Diodes DESD3V3S1BL User Manual

Features
Low Profile Package (0.53mm max) and Ultra-small PCB
Footprint Area (1.08 * 0.68mm max) Suitable for Compact
Portable Electronics
Provides ESD Protection per IEC 61000-4-2 Standard:
Air ±30kV, Contact ±25kV
1 Channel of ESD Protection
Low Channel Input Capacitance
Typically Used in Cellular Handsets, Portable Electronics,
Communication Systems, Computers and Peripherals
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
X1-DFN1006-2
Bottom View
DESD3V3S1BL
LOW CAPACITANCE BIDIRECTIONAL TVS DIODES
Mechanical Data
Case: X1-DFN1006-2
Case Material: Molded Plastic, “Green” Molding Compound. UL
Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: NiPdAu over Copper leadframe. Solderable per MIL-
STD-202, Method 208
Polarity: Cathode Band
Weight: 0.001 grams (approximate)
Device Schematic
e4
Ordering Information (Note 4)
Product Compliance Marking Reel size(inches) Tape width(mm) Quantity per reel
DESD3V3S1BL-7B Standard RH 7 8 10,000/Tape & Reel
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
DESD3V3S1BL
Document number: DS35995 Rev. 3 - 2
RH = Product Type Marking Code Line Denotes Cathode Side
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t
r
P
P
O
R
P
O
P
A
P
U
DERAT
N
G
O
F
Maximum Ratings (@T
= +25°C unless otherwise specified)
A
Characteristic Symbol Value Unit Conditions
Peak Pulse Power Dissipation Peak Pulse Current ESD Protection – Contact Discharge ESD Protection – Air Discharge
Thermal Characteristics
Characteristic Symbol Value Unit
Package Power Dissipation (Note 5) Thermal Resistance, Junction to Ambient (Note 5) Operating and Storage Temperature Range
Electrical Characteristics (@T
= +25°C unless otherwise specified)
A
P
PP
I
PP
V
ESD_Contac
V
ESD_Ai
DESD3V3S1BL
35 W 8/20μs, Per Figure 3
5 A 8/20μs, Per Figure 3
±25 kV IEC 61000-4-2 Standard ±30 kV IEC 61000-4-2 Standard
P
D
R
θJA
T
, T
J
STG
250 mW 500
-65 to +150
C/W
C
Characteristic Symbol Min Typ Max Unit Test Conditions
Reverse Standoff Voltage Channel Leakage Current (Note 6)
Clamping Voltage, Positive Transients
Breakdown Voltage Differential Resistance Channel Input Capacitance
Notes: 5. Device mounted on FR-4 PCB pad layout (2oz copper) as shown on Diodes, Inc. suggested pad layout AP02001, which can be found on our website at
http://www.diodes.com.
6. Short duration pulse test used to minimize self-heating effect.
V
RWM
I
V
V
R
C
RM
CL
BR
DIF
T
— — 3.3 V — — 10 100 nA
— —
4.5
5.8
5.4
7.0
3.8 — 6.5 V
— 0.3 — — 10 13 pF
V I
V
PP
I
PP
IR = 1mA IR = 1A VR = 0V, f = 1MHz
= 3.3V
RWM
= 1A, tp = 8/20μS = 5A, tp = 8/20μS
N (mW)
ATI
250
225
200
175
150
125
Note 5
100
75
%
I
50
DISSI
WE
,
D
100
75
50
LSE
K
25
E
PEAK POWER OR CURRENT
25
0
0125175
25 10050 75 150
T , AMBIENT TEMPERATURE ( C)
A
Figure 1 Power Derating Curve
°
0
0
25 50
T , AMBIENT TEMPERATURE (°C)
A
75 100 125
Figure 2 Pulse Derating Curve
150
175 200
DESD3V3S1BL
Document number: DS35995 Rev. 3 - 2
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1000
100
100
10
50
1
PppP
I , PEAK PULSE CURRENT (%I )
0
0
20 40
t, TIME ( s)
Figure 3 Pulse Waveform
60
R
I , INSTANTANEOUS REVERSE CURRENT (nA)
0.1 0123
V , INSTANTANEOUS REVERSE VOLTAGE (V)
R
Figure 4 Typical Reverse Characteristics
11
10.5
f = 1MHz
10
9.5
9
8.5
8
7.5
7
6.5
J
C , JUNCTION CAPACITANCE (pF)
6
5.5
5
0 0.5 1 1.5 2 2.5 3 3.3
V , REVERSE VOLTAGE (V)
R
Figure 5 Typical Capacitance
Package Outline Dimensions
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
DESD3V3S1BL
Document number: DS35995 Rev. 3 - 2
A
X1-DFN1006-2
Dim Min Max Typ
A1
D
A 0.47 0.53 0.50
A1 0 0.05 0.03
b 0.45 0.55 0.50 D 0.95 1.075 1.00 E 0.55 0.675 0.60
E
R
b
e - - 0.40 L 0.20 0.30 0.25 R 0.05 0.15 0.10
All Dimensions in mm
L
e
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DESD3V3S1BL
T = 150°C
A
T = 125°C
A
T = 85°C
A
T = 25°C
A
T = -55°C
A
March 2014
© Diodes Incorporated
DESD3V3S1BL
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for latest version.
X
Y
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the final and determinative format released by Diodes Incorporated.
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2014, Diodes Incorporated
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C
Dimensions Value (in mm)
Z 1.1
G 0.3
X 0.7 Y 0.4
G
Z
C 0.7
IMPORTANT NOTICE
LIFE SUPPORT
DESD3V3S1BL
Document number: DS35995 Rev. 3 - 2
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March 2014
© Diodes Incorporated
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