Diodes DMC1017UPD User Manual

g
YYWW
COMPLEMENTARY PAIR ENHANCEMENT MODE MOSFET
POWERDI
Product Summary
Device
Q1 12V
Q2 -12V
V
R
(BR)DSS
17m @ V
25m @ VGS = 2.5V
32m @ V
53m @ VGS = -2.5V
DS(ON)
GS
GS
= 4.5V
= -4.5V
TA = +25°C
9.5A
7.8A
-6.9A
-5.4A
Description and Applications
This new generation Complementary Pair Enhancement Mode MOSFET has been designed to minimize R superior switching performance. This device is ideal for use in
Notebook battery power management and Loadswitch.
Notebook Battery Power Management
DC-DC Converters
Loadswitch
Top View
Pin1
Bottom View
and yet maintain
DS(on)
I
D
G1
Features and Benefits
Thermally Efficient Package-Cooler Running Applications
High Conversion Efficiency
Low R
Low Input Capacitance
Fast Switching Speed
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
– Minimizes On State Losses
DS(ON)
Mechanical Data
Case: POWERDI5060-8
Case Material: Molded Plastic, “Green” Molding Compound. UL
Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminal Connections: See Diagram Below
Weight: 0.097 grams (approximate)
D1
G2
S1
Q1 N-Channel MOSFET Q2 P-Channel MOSFET
D2
S2
S1
G1
S2
G2
Top View
Pin Confi
Ordering Information (Note 4)
Part Number Case Packaging
DMC1017UPD-13 POWERDI5060-8 2500 / Tape & Reel
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
POWERDI is a registered trademark of Diodes Incorporated.
DMC1017UPD
Document number: DS36903 Rev. 1 - 0
D1 D2 D2
C1017UD
S1D1G1 S2 G2
www.diodes.com
= Manufacturer’s Marking C1017UD = Product Type Marking Code YYWW = Date Code Marking YY = Year (ex: 13 = 2013) WW = Week (01 - 53)
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© Diodes Incorporated
®
5060-8
uration
April 2014
D1
D1
D2
D2
V
V
Maximum Ratings (@T
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (Note 5) VGS = 4.5V
Maximum Body Diode Forward Current
Pulsed Drain Current (10µs pulse, duty cycle = 1%)
Avalanche Current (Note 6) L = 0.1mH
Avalanche Energy (Note 6) L = 0.1mH
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Q1
V
DSS
V
GSS
= +25°C
Steady
State
t<10s
T
A
= +70°C
T
A
= +25°C
T
A
= +70°C
T
A
I
D
I
D
I
S
I
DM
I
AS
E
AS
alue Q2 Value Units
12 -12 V
±8 ±8 V
9.5
7.6
13.0
10.4
-6.9
-5.5
-9.4
-7.5
A
A
2 -2 A
50 -35 A
9.7 -9.2 A
4.7 4.3 mJ
Thermal Characteristics
Characteristic Symbol
T
= +25°C
Total Power Dissipation (Note 5)
Thermal Resistance, Junction to Ambient (Note 5)
Thermal Resistance, Junction to Case (Note 5)
Operating and Storage Temperature Range
A
TA = +70°C
Steady state
t<10s 29
P
R
R
T
J, TSTG
JA
JC
D
Electrical Characteristics Q1 N-Channel (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Source Leakage
12
BV
DSS
I
DSS
I
GSS
1 µA
±100
V
VGS = 0V, ID = 250µA
VDS = 12V, VGS = 0V
nA
VGS = ±8V, VDS = 0V
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
Static Drain-Source On-Resistance
Diode Forward Voltage
V
R
DS(ON)
V
GS(th)
SD
0.6
9.6 17
11 25
0.7 1.2 V
1.5 V
VDS = VGS, ID = 250µA
V
m
VGS = 2.5V, ID = 9.8A
VGS = 0V, IS = 2.9A
DYNAMIC CHARACTERISTICS (Note 8)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
Total Gate Charge (VGS = 4.5V)
Total Gate Charge (VGS = 10V)
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
Notes: 5. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate.
6. I
and EAS rating are based on low frequency and duty cycles to keep TJ = 25°C.
AS
7. Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to product testing.
