Page 1
ernal Schematic
Features
• Low Capacitance
• Small Surface Mount Package
• For ESD Protection of High Speed Data Lines
• Lead Free/RoHS Compliant (Note 1)
• "Green" Device (Note 2)
• Qualified to AEC-Q101 Standards for High Reliability
ADVANCE INFORMATION
SOT323
Top View
Ordering Information (Notes 3)
Part Number Qualification Case Packaging
DESD1P0RFW-7 Commercial SOT323 3000/Tape & Reel
DESD1P0RFWQ-7 Automotive SOT323 3000/Tape & Reel
Notes: 1. No purposefully added lead.
2. Diodes Inc.`s “Green” Policy can be found on our website at http://www.diodes.com
3. For Packaging Details, go to our website at http://www.diodes.com.
Marking Information
Date Code Key
Year 2011 2012 2013 2014 2015 2016 2017
Code Y Z A B C D E
Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec
Code 1 2 3 4 5 6 7 8 9 O N D
TV9
YM
DESD1P0RFW
LOW CAPACITANCE, ESD PROTECTION DIODE ARRAY
Mechanical Data
• Case: SOT323
• Case Material: Molded Plastic, "Green" Molding Compound.
UL Flammability Classification Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020
• Terminals: Matte Tin Finish Annealed Over Alloy 42 Leadframe
(Lead Free Plating). Solderable per MIL-STD-202, Method 208
• Weight: 0.006 Grams (Approximate)
Top View
Int
TV9 = Product Type Marking Code
YM = Date Code Marking
Y = Year (ex: Y = 2011)
M = Month (ex: 9 = September)
DESD1P0RFW
Document number: DS35278 Rev. 5 - 2
1 of 4
www.diodes.com
September 2011
© Diodes Incorporated
Page 2
t
r
θ
P
P
O
R
PATIO
T
T
O
U
O
RWAR
C
URR
T
Maximum Ratings @T
= 25°C unless otherwise specified
A
Characteristic Symbol Value Unit Conditions
Peak Pulse Current
ESD Protection – Contact Discharge
ESD Protection – Air Discharge
Thermal Characteristics
Characteristic Symbol Value Unit
Power Dissipation (Note 6)
Thermal Resistance Junction to Ambient Air (Note 6)
Operating and Storage Temperature Range
Electrical Characteristics @T
ADVANCE INFORMATION
Reverse Working Voltage
Reverse Current
Forward Clamping Voltage (Note 5)
Capacitance
Notes: 4. Diodes Short duration pulse test used to minimize self-heating effect.
Characteristic (Note 4) Symbol Min Typ Max Unit Test Conditions
5. Anti-parallel or rail-to-rail connection
6. Device mounted on FR-4 PCB with minimum recommended pad layout.
7. Clamping voltage value is based on an 8x20 μs peak pulse current (I
8. Total capacitance line to ground (2 diodes in parallel)
250
200
N (mW )
150
= 25°C unless otherwise specified
A
V
RWM
I
RM
V
FC
C
T
I
PP
V
ESD_Contac
V
ESD_Ai
- - 70 V -
15 A
±30 kV Standard IEC 61000-4-2(Note 5)
±30 kV Standard IEC 61000-4-2(Note 5)
P
D
R
JA
T
, T
J
STG
-65 to +150
- - 100 nA
- 2 6
- 4 8
V
- 1 1.5 pF
) waveform.
pp
8/20μs (Notes 4 & 5)
200 mW
625
VRM = 70V
I
= 3A; per IEC 61000-4-5 (Note 7)
PP
I
= 10A; per IEC 61000-4-5 (Note 7)
PP
VR = 0V, f = 1MHz (Note 8)
1,000
(mA)
EN
100
D
DESD1P0RFW
°C/W
°C
10
DISSI
100
S F
WE
1
,
50
D
0
0
T , AMBIENT TEMPERATURE ( C)
A
120
160 20040 80
°
Fig. 1 Power Derating Curve, Total Package
ANE
AN
F
0.1
I, INS
0 0.2 0.4 0.6 0.8 1.0 1.2
V , INSTANTANEOUS FORW ARD VOLT AGE (V)
F
Fig. 2 Typi cal Forward C haracte r istics, Per Element
DESD1P0RFW
Document number: DS35278 Rev. 5 - 2
2 of 4
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September 2011
© Diodes Incorporated
Page 3
NST
N
TANEO
U
R
R
CUR
REN
T
O
RWARD C
PING VOLT
G
100,000
(nA)
10,000
1,000
SE
100
EVE
S
10
A
1
R
I, I
0.1
020406080100
V , INSTANT ANEOUS REVERSE VOLT AGE (V)
R
Fig. 3 Typical Reverse Cha r acteris t ics, Per El ement
Package Outline Dimensions
ADVANCE INFORMATION
K
J
Suggested Pad Layout
Y
Z
DESD1P0RFW
8
7
E (V)
A
6
5
4
LAM
3
2
1
FC
V, F
0
0 5 10 15 20
Fig. 4 Typical Forward Clamping Characteristics
A
Dim Min Max Typ
C
B
G
H
M
D
L
C
X
E
A 0.25 0.40 0.30
B 1.15 1.35 1.30
C 2.00 2.20 2.10
D - - 0.65
G 1.20 1.40 1.30
H 1.80 2.20 2.15
J 0.0 0.10 0.05
K 0.90 1.00 1.00
L 0.25 0.40 0.30
M 0.10 0.18 0.11
α
All Dimensions in mm
Dimensions Value (in mm)
Z 2.8
X 0.7
Y 0.9
C 1.9
E 1.0
I , SURGE CURRENT (A)
PP
SOT323
0° 8° -
Note 7
DESD1P0RFW
Document number: DS35278 Rev. 5 - 2
3 of 4
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September 2011
© Diodes Incorporated
Page 4
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorize d application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
ADVANCE INFORMATION
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2011, Diodes Incorporated
www.diodes.com
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
IMPORTANT NOTICE
LIFE SUPPORT
DESD1P0RFW
DESD1P0RFW
Document number: DS35278 Rev. 5 - 2
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September 2011
© Diodes Incorporated
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