Product Summary
Device V
N-Channel 30V
P-Channel -30V
R
(BR)DSS
20m @ V
32m @ VGS = 4.5V
45m @ V
85m @ VGS = -4.5V
DS(ON) max
GS
GS
Package
= 10V
= -10V
SO-8
Description
This MOSFET has been designed to minimize the on-state resistance
) and yet maintain superior switching performance, making it
(R
DS(on)
ideal for high efficiency power management applications.
Applications
• DC Motor Control
• DC-AC Inverters
ADVANCED INFORMATION
SO-8
Top View
S2
G2
S1
G1
Pin Configuration
I
D MAX
TA = +25°C
8.5A
7.0A
-5.5A
-4.1A
DMC3025LSD
30V COMPLEMENTARY ENHANCEMENT MODE MOSFET
Features
• Low On-Resistance
• Low Input Capacitance
• Fast Switching Speed
• Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
• Halogen and Antimony Free. “Green” Device (Note 3)
• Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
• Case: SO-8
• Case Material: Molded Plastic, "Green" Molding Compound.
UL Flammability Classification Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020
• Terminal Connections Indicator: See diagram
• Terminals: Finish ⎯ Matte Tin annealed over Copper leadframe.
Solderable per MIL-STD-202, Method 208
• Weight: 0.008 grams (approximate)
D2
D2
D2
G2
D1
D1
S2
N-CHANNEL MOSFET P-CHANNEL MOSFET
Equivalent Circuit
G1
e3
D1
S1
Ordering Information (Note 4)
Part Number Case Packaging
DMC3025LSD-13 SO-8 2500/Tape & Reel
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.
4. For packaging details, go to our website at http://www.diodes.com.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
Marking Information
DMC3025LSD
Document number: DS35717 Rev. 5 - 2
Top View
8 5
C3025LD
WW
YY
1 4
1 of 9
www.diodes.com
Logo
Part no.
Xth week: 01 ~ 53
Year: “11” = 2011
August 2012
© Diodes Incorporated
Maximum Ratings N-CHANNEL (@T
Characteristic Symbol Value Units
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (Note 5) VGS = 10V
Continuous Drain Current (Note 5) VGS = 4.5V
Maximum Continuous Body Diode Forward Current (Note 5)
Pulsed Drain Current (10µs pulse, duty cycle = 1%)
Maximum Ratings P-CHANNEL (@T
Characteristic Symbol Value Units
Drain-Source Voltage
ADVANCED INFORMATION
Gate-Source Voltage
Continuous Drain Current (Note 5) VGS = -10V
Continuous Drain Current (Note 5) VGS = -4.5V
Maximum Continuous Body Diode Forward Current (Note 5)
Pulsed Drain Current (10µs pulse, duty cycle = 1%)
= +25°C, unless otherwise specified.)
A
V
DSS
V
GSS
T
Steady
State
t<10s
Steady
State
t<10s
= +25°C, unless otherwise specified.)
A
Steady
State
t<10s
Steady
State
t<10s
= +25°C
A
= +70°C
T
A
T
= +25°C
A
T
= +70°C
A
T
= +25°C
A
= +70°C
T
A
T
= +25°C
A
T
= +70°C
A
T
= +25°C
A
T
= +70°C
A
= +25°C
T
A
= +70°C
T
A
T
= +25°C
A
T
= +70°C
A
= +25°C
T
A
= +70°C
T
A
I
D
I
D
I
D
I
D
I
S
I
DM
V
DSS
V
GSS
I
D
I
D
I
D
I
D
I
S
I
DM
DMC3025LSD
30 V
±20 V
6.5
5.1
8.5
6.8
5.3
4.1
7.0
5.5
2 A
60 A
-30 V
±20 V
-4.2
-3.2
-5.5
-4.3
-3.5
-2.3
-4.1
-3.2
-2 A
-30 A
A
A
A
A
A
A
A
A
Thermal Characteristics
Characteristic Symbol Value Units
T
= +25°C
Total Power Dissipation (Note 6)
Thermal Resistance, Junction to Ambient (Note 6)
Total Power Dissipation (Note 5)
Thermal Resistance, Junction to Ambient (Note 5)
Thermal Resistance, Junction to Case (Note 5)
Operating and Storage Temperature Range
Notes: 5. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
A
TA = +70°C
Steady State
t<10s 62
T
= +25°C
A
TA = +70°C
Steady State
t<10s 49
P
R
P
R
R
T
J, TSTG
D
JA
θ
D
JA
θ
JC
DMC3025LSD
Document number: DS35717 Rev. 5 - 2
2 of 9
www.diodes.com
1.2
0.77
104
1.5
0.95
W
°C/W
W
83
°C/W
15
-55 to +150 °C
August 2012
© Diodes Incorporated
Electrical Characteristics N-CHANNEL (@T
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Source Leakage
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
Static Drain-Source On-Resistance
Forward Transfer Admittance
Diode Forward Voltage
DYNAMIC CHARACTERISTICS (Note 8)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate resistance
Total Gate Charge (VGS = 4.5V) Qg
Total Gate Charge (VGS = 10V) Qg
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Turn-On Rise Time
ADVANCED INFORMATION
Turn-Off Delay Time
Turn-Off Fall Time
Reverse Recovery Time
Reverse Recovery Charge
Characteristic Symbol Min Typ Max Unit Test Condition
= +25°C, unless otherwise specified.)