C
iss
C
oss
C
rss
R
G
Q
g
Q
g
Q
gs
Q
gd
t
D(on)
t
r
t
D(off)
t
f
t
rr
Q
rr
1787
297
265
1.6
18.6
35.4
2.7
3.8
6.9
10.9
70.3
31.8
13.1 —
2.2 —
V
pF
f = 1.0MHz
VDS = 0V, VGS = 0V, f = 1.0MHz
nC
V
V
nS
V
nS
I
F
nC
I
F
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alue Units
2.3
1.5 54
4.1
-55 to +150 °C
= 4.5V, ID = 11.8A
GS
= 6V, VGS = 0V,
DS
= 6V, ID = 11.8A
DS
= 6V, RL = 6
DD
= 4.5V, RG = 6, ID = 1A
GS
= 11.8A, di/dt = 100A/s
= 11.8A, di/dt = 100A/s
© Diodes Incorporated
W
°C/W
April 2014
R
CUR
R
T
R
CUR
RENT
R
R
OUR
ON-R
R
R
OUR
ON-R
R
R
OUR
C
R
R
OUR
CE ON-R
T
C
20.0
15.0
(A)
EN
10.0
V= 8.0V
GS
V= 4.5V
GS
V= 4.0V
GS
V= 3.0V
GS
V= 2.5V
GS
V= 2.0V
GS
AIN
D
5.0
I, D
V= 1.2V
0.0 0 0.5 1 1.5 2 2.5 3
V , DRAIN-SOURCE VOLTAGE (V)
DS
GS
Figure 1 Typical Output Characteristics
0.015
Ω
0.012
V= 1.5V
GS
V= 1.3V
GS
20
V = 5.0VDS
18
16
14
(A)
12
10
8
AIN
6
D
I, D
4
2
0
0 0.5 1 1.5 2 2.5
T = 150°C
A
T = 125°C
A
V , GATE-SOURCE VOLTAGE (V)
GS
T = 85°C
A
T = 25°C
A
T = -55°C
A
Figure 2 Typical Transfer Characteristics
0.015
Ω
0.012
V = 4.5VGS
T = 125°C
A
T = 150°C
A
ESISTANCE ( )
CE
AIN-S
, D
DS(ON)
E
AIN-S
, D
DS(ON)
0.009
0.006
V = 2.5VGS
V = 4.5VGS
0.003
0
0 2 4 6 8 10 12 14 16 18 20
I , DRAIN-SOURCE CURRENT (A)D
Figure 3 Typical On-Resistance vs.
Drain Current and Gate Voltage
2.5
2
V= V
2.5
1.5
GS
I= 5A
D
1
0.5
ON-RESISTANCE (NORMALIZED)
V = 4.5V
GS
I= 10A
D
T = 85°C
ESISTANCE ( )
CE
0.009
T = 25°C
A
A
T = -55°C
A
0.006
AIN-S
0.003
, D
DS(ON)
0
0 2 4 6 8 101214161820
I , DRAIN CURRENT (A)
D
Figure 4 Typical On-Resistance vs.
Drain Current and Temperature
0.015
Ω
E ( )
V=.5V
2
GS
I= 5A
D
AN
0.01
ESIS
V= V
4.5
GS
I = 10A
D
0.005
AIN-S
, D
DS(ON)
0
-50-25 0 25 50 75100125150 T , JUNCTION TEMPERATURE ( C)
J
°
Figure 5 On-Resistance Variat ion wi th Temperature
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0
-50 -25 0 25 50 75 100 125 150 T , JUNCTION TEMPERATURE ( C)
J
°
Figure 6 On-Resistance Variation wi th Temperature
April 2014
© Diodes Incorporated
GATE THRESH
O
O
TAG
OUR
CE CUR
RENT
C
UNC
TIO
N CAPACITAN
C
GATE THRESH
O
OLTAG
1.5
E (V)
L
1
LD V
I = 250µA
D
I= 1mA
D
0.5
GS(th)
V,
0
-50 -25 0 25 50 75 100 125 150 T , JUNCTION TEMPERATURE ( C)
J
Figure 7 Gate Threshold Variation vs. Ambient Temperat ure
10000
E (pF)
1000
C
rss
100
, J
T
°
f = 1MHz
C
20
18
16
(A)
14
12
10
8
T= 85°C
T = 150°C
A
T = 125°C
A
S
I, S
6
4
2
0
0 0.3 0.6 0.9 1.2 1.5
V , SOURCE-DRAIN VOLTAGE (V)
SD
Figure 8 Diode Forward Voltage vs. Current
8
iss
E (V)
6
LD V
C
oss
4
2
GS
V
A
T= 25°C
A
T = -55°C
A
V= 6V
DS
I= A
11.8
D
10
024681012
V , DRAIN-SOURCE VOLTAGE (V)
DS
Figure 9 Typical Junction Capacitance
0
0 5 10 15 20 25 30 35 40
Q(nC)
, TOTAL GATE CHARGE
g
Figure 10 Gate Charge
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RAIN
C
U
R
REN
T
R
N
CUR
REN
T
Electrical Characteristics Q2 P-Channel (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 6)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Source Leakage
BV
I
DSS
I
GSS
DSS
-12
ON CHARACTERISTICS (Note 6)
Gate Threshold Voltage
Static Drain-Source On-Resistance
Diode Forward Voltage
V
R
DS(ON)
V
GS(th)
SD
-0.6
21 32
41 53
-0.7 -1.2 V
DYNAMIC CHARACTERISTICS (Note 7)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
Total Gate Charge (VGS = -4.5V)
Total Gate Charge (VGS = -8V)
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
Notes: 6. IAS and EAS rating are based on low frequency and duty cycles to keep TJ = 25°C.
