Diodes DMC3021LK4 User Manual

Page 1
DMC3021LK4
COMPLEMENTARY PAIR ENHANCEMENT MODE MOSFET
Product Summary
I
max
Device
Q1 30V
Q2 -30V
V
(BR)DSS
R
DS(ON)
21m @ V
32m @ VGS = 4.5V
39m @ V
53m @ VGS = -4.5V
GS
max
= 10V
GS
= -10V
D
TC = +25°C
14A
14A
-14A
-14A
Description and Applications
This MOSFET has been designed to minimize the on-state resistance
(R
) and yet maintain superior switching performance, making it
DS(ON)
ideal for high efficiency power management applications.
Motor Control
Power Management Functions
DC-DC Converters
Backlighting
Top View Bottom View Pinout Top View N-Channel MOSFET P-Channel MOSFET
TO252-4L
Features and Benefits
0.6mm Profile – Ideal for Low Profile Applications
PCB Footprint of 4mm
Low Gate Threshold Voltage
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
2
Mechanical Data
Case: TO252-4
Case Material: Molded Plastic, "Green" Molding Compound UL
Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminal Connections Indicator: See diagram
Terminals: Finish – Matte Tin annealed over Copper leadframe.
Solderable per MIL-STD-202, Method 208
Weight: 0.027 grams (approximate)
D
G2
D
G1S2 S1G2
D
S2
D
G1
S1
Ordering Information (Note 4)
Part Number Case Packaging
DMC3021LK4-13 TO252-4 2500/Tape & Reel
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html
Marking Information
C3021L
YYWW
= Manufacturer’s Marking C3021L = Product Type Marking Code YYWW = Date Code Marking YY = Year (ex: 11 = 2011) WW = Week (01 - 53)
DMC3021LK4
Document number: DS35082 Rev. 5 - 2
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Page 2
Maximum Ratings N-CHANNEL – Q1 (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Value Units
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (Note 6) VGS = 10V
Continuous Drain Current (Note 6) VGS = 10V
Pulsed Drain Current (10µs Pulse, Duty Cycle = 1%)
Avalanche Current, (Notes 7) L = 0.1mH
Avalanche Energy, (Notes 7) L = 0.1mH
Steady
State
Steady
State
T
= +25°C
A
T
= +70°C
A
T
= +25°C
C
T
= +70°C
C
V
DSS
V
GSS
I
D
I
D
I
DM
I
AS
E
AS
Maximum Ratings P-CHANNEL – Q2 (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Value Units
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (Note 6) VGS = -10V
Continuous Drain Current (Note 6) VGS = -10V
Pulsed Drain Current (10µs Pulse, Duty Cycle = 1%)
Avalanche Current, (Notes 7) L = 0.1mH
Avalanche Energy, (Notes 7) L = 0.1mH
Steady
State
Steady
State
T
= +25°C
A
T
= +70°C
A
= +25°C
T
C
T
= +70°C
C
V
DSS
V
GSS
I
D
I
D
I
DM
I
AS
E
AS
Thermal Characteristics (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Value Units
= +25°C
T
Total Power Dissipation (Note 6)
Total Power Dissipation (Note 6)
A
TA = +70°C
= +25°C
T
C
TC = +70°C
Thermal Resistance, Junction to Ambient (Note 6) Steady state
Thermal Resistance, Junction to Case (Note 6) Steady state
Operating and Storage Temperature Range
Notes: 5. Device mounted on FR-4 PC board, with minimum recommended pad layout, single sided.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with thermal bias to bottom layer 1inch square copper plate
7. I
and EAS rating are based on low frequency and duty cycles to keep TJ = 25°C
AS
8. Short duration pulse test used to minimize self-heating effect.
9. Guaranteed by design. Not subject to product testing.
DMC3021LK4
P
D
R
JA
θ
R
JC
θ
T
J, TSTG
30 V
±20 V
9.4
7.5
14 14
A
A
70 A
16 A
13 mJ
-30 V
±20 V
-6.8
-5.3
-14
-14
A
A
-50 A
-16 A
13 mJ
2.7
1.7
22
W
14
46
5.5
°C/W
-55 to +150 °C
DMC3021LK4
Document number: DS35082 Rev. 5 - 2
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Page 3
RAIN C
U
R
R
N
T
Electrical Characteristics N-CHANNEL – Q1 (@T
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 8)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current @TC = +25°C I
Gate-Source Leakage
ON CHARACTERISTICS (Note 8)
Gate Threshold Voltage
Static Drain-Source On-Resistance
Forward Transfer Admittance
Diode Forward Voltage
DYNAMIC CHARACTERISTICS (Note 9)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
Total Gate Charge (4.5V)
Total Gate Charge (10V)
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Notes: 8. Short duration pulse test used to minimize self-heating effect.
