DMC6040SSD
COMPLEMENTARY PAIR ENHANCEMENT MODE MOSFET
Product Summary
I
Device
Q1
N-Channel
Q2
P-Channel
V
(BR)DSS
60V
-60V
R
DS(on) max
40mΩ @ V
55mΩ @ VGS = 4.5V
110mΩ @ V
130mΩ @ VGS = -4.5V
= 10V
GS
GS
= -10V
D
TA = +25°C
6.5 A
5.6 A
-3.9 A
-3.6 A
Description and Applications
This new generation MOSFET has been designed to minimize the on-
state resistance (R
performance, making it ideal for high efficiency power management
applications.
• DC-DC Converters
• Power Management Functions
• Backlighting
NEW PRODUCT
Pin1
Top View
ADVANCE INFORMATION
) and yet maintain superior switching
DS(ON)
SO-8
S1
G1
S2
G2
Top View
Pin Configuration
Features and Benefits
• Low Input Capacitance
• Low On-Resistance
• Fast Switching Speed
• Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
• Halogen and Antimony Free. “Green” Device (Note 3)
• Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
• Case: SO-8
• Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020
• Terminal Connections: See Diagram
• Terminals: Finish – Tin Finish annealed over Copper leadframe.
Solderable per MIL-STD-202, Method 208
• Weight: 0.074 grams (approximate)
D1
D1
D1
G1
D2
D2
S1
Q1 N-Channel MOSFET
G
2
e3
D2
S2
Q2 P-Channel MOSFET
Ordering Information (Note 4)
Part Number Case Packaging
DMC6040SSD-13 SO-8 2,500/Tape & Reel
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
8 5
DMC6040SSD
Document number: DS36829 Rev. 1 - 2
C6040SD
WWYY
1 4
Chengdu A/T Site Shanghai A/T Site
8 5
C6040SD
WWYY
1 4
www.diodes.com
1 of 9
= Manufacturer’s Marking
C6040SD = Product Type Marking Code
YYWW = Date Code Marking
YY or YY = Year (ex: 14= 2014)
WW = Week (01 - 53)
YY = Date Code Marking for SAT (Shanghai Assembly/ Test site)
YY = Date Code Marking for CAT (Chengdu Assembly/ Test site)
June 2014
© Diodes Incorporated
DMC6040SSD
Maximum Ratings (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Q1 Q2 Units
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (Note 6) VGS = -10V
Maximum Body Diode Forward Current (Note 6)
Pulsed Drain Current (10µs pulse, duty cycle = 1%)
Avalanche Current (Note 7) L = 0.1mH
Avalanche Energy (Note 7) L = 0.1mH
Steady
State
t<10s
= +25°C
T
A
T
= +70°C
A
= +25°C
T
A
= +70°C
T
A
V
DSS
V
GSS
I
D
I
D
I
S
I
DM
I
AS
E
AS
60 -60 V
±20 ±20 V
5.1
4.1
6.5
5.2
-3.1
-2.5
-3.9
-3.1
A
A
2.1 -2.1 A
28 -19 A
17.2 -17.6 A
14.7 15.4 mJ
Thermal Characteristics (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Value Units
= +25°C
T
Total Power Dissipation (Note 5)
ADVANCE INFORMATION
Thermal Resistance, Junction to Ambient (Note 5)
NEW PRODUCT
Total Power Dissipation (Note 6)
Thermal Resistance, Junction to Ambient (Note 6)
Thermal Resistance, Junction to Case (Note 6)
Operating and Storage Temperature Range
A
TA = +70°C
Steady state
t < 10s 61
= +25°C
T
A
TA = +70°C
Steady state
t<10s 49
P
R
P
R
R
T
J, TSTG
D
JA
θ
D
JA
θ
JC
1.24
0.8
101
1.56
1.0
W
°C/W
W
80
°C/W
14.7
-55 to +150 °C
Electrical Characteristics N-Channel Q1 (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 8)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Source Leakage
BV
I
DSS
I
GSS
DSS
60
⎯ ⎯
⎯ ⎯
⎯ ⎯
V
1 µA
±100
nA
VGS = 0V, ID = 250µA
VDS = 48V, VGS = 0V
VGS = ±20V, VDS = 0V
ON CHARACTERISTICS (Note 8)
Gate Threshold Voltage
Static Drain-Source On-Resistance
Diode Forward Voltage
V
GS(th
R
DS (ON)
V
SD
1
⎯
⎯
⎯
⎯
33 40
37 55
0.7 1.2 V
3 V
VDS = VGS, ID = 250µA
V
m
VGS = 4.5V, ID = 5A
VGS = 0V, IS = 1A
= 10V, ID = 8A
GS
DYNAMIC CHARACTERISTICS (Note 9)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
C
⎯
iss
C
⎯
oss
C
⎯
rss
R
⎯
G
Total Gate Charge (VGS = 10V) Qg ⎯
Total Gate Charge (VGS = 4.5V) Qg
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
Notes: 5. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate.