7. Short duration pulse test used to minimize self-heating effect.
C
iss
C
oss
C
rss
R
G
Q
g
Q
g
Q
gs
Q
gd
t
D(on)
t
r
t
D(off)
t
f
t
rr
Q
rr
2100
872
626
23.1
23.7
38.8
5.3
9.8
10.6
25.5
144
129
48.9 — nS
15.3 — nC
20.0
15.0
(A)
V = -8.0V
GS
V = -4.5V
GS
V = -4.0V
GS
V = -3.5V
GS
V = -3.0V
GS
V = -2.5V
GS
-1 µA
±100
-1.5 V
20
V = -5.0V
DS
18
16
(A)
14
12
V
VGS = 0V, ID = -250µA
VDS = -12V, VGS = 0V
nA
VGS = ±8V, VDS = 0V
VDS = VGS, ID = -250µA
= -4.5V, ID = -8.9A
V
m
pF
nC
nS
GS
VGS = -2.5V, ID = -6.9A
VGS = 0V, IS = -2.9A
VDS = -6V, VGS = 0V, f = 1.0MHz
VDS = 0V, VGS = 0V, f = 1.0MHz
V
= -6V, ID = -8.9A
DS
V
= -6V, RL = 6
DD
= -4.5V, RG = 6, ID = -1A
V
GS
IF = -8.9A, di/dt = -100A/s
IF = -8.9A, di/dt = -100A/s
10.0
D
-I , D
5.0
V = -1.8V
0.0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5
-V , DRAIN -SOURCE VOLTAGE (V)
DS
GS
Figure 11 Typical Output Characteristics
V = -2.0V
GS
10
8
AI
6
D
-I , D 4
T = 150C
A
T = 125C
°
A
°
2
0
0 0.5 1 1.5 2 2.5 3 3.5 4
-V , GATE-SOURCE VOLTAGE (V)
GS
T = 85C
A
T = 25C
A
T = -55C
°
A
°
°
Figure 12 Typical Transfer Characteristics
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R
R
OUR
ON-R
R
R
OUR
ON-R
R
R
OUR
C
R
RAIN-SOUR
CE O
N-R
TAN
C
G
TE T
H
RESH
O
O
TAG
OUR
CE C
U
R
R
T
Ω
ESISTANCE ( )
0.03
0.027
0.024
V= -4.5V
GS
T = 125 CA°
T = 150CA°
T = 85CA°
0.08
Ω
0.07
0.06
ESISTANCE ( )
0.05
V = -2.5V
GS
0.021
0.04
CE
0.03
V = -4.5V
AIN-S
0.02
GS
, D
0.01
DS(ON)
0
0 2 4 6 8 10121416 1820
-I , DRAIN SOURCE CURRENT (A)
D
Figure 13Typical On-Resistance vs.
Drain Current and Gate Voltage
2
V = -4.5V
1.5
E
GS
I = -10A
D
CE
0.018
0.015
AIN-S
, D
0.012
DS(ON)
0.009 0 2 4 6 8 10 12 14 16 18 20
-I , DRAIN SOURCE CURRENT (A)
D
Figure 14 Typical On-Resistance vs.
