Diodes DMC2400UV User Manual

DMC2400UV
COMPLEMENTARY PAIR ENHANCEMENT MODE MOSFET
SOT563
Features and Benefits
Low On-Resistance
Low Gate Threshold Voltage V
GS(th)
<1V
Low Input Capacitance
Fast Switching Speed
Low Input/Output Leakage
Complementary Pair MOSFET
Ultra-Small Surface Mount Package
ESD Protected Gate to 2kV HBM
Lead Free/RoHS Compliant (Note 1)
"Green" Device, Halogan and Antimony Free (Note 2)
Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
Case: SOT563
Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminal Connections: See Diagram
Terminals: Finish – Matte Tin annealed over Copper
leadframe. Solderable per MIL-STD-202, Method 208
Weight: 0.003 grams (approximate)
D
G
1
Q
1
S
1
S
2
2
Q
2
D
G
2
1
Product Summary
I
max
Device
V
R
(BR)DSS
DS(ON)
0.5 @ V
max
= 4.5V
GS
Q1 20V
0.9 @ VGS = 1.8V
1.0 @ V
= -4.5V
GS
Q2 -20V
2.0 @ VGS = -1.8V
Description and Applications
This new generation MOSFET has been designed to minimize the on-state resistance (R
) and yet maintain superior switching
DS(on)
performance, making it ideal for high efficiency power management
ADVANCE INFORMATION
applications.
Power management functions
Battery Operated Systems and Solid-State Relays
Load switch
ESD PROTECTED TO 2kV
D
TA = 25°C
1030mA
740mA
-700mA
-460mA
Top View Bottom View Equivalent Circuit
Ordering Information (Note 3)
Part Number Case Packaging
DMC2400UV-7 SOT563 3000/Tape & Reel
DMC2400UV-13 SOT563 10000/Tape & Reel
Notes: 1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. No purposely added lead. Halogen and Antimony free
2. Diodes Inc.’s “Green” policy can be found on our website at http://www.diodes.com.
3. For packaging details, go to our website at http://www.diodes.com.
Marking Information
CA3 = Product Type Marking Code YM = Date Code Marking Y = Year (ex: Y = 2011) M = Month (ex: 9 = September)
Date Code Key
Year 2011 2012 2013 2014 2015 2016 2017
Code Y Z A B C D E
Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec
Code 1 2 3 4 5 6 7 8 9 O N D
DMC2400UV
Document number: DS35537 Rev. 6 - 2
1 of 10
www.diodes.com
February 2012
© Diodes Incorporated
DMC2400UV
Maximum Ratings - Q1 N-CHANNEL @T
= 25°C unless otherwise specified
A
Characteristic Symbol Value Units
Drain-Source Voltage Gate-Source Voltage
Continuous Drain Current (Note 5) VGS = 4.5V
Continuous Drain Current (Note 5) VGS = 1.8V
Pulsed Drain Current (10s pulse, duty cycle = 1%) Maximum Body Diode continuous Current
Steady
State
t<10s
Steady
State
t<10s
T
= 25°C
A
= 70°C
T
A
T
= 25°C
A
T
= 70°C
A
T
= 25°C
A
T
= 70°C
A
= 25°C
T
A
= 70°C
T
A
V
DSS
V
GSS
I
D
I
D
I
D
I
D
I
DM
I
S
20 V
±12 V
1030
800
1150
900 740
570 870
700
mA
mA
mA
mA
3 A
800 mA
ADVANCE INFORMATION
Maximum Ratings - Q2 P-CHANNEL @T
= 25°C unless otherwise specified
A
Characteristic Symbol Value Units
Drain-Source Voltage Gate-Source Voltage
Continuous Drain Current (Note 5) VGS = -4.5V
Continuous Drain Current (Note 5) VGS = -1.8V
Pulsed Drain Current (10s pulse, duty cycle = 1%) Maximum Body Diode continuous Current
Steady
State
