Diodes DFLS140 User Manual

Features
Guard Ring Die Construction for Transient Protection
Low Power Loss, High Efficiency
Patented Interlocking Clip Design for High Surge Current
Capacity
Low Forward Voltage Drop
Lead Free Finish, RoHS Compliant (Note 1)
“Green” Molding Compound (No Br, Sb)
Qualified to AEC-Q101 Standards for High Reliability
DFLS140
1.0A SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER PowerDI
®
123
Mechanical Data
Case: PowerDI®123
Case Material: Molded Plastic.UL “Green” Molding Compound
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Polarity: Cathode Band
Terminals: Finish – Matte Tin annealed over Copper
leadframe. Solderable per MIL-STD-202, Method 208
Weight: 0.01 grams (approximate)
Top View
Ordering Information (Note 2)
Part Number Case Packaging
DFLS140-7 PowerDI®123 3000/Tape & Reel
Notes: 1. EU Directive 2002/95/EC (RoHS). All applicable RoHS exemptions applied, see EU Directive 2002/95/EC Annex Notes.
2. For packaging details, go to our website at http://www.diodes.com.
Marking Information
Date Code Key
Year 2004 2005 2006 2007 2008 2009 2010 2011 2012
Code R S T U V W X Y Z
Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec
Code 1 2 3 4 5 6 7 8 9 O N D
F04
DFLS140
Document number: DS30446 Rev. 8 - 2
F04 = Product Type Marking Code YM = Date Code Marking Y = Year (ex: T = 2006)
YM
M = Month (ex: 9 = September)
1 of 4
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© Diodes Incorporated
)
)
θ
θ
θ
(BR)
TANT
O
US F
O
R
RD CUR
RENT
Maximum Ratings @T
= 25°C unless otherwise specified
A
Single phase, half wave, 60Hz, resistive or inductive load. For capacitance load, derate current by 20%.
Characteristic Symbol Value Unit
Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage
RMS Reverse Voltage Average Forward Current @ TT = 119°C I
Non-Repetitive Peak Forward Surge Current 8.3ms Single Half Sine-Wave Superimposed on Rated Load
Thermal Characteristics
Characteristic Symbol Value Unit
Power Dissipation (Note 1) Power Dissipation (Note 2) Thermal Resistance Junction to Ambient (Note 3) Thermal Resistance Junction to Ambient (Note 4) Thermal Resistance Junction to Soldering (Note 5) Operating Temperature Range Storage Temperature Range
V
V
V
R(RMS
I
R R R
T
RRM RWM
V
F(AV
FSM
P P
T
STG
DFLS140
R
D D JA JA JS J
40 V
28 V
1.1 A 40 A
1.67 W 556 mW
60
180
10
-55 to +125
-55 to +150
°C/W °C/W °C/W
°C °C
Electrical Characteristics @T
= 25°C unless otherwise specified
A
Characteristic Symbol Min Typ Max Unit Test Condition
Reverse Breakdown Voltage (Note 6) Forward Voltage
Leakage Current (Note 6) Total Capacitance
Notes: 3. Part mounted on 50.8mm X 50.8mm GETEK board with 25.4mm X 25.4mm copper pad, 25% anode, 75% cathode. TA = 25°C
4. Part mounted on FR-4 board with 1.8mm X 2.5mm cathode and 1.8mm X 1.2mm anode, 1 oz. copper pads. T
5. Theoretical R
6. Short duration pulse test used to minimize self-heating effect.
10
(A)
calculated from the top center of the die straight down to the PCB/cathode tab solder junction.
θJS
V
V
F
I
R
C
T
40
R
⎯ ⎯
⎯ ⎯
0.45
0.53
28
0.51
20
6.0
10,000
V
IR = 20μA
= 0.5A
I
F
V
I
=1.1A
F
= 40V, TJ = 25°C
V
μA
mA
R
= 40V, TJ = 100°C
V
R
pF
VR = 10V, f = 1.0MHz
= 25°C
A
1,000
1
WA
0.1
100
10
1.0
0.1
ANE
0.01
0.01
0.001
F
I , INS
0.001 V , INSTANTANEOUS FORWARD VOLTAGE (V)
F
0.4
0.20
0.6
0.8
1.0
Fig. 1 Typi cal Forwar d C haracte r istics
1.2
1.4
1.6
0.0001 20 30
10515
V , INSTANTANEOUS REVERSE VOLTAGE (V)
R
25 35
Fig. 2 Typical Reverse Characteristics
40
DFLS140
Document number: DS30446 Rev. 8 - 2
2 of 4
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October 2010
© Diodes Incorporated
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