Drain Current and Temperature
0.05
Ω
0.045
E ( )
0.04
0.035
ESIS
T = 25CA°
T = -55CA°
V= -2.5V
GS
I= A
-5
D
0.03
1
AIN-S
, D
DS(ON)
0.5
ON-RESISTANCE (NORMALIZED)
0
-50 -25 0 25 50 75 100 125 150 T , JUNCTION TEMPERATURE ( C)J°
Figure 15 On-Resistance Variation with Temperature
2
V = -2.5V
GS
I = -5A
D
0.025
0.02
0.015
0.01
, D
0.005
DS(on)
0
-50 -25 0 25 50 75 100 125 150 T , JUNCTION TEMPERATURE ( C)J°
Figure 16 On-Resistance Variation with Temperature
20
-4.
V=5V
GS
-10
I= A
D
18
E (V)
16
1.5
L
-I = 1m AD
LD V
-I = 250µA
D
1
A
0.5
GS(TH)
V,
0
-50-25 0 25 50 75100125150 T , AMBIENT TEMPERATURE (°C)
A
Figure 17 Gate Threshold Variation vs. Ambient Temperature
(A)
14
EN
12
10
8
T= 150CA°
6
-I , S
S
4
T= 125CA°
2
0
0 0.3 0.6 0.9 1.2
-V , SOURCE-DRAIN VOLTAGE (V)
SD
Figure 18 Diode Forward Voltage vs. Current
T= 85CA°
T= 25CA°
T= -55CA°
1.5
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GAT
OUR
C
O
TAG
T
R
T T
HER
R
TANC
10000
f = 1MHz
C
iss
8
E (V)
6
L
E V
V= -6V
1000
C
oss
C
rss
4
E-S
DS
I = -8.9A
D
2
T
C , JUNCTION CAPACITANCE (pF)
100
024681012
-V , DRAIN-SOURCE VOLTAGE (V)
DS
Figure 19 Typical Junction Capacitance
1
D = 0.9
D = 0.7
D = 0.5
E
D = 0.3
GS
-V ,
0
0 5 10 15 20 25 30 35 40
Q , TOTAL GATE CHARGE (nC)
g
Figure 20 Gate-Charge Characteristics
0.1
ESIS
D = 0.1
MAL
D = 0.05
D = 0.02
0.01
D = 0.01
ANSIEN
D = 0.005
r(t),
Single Pulse
0.001
0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000
R (t) = r(t) * R
θθ
JA JA
R = 104°C/W
θ
JA
Duty Cycle, D = t1/ t2
t1, PULSE DURATION TIMES (sec)
Figure 21 Transient Thermal Resistance
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Package Outline Dimensions
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
D
1
04
x
y
x
E
1DE
1
Ø1.000 Depth 0.07±0.030
c
e
0
14
x
A
1
Seating Plane
E
2
b
18
x
b8
x
1
D
L
3
k
1
D
2
e/2
b
22
x
k
L
4
D
2
M
DETAIL
A
A
DETAIL
A
L
a
L
1
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for latest version.
8
X
4
X
Y
2
Y
3
3
X
1
1
X
X
2
C
Y
1
G
1
Y4
x
G
Dim Min Max Typ
A 0.90 1.10 1.00
A1 0 0.05 0.02
b 0.33 0.51 0.41 b1 0.300 0.366 0.333 b2 0.20 0.35 0.25
c 0.23 0.33 0.277
D 5.15 BSC D1 4.85 4.95 4.90 D2 1.40 1.60 1.50 D3 - - 3.98
E 6.15 BSC
E1 5.75 5.85 5.80 E2 3.56 3.76 3.66
e 1.27BSC k - - 1.27
k1 0.56 - -
L 0.51 0.71 0.61 La 0.51 0.71 0.61 L1 0.05 0.20 0.175 L4 - - 0.125
M 3.50 3.71 3.605
x - - 1.400
y - - 1.900
θ 10° 12° 11° θ1 6° 8° 7°
Dimensions
C 1.270
G 0.660
G1 0.820
X 0.610 X1 3.910 X2 1.650 X3 1.650 X4 4.420
Y 1.270 Y1 1.020 Y2 3.810 Y3 6.610
PowerDI5060-8
All Dimensions in mm
Value
(in mm)
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IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2014, Diodes Incorporated
www.diodes.com
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April 2014
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