Diodes DFLS230L User Manual
Features
• Guard Ring Die Construction for Transient Protection
• Low Power Loss, High Efficiency
• Patented Interlocking Clip Design for High Surge Current
Capacity
• High Current Capability and Low Forward Voltage Drop
• Lead Free Finish, RoHS Compliant (Note 1)
• "Green" Molding Compound (No Br, Sb)
• Qualified to AEC-Q101 Standards for High Reliability
DFLS230L
2.0A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER
PowerDI
®
123
Mechanical Data
• Case: PowerDI®123
• Case Material: Molded Plastic, "Green" Molding Compound. UL
Flammability Classification Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-02
• Terminal Connections: Cathode Band
• Terminals: Finish – Matte Tin Annealed Over Copper
Leadframe. Solderable per MIL-STD-202, Method 208
• Weight: 0.01 grams (approximate)
Top View
Ordering Information (Note 2)
Part Number Case Packaging
DFLS230L-7 PowerDI®123 3000/Tape & Reel
Notes: 1. EU Directive 2002/95/EC (RoHS). All applicable RoHS exemptions applied, see EU Directive 2002/95/EC Anne x Notes.
2. For packaging details, go to our website at http://www.diodes.com.
Marking Information
Date Code Key
Year 2004 2005 2006 2007 2008 2009 2010 2011 2012
Code R S T U V W X Y Z
Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec
Code 1 2 3 4 5 6 7 8 9 O N D
PowerDI is a registered trademark of Diodes Incorporated.
F03A
YM
DFLS230L
Document number: DS30515 Rev. 5 - 2
F03A = Product Type Marking Code
YM = Date Code Marking
Y = Year (ex: T = 2006)
M = Month (ex: 9 = September)
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)
)
θ
θ
θ
(BR)
Maximum Ratings @T
= 25°C unless otherwise specified
A
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitance load, derate current by 20%.
Characteristic Symbol Value Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Average Forward Current @ TT = 121°C I
Non-Repetitive Peak Forward Surge Current 8.3ms
Single Half Sine-Wave Superimposed on Rated Load
Thermal Characteristics
Characteristic Symbol Value Unit
Power Dissipation (Note 3)
Power Dissipation (Note 4)
Thermal Resistance Junction to Ambient (Note 3)
Thermal Resistance Junction to Ambient (Note 4)
Thermal Resistance Junction to Soldering (Note 5)
Operating Temperature Range
Storage Temperature Range
V
V
V
R(RMS
I
R
R
R
T
RRM
RWM
V
F(AV
FSM
P
P
T
STG
DFLS230L
R
D
D
JA
JA
JS
J
30 V
21 V
2.0 A
33 A
1.67 W
556 mW
60
180
10
-40 to +125
-40 to +150
°C/W
°C/W
°C/W
°C
°C
Electrical Characteristics @T
= 25°C unless otherwise specified
A
Characteristic Symbol Min Typ Max Unit Test Condition
Reverse Breakdown Voltage (Note 6)
Forward Voltage
Leakage Current (Note 6)
Total Capacitance
Notes: 3. Part mounted on 2"x2" GETEK board with 1"x1" copper pad, 25% anode, 75% cathode. TA = 25°C.
4. Part mounted on FR-4 board with recommended pad layout, which can be found on our website at http://www.diodes.com.
5. Theoretical R
6. Short duration pulse test used to minimize self-heating effect.
calculated from the top center of the die straight down to the PCB/cathode tab solder junction.
θJS
V
V
F
I
R
C
T
30
R
⎯
⎯
⎯
⎯
⎯
⎯ ⎯
0.310
0.375
0.260
⎯
76
⎯
0.420
⎯
1.0
⎯
V
IR = 1.0mA
= 1.0A
I
F
V
= 2.0A
I
F
= 5V, TA = 25°C
V
mA
R
V
= 30V, TA = 25°C
R
pF
VR = 10V, f = 1.0MHz
PowerDI is a registered trademark of Diodes Incorporated.
DFLS230L
Document number: DS30515 Rev. 5 - 2
2 of 4
www.diodes.com
October 2010
© Diodes Incorporated
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