Diodes DESD1P0RFW User Manual
ernal Schematic
Features
• Low Capacitance
• Small Surface Mount Package
• For ESD Protection of High Speed Data Lines
• Lead Free/RoHS Compliant (Note 1)
• "Green" Device (Note 2)
• Qualified to AEC-Q101 Standards for High Reliability
ADVANCE INFORMATION
SOT323
Top View
Ordering Information (Notes 3)
Part Number Qualification Case Packaging
DESD1P0RFW-7 Commercial SOT323 3000/Tape & Reel
DESD1P0RFWQ-7 Automotive SOT323 3000/Tape & Reel
Notes: 1. No purposefully added lead.
2. Diodes Inc.`s “Green” Policy can be found on our website at http://www.diodes.com
3. For Packaging Details, go to our website at http://www.diodes.com.
Marking Information
Date Code Key
Year 2011 2012 2013 2014 2015 2016 2017
Code Y Z A B C D E
Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec
Code 1 2 3 4 5 6 7 8 9 O N D
TV9
YM
DESD1P0RFW
LOW CAPACITANCE, ESD PROTECTION DIODE ARRAY
Mechanical Data
• Case: SOT323
• Case Material: Molded Plastic, "Green" Molding Compound.
UL Flammability Classification Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020
• Terminals: Matte Tin Finish Annealed Over Alloy 42 Leadframe
(Lead Free Plating). Solderable per MIL-STD-202, Method 208
• Weight: 0.006 Grams (Approximate)
Top View
Int
TV9 = Product Type Marking Code
YM = Date Code Marking
Y = Year (ex: Y = 2011)
M = Month (ex: 9 = September)
DESD1P0RFW
Document number: DS35278 Rev. 5 - 2
1 of 4
www.diodes.com
September 2011
© Diodes Incorporated
t
r
θ
P
P
O
R
PATIO
T
T
O
U
O
RWAR
C
URR
T
Maximum Ratings @T
= 25°C unless otherwise specified
A
Characteristic Symbol Value Unit Conditions
Peak Pulse Current
ESD Protection – Contact Discharge
ESD Protection – Air Discharge
Thermal Characteristics
Characteristic Symbol Value Unit
Power Dissipation (Note 6)
Thermal Resistance Junction to Ambient Air (Note 6)
Operating and Storage Temperature Range
Electrical Characteristics @T
ADVANCE INFORMATION
Reverse Working Voltage
Reverse Current
Forward Clamping Voltage (Note 5)
Capacitance
Notes: 4. Diodes Short duration pulse test used to minimize self-heating effect.
Characteristic (Note 4) Symbol Min Typ Max Unit Test Conditions
5. Anti-parallel or rail-to-rail connection
6. Device mounted on FR-4 PCB with minimum recommended pad layout.
7. Clamping voltage value is based on an 8x20 μs peak pulse current (I
8. Total capacitance line to ground (2 diodes in parallel)
250
200
N (mW )
150
= 25°C unless otherwise specified
A
V
RWM
I
RM
V
FC
C
T
I
PP
V
ESD_Contac
V
ESD_Ai
- - 70 V -
15 A
±30 kV Standard IEC 61000-4-2(Note 5)
±30 kV Standard IEC 61000-4-2(Note 5)
P
D
R
JA
T
, T
J
STG
-65 to +150
- - 100 nA
- 2 6
- 4 8
V
- 1 1.5 pF
) waveform.
pp
8/20μs (Notes 4 & 5)
200 mW
625
VRM = 70V
I
= 3A; per IEC 61000-4-5 (Note 7)
PP
I
= 10A; per IEC 61000-4-5 (Note 7)
PP
VR = 0V, f = 1MHz (Note 8)
1,000
(mA)
EN
100
D
DESD1P0RFW
°C/W
°C
10
DISSI
100
S F
WE
1
,
50
D
0
0
T , AMBIENT TEMPERATURE ( C)
A
120
160 20040 80
°
Fig. 1 Power Derating Curve, Total Package
ANE
AN
F
0.1
I, INS
0 0.2 0.4 0.6 0.8 1.0 1.2
V , INSTANTANEOUS FORW ARD VOLT AGE (V)
F
Fig. 2 Typi cal Forward C haracte r istics, Per Element
DESD1P0RFW
Document number: DS35278 Rev. 5 - 2
2 of 4
www.diodes.com
September 2011
© Diodes Incorporated
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