This MOSFET has been designed to ensure that R
channel FET are matched to minimize losses in both arms of the
bridge. The DMC4040SSD is optimized for use in 3 phases brushless
DC motor circuits (BLDC), CCFL backlighting.
• 3 phases BLDC motor
• CCFL backlighting
SO-8
G1
S2
G2
Top View
DS(on)
of N and P
Top View
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Diodes Incorporated
DMC4050SSD
Features and Benefits
• Matched N & P R
• Fast switching – Minimizes switching losses
• Dual device – Reduces PCB area
• "Green" component and RoHS compliant (Note 1)
• Qualified to AEC-Q101 Standards for High Reliability
- Minimizes power losses
DS(on)
Mechanical Data
• Case: SO-8
• Case Material: Molded Plastic, “Green” Molding Compound. UL
Flammability Classification Rating 94V-0 (Note 1)
• Moisture Sensitivity: Level 1 per J-STD-020
• Terminals: Finish - Matte Tin annealed over Copper lead frame.
Notes: 1. Diodes, Inc. defines “Green” products as those which are RoHS compliant and contain no halogens or antimony compounds; further information about
Diodes Inc.’s “Green” Policy can be found on our website. For packaging details, go to our website.
Marking Information
DMC4050SSD
Document number: DS33310 Rev. 2 - 2
C4050SD
YY
WW
= Manufacturer’s Marking
C4050SD = Product Type Marking Code
YYWW = Date Code Marking
YY = Year (ex: 10 = 2010)
WW = Week (01 - 53)
Pulsed Drain Current
Continuous Source Current (Body diode) (Notes 3 & 5)
Pulsed Source Current (Body diode) (Notes 4 & 5)
Thermal Characteristics@T
Power Dissipation
Linear Derating Factor
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Lead (Notes 5 & 7)
Operating and Storage Temperature Range
Notes: 2. For a device surface mounted on 25mm x 25mm x 1.6mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions; the device is
measured when operating in a steady-state condition.
DMC4050SSD
Document number: DS33310 Rev. 2 - 2
3. Same as note (2), except the device is measured at t ≤ 10 sec.
4. Same as note (2), except the device is pulsed with D = 0.02 and pulse width 300µs.
5. For a dual device with one active die.
6. For a device with two active die running at equal power.
7. Thermal resistance from junction to solder-point (at the end of the drain lead).
= 25°C unless otherwise specified
A
Characteristic Symbol N-Channel - Q1 P-Channel - Q2
V
DSS
V
(Notes 3 & 5)
= 10V
V
GS
V
= 10V
GS
Characteristic Symbol N-Channel - Q1 P-Channel - Q2 Unit
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 8)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current TJ = 25°C I
Gate-Source Leakage
ON CHARACTERISTICS (Note 8)
Gate Threshold Voltage
Static Drain-Source On-Resistance
Forward Transfer Admittance
Diode Forward Voltage (Note 8)
DYNAMIC CHARACTERISTICS (Note 9)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Notes: 8. Short duration pulse test used to minimize self-heating effect.
9. Guaranteed by design. Not subject to production testing.
30
= 25°C unless otherwise specified
A
40 - - V
BV
DSS
- - 1.0
DSS
- - ±100 nA
I
GSS
0.8 1.3 1.8 V
V
GS(th
R
DS (ON)
|Y
V
SD
-
|
fs
- 12.6 - S
- 0.7 1.0 V
20
33
C
C
C
R
Q
Q
Q
t
D(on)
t
D(off)
iss
oss
rss
t
t
s
d
f
- 1790.8 -
- 160.6 -
- 120.5 -
- 1.03 -
- 37.56 -
- 7.8 -
- 6.6 -
8.08
-
15.14
-
24.29
-
5.27
-
30
25
V = 8.0V
GS
25
V = 5V
DS
(A)
EN
20
V = 4.5V
GS
(A)
20
E
15
V = 4.0V
GS
AIN
10
D
I, D
V = 3.5V
GS
5
V = 3.0V
V = 2.5V
0
00.511.52
V , DRAIN-SOURCE VOLTAGE (V)
DS
GS
GS
Fig. 1 Typica l O ut put Chara ct er istic
DMC4050SSD
Document number: DS33310 Rev. 2 - 2
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4 of 11
15
10
D
I, D
5
0
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DMC4050SSD
VGS = 0V, ID = 250μA
μA
VDS = 40V, VGS = 0V
VGS = ±20V, VDS = 0V
VDS = VGS, ID = 250μA
= 10V, ID = 3A
45
60
- ns
- ns
- ns
- ns
V , GATE-SOURCE VOLT AGE (V)
GS
Fig. 2 Typical Transfer Characteristic
V
mΩ
GS
VGS = 4.5V, ID = 3A
VDS = 5V, ID = 3A
VGS = 0V, IS = 1A