A
BV
I
I
V
GS(th
R
DS (ON)
|Y
V
C
C
C
DSS
DSS
GSS
fs
SD
iss
oss
rss
R
30 — — V
— — 1 A
— — ±1 A
1.0 — 2.0 V
— 15 20
— 23 32
— 8 — S
|
— 0.70 1.2 V
— 501 —
— 72 —
— 57 —
— 1.84 —
— 4.6 —
— 9.8 —
Q
Q
t
D(on
t
D(off
Q
s
d
t
t
f
t
r
r
— 1.6 —
— 2.0 —
— 3.9 —
— 4.2 —
— 16.6 —
— 5.8 —
— 5.5 — ns
— 2.6 — nC
DMC3025LSD
VGS = 0V, ID = 250A
VDS = 30V, VGS = 0V
VGS = ±20V, VDS = 0V
VDS = VGS, ID = 250A
= 10V, ID = 7.4A
V
mΩ
pF
Ω
nC
ns
GS
= 4.5V, ID = 6A
V
GS
VDS = 5V, ID = 10A
VGS = 0V, IS = 1A
V
= 15V, VGS = 0V,
DS
f = 1.0MHz
VDS = 0V, VGS = 0V, f = 1.0MHz
V
= 15V, ID = 10A
DS
= 15V, VGS = 10V,
V
DD
R
= 6, ID = 1A
G
I
= 12A, di/dt = 500A/s
F
Electrical Characteristics P-CHANNEL (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Source Leakage
BV
I
I
DSS
DSS
GSS
-30 — — V
— — -1 A
— — ±100 nA
VGS = 0V, ID = -250A
VDS = -30V, VGS = 0V
VGS = ±20V, VDS = 0V
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
Static Drain-Source On-Resistance
Forward Transfer Admittance
Diode Forward Voltage
V
GS(th
R
DS (ON)
|Y
V
fs
SD
-1.0 — -2.0 V
— 38 45
— 65 85
— 5 — S
|
— -0.7 -1.2 V
VDS = VGS, ID = -250A
= -10V, ID = -5.2A
V
mΩ
GS
= -4.5V, ID = -4A
V
GS
VDS = -5V, ID = -5.2A
VGS = 0V, IS = -1A
DYNAMIC CHARACTERISTICS (Note 8)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate resistance
C
C
oss
C
R
Total Gate Charge (VGS = 4.5V) Qg
Total Gate Charge (VGS = 10V) Qg
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Reverse Recovery Time
Reverse Recovery Charge
Notes: 7. Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to product testing.
Q
Q
t
D(on
t
D(off
Q
t
t
t
iss
rss
s
d
f
r
r
— 590 — pF
— 69 — pF
— 53 — pF
— 11 —
— 5.1 — nC
— 10.5 — nC
— 1.8 — nC
— 1.9 — nC
— 6.8 — ns
— 4.9 — ns
— 28.4 — ns
— 12.4 — ns
— 14 — ns
— 11 — nC
V
= -25V, VGS = 0V,
DS
f = 1.0MHz
Ω
VDS = 0V, VGS = 0V, f = 1.0MHz
V
= -15V, ID = -6A
DS
= -15V, VGS = -10V,
V
DD
R
= 6, ID = -1A
G
I
= 12A, di/dt = 500A/s
F
DMC3025LSD
Document number: DS35717 Rev. 5 - 2
3 of 9
www.diodes.com
August 2012
© Diodes Incorporated