Diodes DMC3025LSD User Manual

Product Summary
Device V
N-Channel 30V
P-Channel -30V
R
(BR)DSS
20m @ V 32m @ VGS = 4.5V 45m @ V
85m @ VGS = -4.5V
DS(ON) max
GS
GS
Package
= 10V
= -10V
SO-8
Description
This MOSFET has been designed to minimize the on-state resistance
) and yet maintain superior switching performance, making it
(R
DS(on)
ideal for high efficiency power management applications.
Applications
DC Motor Control
DC-AC Inverters
SO-8
Top View
S2
G2 S1 G1
Pin Configuration
I
D MAX
TA = +25°C
8.5A
7.0A
-5.5A
-4.1A
DMC3025LSD
30V COMPLEMENTARY ENHANCEMENT MODE MOSFET
Features
Low On-Resistance
Low Input Capacitance
Fast Switching Speed
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
Case: SO-8
Case Material: Molded Plastic, "Green" Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminal Connections Indicator: See diagram
Terminals: Finish Matte Tin annealed over Copper leadframe.
Solderable per MIL-STD-202, Method 208
Weight: 0.008 grams (approximate)
D2
D2
D2
G2
D1 D1
S2
N-CHANNEL MOSFET P-CHANNEL MOSFET
Equivalent Circuit
G1
e3
D1
S1
Ordering Information (Note 4)
Part Number Case Packaging
DMC3025LSD-13 SO-8 2500/Tape & Reel
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.
4. For packaging details, go to our website at http://www.diodes.com.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.
Marking Information
DMC3025LSD
Document number: DS35717 Rev. 5 - 2
Top View
8 5
C3025LD
WW
YY
1 4
1 of 9
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Logo Part no.
Xth week: 01 ~ 53 Year: “11” = 2011
August 2012
© Diodes Incorporated
θ
Maximum Ratings N-CHANNEL (@T
Characteristic Symbol Value Units
Drain-Source Voltage Gate-Source Voltage
Continuous Drain Current (Note 5) VGS = 10V
Continuous Drain Current (Note 5) VGS = 4.5V
Maximum Continuous Body Diode Forward Current (Note 5) Pulsed Drain Current (10µs pulse, duty cycle = 1%)
Maximum Ratings P-CHANNEL (@T
Characteristic Symbol Value Units
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (Note 5) VGS = -10V
Continuous Drain Current (Note 5) VGS = -4.5V
Maximum Continuous Body Diode Forward Current (Note 5) Pulsed Drain Current (10µs pulse, duty cycle = 1%)
= +25°C, unless otherwise specified.)
A
V
DSS
V
GSS
T
Steady
State t<10s
Steady
State t<10s
= +25°C, unless otherwise specified.)
A
Steady
State t<10s
Steady
State t<10s
= +25°C
A
= +70°C
T
A
T
= +25°C
A
T
= +70°C
A
T
= +25°C
A
= +70°C
T
A
T
= +25°C
A
T
= +70°C
A
T
= +25°C
A
T
= +70°C
A
= +25°C
T
A
= +70°C
T
A
T
= +25°C
A
T
= +70°C
A
= +25°C
T
A
= +70°C
T
A
I
D
I
D
I
D
I
D
I
S
I
DM
V
DSS
V
GSS
I
D
I
D
I
D
I
D
I
S
I
DM
DMC3025LSD
30 V
±20 V
6.5
5.1
8.5
6.8
5.3
4.1
7.0
5.5 2 A
60 A
-30 V
±20 V
-4.2
-3.2
-5.5
-4.3
-3.5
-2.3
-4.1
-3.2
-2 A
-30 A
A
A
A
A
A
A
A
A
Thermal Characteristics
Characteristic Symbol Value Units
T
= +25°C
Total Power Dissipation (Note 6)
Thermal Resistance, Junction to Ambient (Note 6)
Total Power Dissipation (Note 5)
Thermal Resistance, Junction to Ambient (Note 5) Thermal Resistance, Junction to Case (Note 5)
Operating and Storage Temperature Range
Notes: 5. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
A
TA = +70°C
Steady State
t<10s 62
T
= +25°C
A
TA = +70°C
Steady State
t<10s 49
P
R
P
R R
T
J, TSTG
D
JA
θ
D
JA
θ
JC
DMC3025LSD
Document number: DS35717 Rev. 5 - 2
2 of 9
www.diodes.com
1.2
0.77 104
1.5
0.95
W
°C/W
W
83
°C/W
15
-55 to +150 °C
August 2012
© Diodes Incorporated
)
g
g
g
)
r
)
r
r
)
g
g
g
)
r
)
r
r
Electrical Characteristics N-CHANNEL (@T
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage Zero Gate Voltage Drain Current Gate-Source Leakage ON CHARACTERISTICS (Note 7) Gate Threshold Voltage
Static Drain-Source On-Resistance Forward Transfer Admittance
Diode Forward Voltage DYNAMIC CHARACTERISTICS (Note 8) Input Capacitance Output Capacitance Reverse Transfer Capacitance Gate resistance Total Gate Charge (VGS = 4.5V) Qg Total Gate Charge (VGS = 10V) Qg Gate-Source Charge Gate-Drain Charge Turn-On Delay Time Turn-On Rise Time
Turn-Off Delay Time Turn-Off Fall Time Reverse Recovery Time Reverse Recovery Charge
Characteristic Symbol Min Typ Max Unit Test Condition
= +25°C, unless otherwise specified.)
