PRE-BIASED (R1 = R2) SMALL SIGNAL SURFACE MOUNT 100mA NPN TRANSISTOR
Features
• Epitaxial Planar Die Construction
• Ultra-Small Leadless Surface Mount Package
• Ideally Suited for Automated Assembly Processes
• “Lead Free”, RoHS Compliant (Note 1)
• Halogen and Antimony Free "Green" Device (Note 2)
• Qualified to AEC-Q101 Standards for High Reliability
Part Number R1 (NOM) R2 (NOM) Marking
DDTC114ELP 10K
DFN1006-3
Bottom View
10K
B
E
Top View
Pin-Out
N5
C
DDTC114ELP
Mechanical Data
• Case: DFN1006-3
• Case Material: Molded Plastic, "Green" Molding Compound.
UL Flammability Classification Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020
• Terminals: Finish - NiPdAu over Copper leadframe. Solderable
per MIL-STD-202, Method 208
• Weight: 0.0009 grams (approximate)
OUT
C
3
1
R
2
Device S
B
E
2
GND
mbol
IN
1
R
B
IN
1
Equivalent Inverter
E
2
Circuit
C
GND
3
OUT
Ordering Information (Note 3)
Product Marking Reel size (inches) Tape width (mm) Quantity per reel
DDTC114ELP-7 N5 7 8 3,000
DDTC114ELP-7B N5 7 8 10,000
Notes: 1. No purposefully added lead.
2. Diodes Inc's "Green" policy can be found on our website at http://www.diodes.com.
3. For packaging details, go to our website at http://www.diodes.com.
Marking Information
DDTC114ELP
Document number: DS30945 Rev. 7 - 2
DDTC114ELP-7 DDTC114ELP-7B
N5N5
Top View
Dot Denotes
Collector Side
Top View
Bar Denotes Base
and Emitter Side
1 of 5
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N5 = Product Type Marking Code
February 2011
© Diodes Incorporated
Maximum Ratings @T
= 25°C unless otherwise specified
A
Characteristic Symbol Value Unit
Supply Voltage
Input Voltage
Output Current
Collector Current
V
V
I
I
C(MAX
CC
O
IN
Thermal Characteristics @T
= 25°C unless otherwise specified
A
Characteristic Symbol Value Unit
Power Dissipation (Note 4)
Power Derating above 25°C
Thermal Resistance, Junction to Ambient Air (Note 4)
(Equivalent to one heated junction of NPN)
Operating and Storage Temperature Range
P
D
P
de
R
JA
θ
T
, T
J
STG
Electrical Characteristics @T
= 25°C unless otherwise specified
A
Characteristic Symbol Min Typ Max Unit Test Condition
Off Characteristics (Note 5)
Collector-Base Breakdown Voltage
Collector-Emitter Breakdown Voltage
Emitter-Base Breakdown Voltage
Collector Cutoff Current
Base Cutoff Current (I
) IBL ⎯ ⎯
BE
Collector-Base Cut Off Current
Collector-Emitter Cut Off Current, I
O(OFF
Emitter-Base Cut Off Current
Input Off Voltage
BV
CBO
BV
CEO
BV
EBO
I
⎯ ⎯
CEX
I
⎯ ⎯
CBO
I
⎯ ⎯
CEO
I
⎯ ⎯
EBO
V
I(off
50
50
5
⎯
⎯ ⎯
⎯ ⎯
⎯ ⎯
0.5
0.5
0.5
1
0.4 mA
1.16 0.5 V
On Characteristics (Notes 5 & 6)
DC Current Gain
Collector-Emitter Saturation Voltage
Base-Emitter Turn-On Voltage
Base-Emitter Saturation Voltage
Input-On Voltage
Input Current
Output On Voltage (Same as V
CE(sat
) V
h
V
CE(sat)
V
BE(on)
V
BE(sat)
V
FE
I(on
I
I
O(on
10
15
60
100
90
⎯ ⎯
⎯ ⎯
⎯ ⎯
⎯ ⎯
⎯ ⎯
⎯ ⎯
⎯ ⎯
⎯ ⎯
⎯ ⎯
2.5 1.6
⎯ ⎯
⎯ ⎯
⎯ ⎯ ⎯ V
⎯ ⎯ ⎯ V
⎯ ⎯ ⎯ V
⎯ ⎯ ⎯ V
⎯ ⎯ ⎯ VCE = 5V, IC = 70mA
0.15 V
0.2 V
0.25 V
0.25 V
0.3 V
0.85 V
0.95 V
0.98 V
1.2 V
⎯
0.88 mA
0.3 V
Input Resistance R1 7 10 13
Resistance Ratio (R2/R1) 0.8 1 1.2
Small Signal Characteristics
Current Gain-Bandwidth Product
Notes: 4. Device mounted on FR-4 PCB, 1” x 0.85” x 0.062”
5. Short duration pulse test used to minimize self-heating effect. Pulse Test: Pulse width tp<300 μs, Duty Cycle, d ≤ 2%.
6. Guaranteed by design.
f
⎯
T
250
⎯
50 V
-10 to +40 V
50 mA
100 mA
250 mW
2 mW/°C
500 °C/W
-55 to +150 °C
V
IC = 10μA, IE = 0
V
IC = 1.0mA, IB = 0
V
IE = 50μA, IC = 0
μA
μA
μA
μA
= 50V, V
V
CE
= 50V, V
V
CE
= 50V, IE = 0
V
CB
= 50V, IB = 0
V
CB
EB(OFF
EB(OFF
VEB = 4V, IC = 0
VCC = 5V, IO = 100uA
= 5V, IC = 1mA
CE
= 5V, IC = 2mA
CE
= 5V, IC = 10mA
CE
= 5V, IC = 50mA
CE
I
= 10mA, IB = 1mA
C
IC = 50mA, IB = 5mA
IC = 50mA, IB = 2.5mA
IC = 50mA, IB = 10mA
IC = 70mA, IB = 10mA
V
= 5V, IC = 2mA
CE
VCE = 5V, IC = 10mA
I
= 10mA, IB = 1mA, VCE = 5V
C
IC = 50mA, IB = 5mA, VCE = 5V
V
VO = 0.3V, IO = 50mA
V
= 5V
I
II = 2.5mA, IO = 50mA
K
⎯ ⎯
MHz
VCE = 10V, IE = 5mA, f = 1MHz
DDTC114ELP
= 3.0V
= 3.0V
⎯
DDTC114ELP
Document number: DS30945 Rev. 7 - 2
2 of 5
www.diodes.com
February 2011
© Diodes Incorporated