7. UIS in production with L = 0.1mH, starting T
8. Short duration pulse test used to minimize self-heating effect.
9. Guaranteed by design. Not subject to product testing.
t
t
= +25°C.
A
Q
Q
D(on
t
D(off
t
t
r
Q
s
d
f
r
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
⎯
1130
69
42
1.7
20.8
9.4
3.3
3.0
3.6
1.8
20.1
4.3
14.2
7.5
⎯
⎯
pF
= 15V, VGS = 0V f = 1.0MHz
V
DS
⎯
⎯ Ω VDS = 0V, VGS = 0V, f = 1.0MHz
⎯
⎯
⎯
nC
= 30V, ID = 4.3A
V
DS
⎯
⎯
⎯
⎯
nS
V
= 10V, VDD = 30V, RG = 6Ω,
GS
= 4.3A
I
D
⎯
⎯
⎯
nS
IS = 4.3A, dI/dt = 100A/s
nC
IS = 4.3A, dI/dt = 100A/s
DMC6040SSD
Document number: DS36829 Rev. 1 - 2
2 of 9
www.diodes.com
June 2014
© Diodes Incorporated
DMC6040SSD
20.0
V = 10VGS
V= 5.0V
GS
V= 4.5V
GS
V= 4.0V
GS
V= 3.5V
GS
V= 2.8V
GS
V= 3.0V
GS
(A)
AIN
D
I, D
18.0
16.0
14.0
12.0
10.0
8.0
6.0
4.0
2.0
0.0
012345
V , DRAIN-SOURCE VOLTAGE (V)
DS
Figure 1 Typical Output Characteristics
ADVANCE INFORMATION
NEW PRODUCT
0.05
Ω
0.045
ESISTANCE ( )
CE
0.04
0.035
V = 4.5VGS
20
V = 5.0VDS
18
16
14
(A)
E
12
10
8
6
D
I, D
4
2
0
1 1.5 2 2.5 3 3.5 4
T = 150°C
A
T = 125°C
A
V , GATE-SOURCE VOLTAGE (V)
GS
T = 85°C
T = 25°C
A
T = -55°C
A
Figure 2 Typical Transfer Characteristics
0.09
Ω
0.08
0.07
V = 10VGS
T = 125°C
A
T = 150°C
A
ESISTANCE ( )
0.06
0.05
CE
A
T = 85°C
A
AIN-S
, D
0.03
V = 10VGS
0.025
DS(ON)
0.02
02468101214161820
I , DRAIN-SOURCE CURRENT (A)D
Figure 3 Typical On-Resistance vs.
Drain Current and Gate Voltage
2.4
AIN-S
, D
0.04
0.03
T = 25°C
A
T = -55°C
0.02
DS(ON)
0.01
02468101214161820
I , DRAIN CURRENT (A)
D
Figure 4 Typical On-Resistance vs.
Drain Current and Temperature
0.1
A
Ω
2.2
V=V
10
2
E
1.8
1.6
-S
GS
I= 8A
D
1.4
1.2
, D
1
DS(ON)
0.8
ON-RESISTANCE (NORMALIZED)
0.6
0.4
-50 -25 0 25 50 75 100 125 150
T , JUNCTION TEMPERATURE ( C)
J
Figure 5 On-Resistance Variation with Temperature
V = 4.5V
GS
I= 5A
D
°
0.09
E ( )
0.08
0.07
ESIS
0.06
V = 4.5V
GS
I= 5A
D
0.05
V=V
10
GS
I= 8A
D
AIN-S
, D
0.04
0.03
0.02
0.01
DS(ON)
0
-50 -25 0 25 50 75 100 125 150
T , JUNCTION TEMPERATURE ( C)
J
Figure 6 On-Resistance Variation with Temperature
°
DMC6040SSD
Document number: DS36829 Rev. 1 - 2
3 of 9
www.diodes.com
June 2014
© Diodes Incorporated