Diodes DESD3V3S1BLP3 User Manual
t
r
Features
Ultra-Small, Low Profile Leadless Surface Mount Package (0.6 *
0.3 * 0.3mm)
Provides ESD Protection per IEC 61000-4-2 Standard:
Air – ±30kV, Contact – ±25kV
1 Channel of ESD Protection
Low Channel Input Capacitance
Typically Used in Cellular Handsets, Portable Electronics,
Communication Systems, Computers and Peripherals
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
ADVANCE INFORMATION
Top View Bottom View
X3-DFN0603-2
DESD3V3S1BLP3
LOW CAPACITANCE BIDIRECTIONAL TVS DIODE
Mechanical Data
Case: X3-DFN0603-2
Case Material: Molded Plastic, “Green” Molding Compound. UL
Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Finish Matte Tin over Copper leadframe, Solderable
per MIL-STD-202, Method 208
Weight: 0.0002 grams (approximate)
Device Schematic
Ordering Information (Note 4)
Product Compliance Marking Reel size(inches) Tape width(mm) Quantity per reel
DESD3V3S1BLP3-7 Standard S 7 8 10,000/Tape & Reel
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
Maximum Ratings (@T
Characteristic Symbol Value Unit Conditions
Peak Pulse Power Dissipation
Peak Pulse Current
ESD Protection – Contact Discharge
ESD Protection – Air Discharge
A
= +25°C unless otherwise specified)
V
ESD_Contac
V
S = Product Type Marking Code
P
PP
I
PP
ESD_Ai
35 W 8/20μs, Per Fig. 3
5 A 8/20μs, Per Fig. 3
±25 kV IEC 61000-4-2 Standard
±30 kV IEC 61000-4-2 Standard
DESD3V3S1BLP3
Document number: DS36098 Rev. 3 - 2
1 of 4
www.diodes.com
December 2013
© Diodes Incorporated
P, P
OWER
P
O
P
P
U
RATIN
G
O
F
DESD3V3S1BLP3
Thermal Characteristics
Characteristic Symbol Value Unit
Package Power Dissipation (Note 5)
Thermal Resistance, Junction to Ambient (Note 5)
Operating and Storage Temperature Range
P
D
R
θJA
T
, T
J
STG
Electrical Characteristics (@T
= +25°C unless otherwise specified)
A
Characteristic Symbol Min Typ Max Unit Test Conditions
Reverse Standoff Voltage
Channel Leakage Current (Note 6)
Clamping Voltage, Positive Transients
Breakdown Voltage
Differential Resistance
Channel Input Capacitance
Notes: 5. Device mounted on FR-4 PCB pad layout (2oz copper) as shown on Diodes, Inc. suggested pad layout AP02001, which can be found on our website at
ADVANCE INFORMATION
http://www.diodes.com.
6. Short duration pulse test used to minimize self-heating effect.
V
RWM
I
RM
V
V
R
C
CL
BR
DIF
T
—
—
—
—
— 3.3 V —
10 100 nA
4.5
5.8
5.4
7.0
3.8 — 6.5 V
—
—
0.3 — Ω
10 13 pF
N (mW)
250
225
200
175
Note 5
100
75
%
250 mW
500
-65 to +150
V
= 3.3V
RWM
= 1A, tp = 8/20μS
I
PP
V
= 5A, tp = 8/20μS
I
PP
IR = 1mA
I
= 1A
R
VR = 0V, f = 1MHz
C/W
C
ATI
150
125
DISSI
100
LSE DE
75
D
50
EAK
PEAK POWER OR CURRENT
25
0
0125175
25 10050 75 150
T , AMBIENT TEMPERATURE ( C)
A
Figure 1 Power Derating Curve
°
1000
100
100
50
10
50
25
0
0
25 50
T , AMBIENT TEMPERATURE (°C)
A
75 100 125
Figure 2 Pulse Derating Curve
T = 150°C
A
T = 125°C
A
T = 85°C
A
T = 25°C
1
A
150
T = -55°C
A
175 200
PppP
I , PEAK PULSE CURRENT (%I )
0
0
20 40
t, TIME ( s)
Figure 3 Pulse Waveform
DESD3V3S1BLP3
Document number: DS36098 Rev. 3 - 2
60
2 of 4
www.diodes.com
R
I , INSTANTANEOUS REVERSE CURRENT (nA)
0.1
0123
V , INSTANTANEOUS REVERSE VOLTAGE (V)
R
Figure 4 Typical Reverse Characteristics
December 2013
© Diodes Incorporated
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