9. Guaranteed by design. Not subject to product testing.
30
25
(A)
20
V= 10V
GS
V = 4.5V
GS
V = 4.0VGS
E
15
V = 3.5V
GS
BV
I
GSS
V
GS(th)
R
DS(ON)
|Y
V
C
C
C
R
Q
Q
Q
Q
t
D(on)
t
D(off)
DSS
DSS
SD
iss
oss
rss
gd
t
t
|
fs
g
g
g
gs
r
f
= +25°C, unless otherwise specified.)
A
30
— —
— —
— V
1.0 A
±100 nA
1 1.5 2.1 V
14 21
18 32
m
8.5 — S
0.7 1.0 V
751
121
110
1.5
9
17.4
2.2
3
2.5
6.6
19.0
6.3
pF
pF
pF
nC
nC
nC
nC
ns
ns
ns
ns
20
V = 5.0V
DS
15
10
DMC3021LK4
VGS = 0V, ID = 250A
VDS = 30V, VGS = 0V
VGS = ±20V, VDS = 0V
VDS = VGS, ID = 250A
= 10V, ID = 7A
V
GS
V
= 4.5V, ID = 5.6A
GS
VDS = 5V, ID = 7A
VGS = 0V, IS = 1A
V
= 10V, VGS = 0V,
DS
f = 1.0MHz
VDS = 10V, VGS = 0V,f = 1.0MHz
= 10V, VDS = 15V,
V
GS
= 6A
I
D
= 15V, VGS = 10V,
V
DD
= 6, RL = 1.8, ID = 6.7A
R
G
T = 150°C
GS
A
T = A125°C
85°C
T =
A
T =
25°C
A
T = A-55°C
April 2014
© Diodes Incorporated
10
D
D
I, D
V = 3.0V
GS
I , DRAIN CURRENT (A)
5
5
V = 2.5VGS
0
0 0.5 1 1.5 2
V , DRAIN-SOURCE VOLTAGE (V)
DS
Fig.1 Typical Output Characteristics
DMC3021LK4
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0
012345
V , GATE-SOURCE VOLTAGE (V)
Fig. 2 Typical Transfer Characteristics
Page 4
R
R
OUR
CE ON-R
TANC
R
RAIN-SOUR
CE O
N-R
TAN
C
5
Ω
0.05
0.04
Ω
E ( )
0.05
0.04
V = 4.5V
GS
ESIS
0.03
0.02
V = 4.5VGS
V = 10VGS
0.01
DS(ON)
R , DRAIN-SOURCE ON-RESISTANCE( )
0
0 5 10 15 20 25 30
I , DRAIN-SOURCE CURRENT (A)
D
Fig. 3 Typical On-Resistance vs.
Drain Current and Gate Voltage
1.7
V = 10V
1.5
GS
I=10A
D
0.03
0.02
AIN-S
0.01
, D
DS(ON)
0
024 6 8101214161820
I , DRAIN CURRENT (A)
D
Fig. 4 Typical On-Resistance vs.
Drain Current and Temperature
0.0
Ω
E ( )
0.04
DMC3021LK4
T = A150°C
T = 125°C
A
T = A85°C
T =
25°C
A
T = A-55°C
1.3
1.1
V = 4.5V
GS
I= 5A
D
ESIS
0.03
V = 4.5V
GS
I=5A
D
0.02
0.9
DS(ON)
R , DRAIN-SOURCE
ON-RESISTANCE (Normalized)
0.7
0.5
-50 -25 0 25 50 75 100 125 150
T , JUNCTION TEMPERATURE ( C)J°
Fig. 5 On-Resistance Variation with Temperature
2.5
0.01
, D
DS(ON)
0
-50 -25 0 25 50 75 100 125 150 T , JUNCTION TEMPERATURE ( C)J°
Fig. 6 On-Resistance Variation with Temperature
20
V = 10V
GS
I = 10A
D
18
2
16
14
I= 1mA
D
12
1.5
I = 250µA
1
GS(th)
V , GATE THRESHOLD VOLTAGE (V)
0.5
-50 -25 0 25 50 75 100 125 150
D
T , JUNCTION TEMPERATURE ( C)J°
Fig. 7 On-Resistance Variation with Temperature
DMC3021LK4
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10
T = 25°C
8
A
6
S
I , SOURCE CURRENT (A)
4
2
0
0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1 1.2
V , SOURCE-DRAIN VOLTAGE (V)
SD
Fig. 8 Diode Forward Voltage vs. Current
© Diodes Incorporated
April 2014
Page 5
C
T, J
UNC
TION CAPACIT
C
pF)
DMC3021LK4
10,000
T = 150°C
A
1,000
100
T = A125°C
85°C
T =
A
10
DSS
I , LEAKAGE CURRENT (nA)
1
0 5 10 15 20 25 30
V , DRAIN-SOURCE VOLTAGE (V)
DS
T = A25°C
Fig. 9 Typical Drain-Source Leakage Current vs. Voltage
10
10,000
f=1MHz
E (
