Diodes DLPA004 User Manual

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Features

• Fast Switching Speed

• Ultra-Small Surface Mount Package

• Lead Free By Design/RoHS Compliant (Note 3)

• "Green" Device (Note 4)

• Qualified to AEC-Q101 Standards for High Reliability

Data Line Transient Protection

In accordance with (Note 1):

• IEC 61000-4-2 Contact Method: ±15kV

• IEC 61000-4-2 Air Discharge Method: ±25kV

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Mechanical Data

• Case: SOT-363

• Case Material: Molded Plastic, "Green" Molding Compound.

UL Flammability Classification Rating 94V-0 (Note 3)

• Moisture Sensitivity: Level 1 per J-STD-020D

• Terminals: Finish ⎯ Matte Tin annealed over Alloy 42

Leadframe. Solderable per MIL-STD-202, Method 208

• Ordering Information: See Page 3

• Marking Information: See Page 3

• Weight: 0.006 grams (approximate)

SOT-363

Device Schematic

DATA BUS TRANSIENT SUPPRESSOR

I/O

N/CN/C

5

46

2

I/O

3

V

P

1

V

N

DLPA004

Maximum Ratings @T

= 25°C unless otherwise specified

A

Characteristic Symbol Value Unit

Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage

RMS Reverse Voltage
Forward Current (Single Diode)
Peak Forward Surge Current

8.3ms Single half Sine-Wave Superimposed on Rated Load
Average Rectified Forward Current (Note 1)
Repetitive Peak Forward Current
Non-Repetitive Peak Forward Surge Current @ t = 1.0μs

@ t = 1.0ms
@ t = 1.0s

Thermal Characteristics

Characteristic Symbol Value Unit

Power Dissipation (Note 2)
Thermal Resistance Junction to Ambient Air (Note 2)
Operating and Storage Temperature Range

Notes: 1. Tested with VCC pins connected to GND pin.

DLPA004

Document number: DS31593 Rev. 4 - 2

2. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which
can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.

3. No purposefully added lead.

4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.

V

RRM

V

RWM

V

R

V

R(RMS

I

FM

I

FM(surge)

I

F(AV

I

FRM

I

FSM

P

D

R

JA

T

, T

J

STG

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85 V

60 V

200 mA

3.5 A
1 A

450 mA

4.0

1.0

A

0.5

200 mW
625

-65 to +150

°C/W

°C

March 2009

© Diodes Incorporated

(BR)

P, P

OWER

PATIO

N

TANT

O

US FORWARD CUR

RENT

T

T

O

U

R

R

C

URR

T

Electrical Characteristics @T

= 25°C unless otherwise specified

A

Characteristic Symbol Min Typ Max Unit Test Condition

Reverse Breakdown Voltage (Note 5)

Forward Voltage

Leakage Current (Note 5)

Total Capacitance (per element)
Capacitance Between Two Data Lines (DL1 & DL2, DL1 & DL3) CLL ⎯
Capacitance Between Data Line and Ground

Reverse Recovery Time

Notes: 5. Short duration pulse test used to minimize self-heating effect.

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300

250

(mW)

200

150

DISSI

100

V

V

F

I

R

C

T

C

LG

t

rr

85

R

⎯ ⎯

⎯

⎯

⎯
⎯ ⎯

1,000

(mA)

⎯
⎯

100

1.0

⎯ ⎯

0.80

0.90

1.0

1.25

⎯

⎯
⎯

2

2.5
30
50

⎯

1.6 2.0 pF

2.3 3.0 pF

3.0

10

V

IR = 100μA
I

= 1.0mA

F

= 10mA

I

F

V

I

= 50mA

F

= 150mA

I

F

V

= 70V

R

μA

pF

= 25V, TJ = 150°C

V

R

V

= 70V, TJ = 150°C

R

VR = 0, f = 1.0MHz
VR = 0, f = 1.0MHz
VR = 0, f = 1.0MHz
I

= IR = 10mA,

F

μs

I

= 0.1 x IR, RL = 100Ω

rr

DLPA004

D

50

0

0 25 50 75 100 125 150

T , AMBIENT TEMPERATURE (°C)

A

Fig. 1 Power Derating Curve, Total Package

10

ANE

F

I , INS

0.1

0.01
012

V , INSTANTANEOUS FORWARD VOLT AGE (V)

F

Fig. 2 Typical Forward Characteristics, Per Element

(nA )
EN

SE

EVE

1

S

ANE
AN

R

I , INS

0.1
050

T , AMBIENT TEMPERATURE ( C)

A

150100 200

°

Fig. 3 Typical Reverse Characteristics, Per Element

DLPA004

Document number: DS31593 Rev. 4 - 2

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March 2009

© Diodes Incorporated