A
BV
I I
V
GS(th
R
DS (ON)
|Y V
C C C
DSS DSS GSS
fs
SD
iss
oss
rss
R
30 — — V — 1 A — ±1 A
1.0 — 2.0 V — 15 20 — 23 32 — 8 — S
|
0.70 1.2 V
501 — — 72 — — 57 — — 1.84 — — 4.6 — — 9.8 —
Q Q
t
D(on
t
D(off
Q
s d
t
t
f
t
r
r
1.6 — — 2.0 — — 3.9 — — 4.2 — — 16.6 — — 5.8 — — 5.5 — ns — 2.6 — nC
DMC3025LSD
VGS = 0V, ID = 250A VDS = 30V, VGS = 0V VGS = ±20V, VDS = 0V
VDS = VGS, ID = 250A
= 10V, ID = 7.4A
V
mΩ
pF
Ω
nC
ns
GS
= 4.5V, ID = 6A
V
GS
VDS = 5V, ID = 10A VGS = 0V, IS = 1A
V
= 15V, VGS = 0V,
DS
f = 1.0MHz VDS = 0V, VGS = 0V, f = 1.0MHz
V
= 15V, ID = 10A
DS
= 15V, VGS = 10V,
V
DD
R
= 6, ID = 1A
G
I
= 12A, di/dt = 500A/s
F
Electrical Characteristics P-CHANNEL (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage Zero Gate Voltage Drain Current Gate-Source Leakage
BV
I I
DSS DSS GSS
-30 — — V — -1 A — ±100 nA
VGS = 0V, ID = -250A VDS = -30V, VGS = 0V
VGS = ±20V, VDS = 0V ON CHARACTERISTICS (Note 7) Gate Threshold Voltage
Static Drain-Source On-Resistance Forward Transfer Admittance
Diode Forward Voltage
V
GS(th
R
DS (ON)
|Y
V
fs
SD
-1.0 — -2.0 V — 38 45 — 65 85 — 5 — S
|
-0.7 -1.2 V
VDS = VGS, ID = -250A
= -10V, ID = -5.2A
V
mΩ
GS
= -4.5V, ID = -4A
V
GS
VDS = -5V, ID = -5.2A
VGS = 0V, IS = -1A DYNAMIC CHARACTERISTICS (Note 8) Input Capacitance Output Capacitance Reverse Transfer Capacitance
Gate resistance
C
C
oss
C
R Total Gate Charge (VGS = 4.5V) Qg Total Gate Charge (VGS = 10V) Qg Gate-Source Charge Gate-Drain Charge Turn-On Delay Time Turn-On Rise Time Turn-Off Delay Time Turn-Off Fall Time Reverse Recovery Time Reverse Recovery Charge
Notes: 7. Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to product testing.
Q Q
t
D(on
t
D(off
Q
t
t
t
iss
rss
s d
f
r
r
590 — pF — 69 — pF — 53 — pF — 11 — — 5.1 — nC — 10.5 — nC — 1.8 — nC — 1.9 — nC — 6.8 — ns — 4.9 — ns — 28.4 — ns — 12.4 — ns — 14 — ns — 11 — nC
V
= -25V, VGS = 0V,
DS
f = 1.0MHz
Ω
VDS = 0V, VGS = 0V, f = 1.0MHz
V
= -15V, ID = -6A
DS
= -15V, VGS = -10V,
V
DD
R
= 6, ID = -1A
G
I
= 12A, di/dt = 500A/s
F
DMC3025LSD
Document number: DS35717 Rev. 5 - 2
3 of 9
www.diodes.com
August 2012
© Diodes Incorporated
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