1,000
AN
C
100
10
0 5 10 15 20 25 30
V , DRAIN-SOURCE VOLTAGE(V)
DS
oss
Fig. 10 Typical Junction Capacitance
100
R
DS(ON)
Limited
C
iss
C
rss
8
V = 15V
GS
V (V)
DS
I=6A
D
6
4
D
I , DRAIN CURRENT (A)
10
0.1
DC
P = 10sW
P=1s
W
P = 100ms
1
W
P = 10ms
W
P=1ms
W
P = 100µs
W
P = 10µsW
2
T = 150 C
J(MAX)
T= 25C
A
0
0246 8101214161820
Q - (nC)
G
Single Pulse
0.01
0.1 1 10 100
Fig. 11 Gate Charge Characteristi cs
°
°
V , DRAIN-SOURCE VOLTAGE (V)
DS
Fig. 12 SOA, Safe Operation Area
DMC3021LK4
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Page 6
R
CUR
R
T
Electrical Characteristics P-CHANNEL – Q2 (@T
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 8)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current @TC = +25°C I
Gate-Source Leakage
ON CHARACTERISTICS (Note 8)
Gate Threshold Voltage
Static Drain-Source On-Resistance
Forward Transfer Admittance
Diode Forward Voltage
DYNAMIC CHARACTERISTICS (Note 9)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
Total Gate Charge (4.5V)
Total Gate Charge (10V)
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Notes: 8. Short duration pulse test used to minimize self-heating effect.
9. Guaranteed by design. Not subject to product testing.
30
-V = 10V
GS
-V = 4.5V
GS
25
BV
DSS
I
GSS
V
GS(th)
R
DS (ON)
|Y
V
C
C
C
R
Q
Q
Q
Q
t
D(on)
t
D(off)
DSS
fs
SD
iss
oss
rss
g
g
g
gs
gd
t
r
t
f
|
= +25°C, unless otherwise specified.)
A
-30 — — V
— —
— —
-1 A
±100 nA
-1 -1.7 -2.2 V
30 39
42 53
m
10 — S
-0.75 -1.0 V
1039
144
134
13
10.1
21.1
2.8
3.2
10.1
6.5
50.1
22.2
pF
pF
pF
nC
nC
nC
nC
ns
ns
ns
ns
20
V = -5.0V
DS
DMC3021LK4
VGS = 0V, ID = -250A
VDS = -30V, VGS = 0V
VGS = ±20V, VDS = 0V
VDS = VGS, ID = -250A
= -10V, ID = -4.3A
V
GS
V
= -4.5V, ID = -3.7A
GS
VDS = -5V, ID = -4.3A
VGS = 0V, IS = -1A
V
= -10V, VGS = 0V,
DS
f = 1.0MHz
VDS = 0V, VGS = 0V,f = 1.0MHz
= -10V, VDS = -15V,
V
GS
= -6A
I
D
= -15V, VGS = -10V,
V
DS
= 6, ID = -1A
R
G
-V = 4.0V
(A)
20
GS
15
EN
15
-V = 3.5VGS
10
T =
A
85°C
AIN
10
D
-I , D
5
0
00.511.52
-V , DRAIN-SOURCE VOLTAGE (V)
DS
-V = 3.0VGS
-V = 2.5VGS
-V = 2.0VGS
Fig.13 Typical Output Characteristics
D
-I , DRAIN CURRENT (A)
5
0
012345
T =
125°C
A
25°C
T =
150°C
T =
A
V , GATE-SOURCE VOLTAGE (V)
-GS
A
T = -55°C
A
Fig. 14 Typical Transfer Characteristics
DMC3021LK4
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Page 7
R
R
OUR
ON-R
R
R
OUR
O
R
2
R
RAIN-SOUR
CE O
N-R
TAN
C
GAT
THR
H
O
OLT
G
OUR
C
C
URR
T
DMC3021LK4
0.10
Ω
0.08
ESISTANCE( )
0.06
CE
0.04
-V = 4.5VGS
AIN-S
-V = 10V
0.02
, D
DS(ON)
0
0 5 10 15 20
-I , DRAIN-SOURCE CURRENT (A)
D
GS
Fig. 15 Typical On-Resistance vs.
Drain Current and Gate Voltage
1.7
0.1
Ω
V = 4.5VGS
0.10
ESISTANCE ( )
0.08
N-
CE
0.06
T =
A
125°C
0.04
AIN-S
, D
0.02
DS(ON)
0
02468101214161820
-I , DRAIN CURRENT (A)
D
T = 150°C
A
85°C
T =
A
25°C
T =
A
T = A-55°C
Fig. 16 Typical On-Resistance vs.
