Features
Low Profile Package (0.53mm max) and Ultra-small PCB
Footprint Area (1.08 * 0.68mm max) Suitable for Compact
Portable Electronics
Provides ESD Protection per IEC 61000-4-2 Standard:
Air ±30kV, Contact ±25kV
1 Channel of ESD Protection
Low Channel Input Capacitance
Typically Used in Cellular Handsets, Portable Electronics,
Communication Systems, Computers and Peripherals
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
X1-DFN1006-2
Bottom View
DESD3V3S1BL
LOW CAPACITANCE BIDIRECTIONAL TVS DIODES
Mechanical Data
Case: X1-DFN1006-2
Case Material: Molded Plastic, “Green” Molding Compound. UL
Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: NiPdAu over Copper leadframe. Solderable per MIL-
STD-202, Method 208
Polarity: Cathode Band
Weight: 0.001 grams (approximate)
Device Schematic
e4
Ordering Information (Note 4)
Product Compliance Marking Reel size(inches) Tape width(mm) Quantity per reel
DESD3V3S1BL-7B Standard RH 7 8 10,000/Tape & Reel
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
DESD3V3S1BL
Document number: DS35995 Rev. 3 - 2
RH = Product Type Marking Code
Line Denotes Cathode Side
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Maximum Ratings (@T
= +25°C unless otherwise specified)
A
Characteristic Symbol Value Unit Conditions
Peak Pulse Power Dissipation
Peak Pulse Current
ESD Protection – Contact Discharge
ESD Protection – Air Discharge
Thermal Characteristics
Characteristic Symbol Value Unit
Package Power Dissipation (Note 5)
Thermal Resistance, Junction to Ambient (Note 5)
Operating and Storage Temperature Range
Electrical Characteristics (@T
= +25°C unless otherwise specified)
A
P
PP
I
PP
V
ESD_Contac
V
ESD_Ai
DESD3V3S1BL
35 W 8/20μs, Per Figure 3
5 A 8/20μs, Per Figure 3
±25 kV IEC 61000-4-2 Standard
±30 kV IEC 61000-4-2 Standard
P
D
R
θJA
T
, T
J
STG
250 mW
500
-65 to +150
C/W
C
Characteristic Symbol Min Typ Max Unit Test Conditions
Reverse Standoff Voltage
Channel Leakage Current (Note 6)
Clamping Voltage, Positive Transients
Breakdown Voltage
Differential Resistance
Channel Input Capacitance
Notes: 5. Device mounted on FR-4 PCB pad layout (2oz copper) as shown on Diodes, Inc. suggested pad layout AP02001, which can be found on our website at
http://www.diodes.com.
6. Short duration pulse test used to minimize self-heating effect.
V
RWM
I
V
V
R
C
RM
CL
BR
DIF
T
— — 3.3 V —
— 10 100 nA
—
—
4.5
5.8
5.4
7.0
3.8 — 6.5 V
— 0.3 — Ω
— 10 13 pF
V
I
V
PP
I
PP
IR = 1mA
IR = 1A
VR = 0V, f = 1MHz
= 3.3V
RWM
= 1A, tp = 8/20μS
= 5A, tp = 8/20μS
N (mW)
ATI
250
225
200
175
150
125
Note 5
100
75
%
I
50
DISSI
WE
,
D
100
75
50
LSE
K
25
E
PEAK POWER OR CURRENT
25
0
0125175
25 10050 75 150
T , AMBIENT TEMPERATURE ( C)
A
Figure 1 Power Derating Curve
°
0
0
25 50
T , AMBIENT TEMPERATURE (°C)
A
75 100 125
Figure 2 Pulse Derating Curve
150
175 200
DESD3V3S1BL
Document number: DS35995 Rev. 3 - 2
2 of 4
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March 2014
© Diodes Incorporated