t<10s
Steady
State
t<10s
= 25°C
T
A
= 70°C
T
A
T
= 25°C
A
T
= 70°C
A
T
= 25°C
A
= 70°C
T
A
T
= 25°C
A
T
= 70°C
A
V
DSS
V
GSS
I
D
I
D
I
D
I
D
I
DM
I
S
-20 V ±8 V
-700
-550
-820
-640
-460
-350
-550
-420
mA
mA
mA
mA
-2 A
-800 mA
Thermal Characteristics @T
= 25°C unless otherwise specified
A
Characteristic Symbol Value Units
Total Power Dissipation (Note 4) Thermal Resistance, Junction to Ambient (Note 4) Total Power Dissipation (Note 5) Thermal Resistance, Junction to Ambient (Note 5) Operating and Storage Temperature Range
DMC2400UV
Document number: DS35537 Rev. 6 - 2
Steady state
t<10s 210 °C/W
Steady state
t<10s 97 °C/W
2 of 10
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P
R
P
R
T
J, TSTG
D
JA
θ
D
JA
θ
0.45 W 281 °C/W
1 W
129 °C/W
-55 to +150 °C
February 2012
© Diodes Incorporated
)
g
g
g
g
r
RAIN C
URR
N
T
R
CUR
R
T
Electrical Characteristics - Q1 N-CHANNEL @T
= 25°C unless otherwise specified
A
DMC2400UV
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 6)
Drain-Source Breakdown Voltage Zero Gate Voltage Drain Current TJ = 25°C I
Gate-Source Leakage
BV
DSS
I
GSS
DSS
20 - - V
- - 100 nA
- - ±1
- - ±4.0
VGS = 0V, ID = 1mA VDS = 20V, VGS = 0V
= ±5V, VDS = 0V
V
μA
GS
V
= ±8V, VDS = 0V
GS
ON CHARACTERISTICS (Note 6) Gate Threshold Voltage
Static Drain-Source On-Resistance
Forward Transfer Admittance Diode Forward Voltage
V
GS(th
R
DS (ON)
|Y V
fs
SD
0.5 - 0.9 V
- 0.3 0.48
- 0.35 0.5
- 0.45 0.7
- 0.55 0.9
- 0.65 1.5
- 2 -
|
- 1.4 - S
- 0.7 1.2 V
VDS = VGS, ID = 250A V
= 5.0V, ID = 200mA
GS
V
= 4.5V, ID = 200mA
GS
V
= 2.5V, ID = 200mA
Ω
GS
V
= 1.8V, ID = 100mA
GS
V
= 1.5V, ID = 50mA
GS
= 1.2V, ID = 1mA
V
GS
VDS = 3V, ID = 200mA VGS = 0V, IS = 500mA,
DYNAMIC CHARACTERISTICS (Note 7)
ADVANCE INFORMATION
Input Capacitance Output Capacitance Reverse Transfer Capacitance Gate Resistance Total Gate Charge Gate-Source Charge Gate-Drain Charge Turn-On Delay Time Turn-On Rise Time Turn-Off Delay Time Turn-Off Fall Time
Notes: 4. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
5. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate.
6. Short duration pulse test used to minimize self-heating effect.
7. Guaranteed by design. Not subject to product testing.
C
C
oss
C
rss
R
Q Q Q
t
D(on)
t
t
D(off)
t
iss
s d
f
- 37.1 -
- 6.5 -
- 4.8 -
- 68 -
- 0.5 -
- 0.07 -
- 0.1 -
4.06
-
7.28
-
13.74
-
10.54
-
= 10V, VGS = 0V,
V
pF
Ω
nC
-
-
-
ns
-
DS
f = 1.0MHz VDS = 0V, VGS = 0V,
= 4.5V, VDS = 10V,
V
GS
= 250mA
I
D
V
= 10V, VGS = 4.5V,
DD
R
= 47, RG = 10,
L
I
= 200mA
D
2.0
V = 4.5V
GS
V = 2.5V
GS
1.5
V = 5V
DS
1.5
(A) E
1.0
V = 2.0V
GS
V = 1.8V
GS
(A) EN
1.0
AIN
0.5
D
D
I, D
0.5
0
012345
V , DRAIN-SOURCE VOLTAGE (V)
DS
V = 1.5V
GS
V = 1.2V
GS
I, D
0
0 0.5 1 1.5 2 2.5 3
Fig. 1 Typical Output Characteristics
DMC2400UV
Document number: DS35537 Rev. 6 - 2
3 of 10
www.diodes.com
T = 150°C
A
T = 125°C
A
T = 85°C
A
V , GATE SOURCE VOLT AGE (V)
GS
T = 25°C
A
T = -55°C
A
Fig. 2 Typical Transfer Characteristics
© Diodes Incorporated
February 2012
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