Drain Current and Temperature
0.08
Ω
1.5
E ( )
0.06
1.3 ESIS
-V = 4.5V
GS
-I = 5A
D
1.1
-V = 10V
GS
-I = 10A
D
0.9
DS(ON)
R , DRAIN-SOURCE
ON-RESISTANCE (Normalized)
0.7
0.5
-50 -25 0 25 50 75 100 125 150 T , JUNCTION TEMPERATURE ( C)
J
Fig. 17 On-Resistance Variation with Temperature
2.5
°
0.04
-V = 10V
GS
-I = 10A
0.02
D
, D
DS(ON)
0
-50 -25 0 25 50 75 100 125 150 T , JUNCTION TEMPERATURE ( C)J°
Fig. 18 On-Resistance Variation with Temperature
20
18
E (V)
2
A
-I = 250µA
D
1.5
LD V
-I = 1mA
D
ES
1
E
0.5
GS(th)
-V , 0
-50 -25 0 25 50 75 100 125 150 T , JUNCTION TEMPERATURE ( C)J°
Fig. 19 On-Resistance Variation with Temperature
16
(A)
14
EN
12
10
E
T = 25°C
A
8
6
S
-I , S 4
2
0
0.2 0.4 0.6 0.8 1.0 1.2 1.4
-V , SOURCE-DRAIN VOLTAGE (V)
SD
Fig. 20 Diode Forward Voltage vs. Current
DMC3021LK4
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Page 8
GE CUR
RENT
C
T
UNC
TION C
P
C
T
C
p
F
R
CUR
R
DMC3021LK4
10,000
150°C
1,000
(nA)
T =
A
T =
A
125°C
100
T = A85°C
10
1
DSS
-I , LEAKA
0.1
0 5 10 15 20 25 30
T = 25°C
A
-V , DRAIN-SOURCE VOLTAGE (V)
DS
Fig. 21 Typical Drain-Source Leakage Current vs. Voltage
10
10,000
f = 1MHz
)
E (
1,000 AN
I
C
iss
A A
100
C
oss
C
rss
, J
10
0 5 10 15 20 25 30
V , DRAIN-SOURCE VOLTAGE(V)
DS
Fig. 22 Typical Junction Capacitance
100
R
DS(ON)
Limited
8
V= 15V
DS
I=6A
D
6
GS
V (V)
4
2
0
0 5 10 15 20 25
Q - (nC)
G
Fig. 23 Gate Charge Characteristics
10
ENT (A)
1
AIN
D
-I , D
0.1
0.01
0.1 1 10 100
DC
P = 10sW
P=1s
W
P = 100ms
W
P = 10ms
W
P=1ms
W
P = 100µs
W
P = 10µsW
T = 150 C
J(MAX)
T= 25C
A
Single Pulse
°
°
-V , DRAIN-SOURCE VOLTAGE (V)
DS
Fig. 24 SOA, Safe Operation Area
1
D = 0.7
D = 0.5
D = 0.3
0.1
0.01
r(t), TRANSIENT THERMAL RESISTANCE
D = 0.1
D = 0.05
D = 0.02
D = 0.01
D = 0.005
Single Pulse
D = 0.9
R (t) = r(t) * R
θθ
JA JA
R = 46°C/W
θ
JA
Duty Cycle, D = t1 / t2
0.001
0.00001 0.0001 0.001 0.01 0.1 1 10 100 1,000 T1, PULSE DURATION TIME (sec)
Fig. 25 Transient Thermal Resistance
DMC3021LK4
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Page 9
Package Outline Dimensions
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for the latest version.
4X b2
E
b3
L3
D
L4
e
5X b
A
c2
A2
H
A1
L
a
E1
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
X1
DMC3021LK4
Dim Min Max Typ
TO252-4
A 2.19 2.39 2.29 A1 0.00 0.13 0.08 A2 0.97 1.17 1.07
b 0.51 0.71 0.583
b2 0.61 0.79 0.70 b3 5.21 5.46 5.33 c2 0.45 0.58 0.531
D 6.00 6.20 6.10 D1 5.21
e
E 6.45 6.70 6.58 E1 4.32
H 9.40 10.41 9.91
L 1.40 1.78 1.59
L3 0.88 1.27 1.08 L4 0.64 1.02 0.83
a 0° 10°
All Dimensions in mm
1.27
Y1
X (4x)
Dimensions Value (in mm)
c 1.27
Y2
c1
Y3
Y
c
c1 2.54
X 1.00
X1 5.73
Y 2.00 Y1 6.17 Y2 1.64 Y3 2.66
DMC3021LK4
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Page 10
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages.
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This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2014, Diodes Incorporated
www.diodes.com
DMC3021LK4
DMC3021LK4
Document number: DS35082 Rev. 5 - 2
10 of 10
www.diodes.com
April 2014
© Diodes Incorporated
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