This MOSFET has been designed to ensure that R
channel FET are matched to minimize losses in both arms of the
bridge. The DMC4040SSD is optimized for use in 3 phases brushless
DC motor circuits (BLDC), CCFL backlighting.
NEW PRODUCT
• 3 phases BLDC motor
• CCFL backlighting
SO-8
G1
S2
2
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Diodes Incorporated
DMC4040SSD
40V COMPLEMENTARY PAIR ENHANCEMENT MODE MOSFET
Features and Benefits
I
max (A)
D
TA = 25°C
(Notes 3 & 5)
7.5
6.2
-7.3
-5.7
of N and P
• Matched N & P R
• Fast switching – Minimizes switching losses
• Dual device – Reduces PCB area
• "Green" component and RoHS compliant (Note 1)
• Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
• Case: SO-8
• Case Material: Molded Plastic, “Green” Molding Compound. UL
Flammability Classification Rating 94V-0 (Note 1)
• Moisture Sensitivity: Level 1 per J-STD-020
• Terminals: Finish - Matte Tin annealed over Copper lead frame.
Note: 1. Diodes, Inc. defines “Green” products as those which are RoHS compliant and contain no halogens or antimony compounds; further information about
Diodes Inc.’s “Green” Policy can be found on our website. For packaging details, go to our website.
Marking Information
DMC4040SSD
Document number: DS32120 Rev. 2 - 2
C4040SD
YY
WW
= Manufacturer’s Marking
C4040SD = Product Type Marking Code
YYWW = Date Code Marking
YY = Year (ex: 10 = 2010)
WW = Week (01 - 53)
Pulsed Drain Current
Continuous Source Current (Body diode) (Notes 3 & 5)
Pulsed Source Current (Body diode) (Notes 4 & 5)
Thermal Characteristics@T
NEW PRODUCT
Power Dissipation
Linear Derating Factor
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Lead (Notes 5 & 7)
Operating and Storage Temperature Range
Notes: 2. For a device surface mounted on 25mm x 25mm x 1.6mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions; the device is
measured when operating in a steady-state condition.
DMC4040SSD
Document number: DS32120 Rev. 2 - 2
3. Same as note (2), except the device is measured at t ≤ 10 sec.
4. Same as note (2), except the device is pulsed with D = 0.02 and pulse width 300µs.
5. For a dual device with one active die.
6. For a device with two active die running at equal power.
7. Thermal resistance from junction to solder-point (at the end of the drain lead).
= 25°C unless otherwise specified
A
Characteristic Symbol N-Channel - Q1 P-Channel - Q2 Unit
V
DSS
V
(Notes 3 & 5)
V
= 10V
GS
V
= 10V
GS
Characteristic Symbol N-Channel - Q1 P-Channel - Q2 Unit