Threshold Voltage

Static Drain-Source On-Resistance

Forward Transfer Admittance

Diode Forward Voltage (Note 7)

V

GS(th)

R

DS(ON)

|Y

V

SD

-0.65 -0.96 -1.5 V

⎯

⎯

|

fs

⎯

2.5 10

3 13

189

⎯ ⎯

DYNAMIC CHARACTERISTICS (Note 8)

Input Capacitance

Output Capacitance

Reverse Transfer Capacitance

Total Gate Charge

Gate-Source Charge

Gate-Drain Charge

Turn-On Delay Time

Rise Time

Turn-Off Delay Time

Fall Time

Notes: 5. Device mounted on FR-4 PC board, with minimum recommended pad layout, single sided.

6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper pad layout

7. Short duration pulse test used to minimize self-heating effect.

8. Guaranteed by design. Not subject to production testing.

DMG302PU

Document number: DS36227 Rev. 2 - 2

C

⎯

iss

C

oss

C

⎯

rss

Q

⎯

g

Q

gs

Q

⎯

gd

t

⎯

d(on)

t

r

t

⎯

d(off)

t

⎯

f

⎯

⎯

⎯

www.diodes.com

27.2

6.1

1.7

0.35

0.08

0.06

4.5

2.3

24.1

11.0

2 of 6

V

DSS

V

GSS

I

D

I

D

P

D

R

θJA

R

θJC

T

J, TSTG

V

-1 µA

-100 nA

Ω

⎯

ms

-1.5 V

⎯

⎯

pF

⎯

⎯

⎯

nC

⎯

⎯

⎯

⎯

ns

⎯

DMG302PU

-25 V

-8 V

-0.17

-0.14

-0.15

-0.12

-0.5 A

0.33

376

81

-55 to +150 °C

VGS = 0V, ID = -250µA

VDS = -20V, VGS = 0V

VGS = -8V, VDS = 0V

VDS = VGS, ID = -250µA

= -4.5V, ID = -0.2A

V

GS

VGS = -2.7V, ID = -0.05A

V

= -5V, ID = -0.2A

DS

VGS = 0V, IS = -0.2A

= -10V, VGS = 0V

V

DS

f = 1.0MHz

V

= -5V, ID = -0.2A,

DS

= -4.5V,

V

GS

V

= -4.5V, VDD = -6V

GS

I

= -0.2A, RG = 50Ω

D

A

A

W

°C/W

May 2014

© Diodes Incorporated