Diodes DCX69 User Manual

Page 1
R
Y
Features
Epitaxial Planar Die Construction
Ideally Suited for Automated Assembly Processes
Ideal for Medium Power Switching or Amplification Applications
Totally Lead-Free & Fully RoHS compliant (Note 1)
Halogen and Antimony Free. “Green” Device (Note 2)
Qualified to AEC-Q101 Standards for High Reliability
SOT89
Top View
COLLECTOR
1
BASE
Device Schematic Pin Out Configuration
2,4
3
EMITTE
DCX69/-16/-25
PNP SURFACE MOUNT TRANSISTOR
Mechanical Data
Case: SOT89
Case Material: Molded Plastic, "Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Finish — Matte Tin annealed over Copper leadframe
(Lead Free Plating). Solderable per MIL-STD-202, Method 208
Weight: 0.055 grams (approximate)
E
3
C
C
4
Top Vi ew
2
B
1
Ordering Information (Note 3)
Part Number Case Packaging
DCX69-13 SOT89 2500/Tape & Reel DCX69-16-13 SOT89 2500/Tape & Reel DCX69-25TA SOT89 1000/Tape & Reel DCX69-25-13 SOT89 2500/Tape & Reel
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
3. For packaging details, go to our website at http://www.diodes.com.
2. Halogen and Antimony free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.
Marking Information
DCX69/-16/-25
Document number: DS31264 Rev. 6 - 2
WW
xxx
www.diodes.com
xxx = Product Type Marking Code: P12 = DCX69 P12-16 = DCX69-16 P12-25 = DCX69-25 YWW = Date Code Marking Y = Last digit of year (ex: 7 = 2007) WW = Week code (01 – 53)
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April 2012
© Diodes Incorporated
Page 2
θ
(BR)
(BR)
(BR)
)
DCX69/-16/-25
Maximum Ratings @T
= 25°C unless otherwise specified
A
Characteristic Symbol Value Unit Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Collector Current Peak Pulse Power
V
CBO
V
CEO
V
EBO
I
C
I
CM
-25 V
-20 V
-5.0 V
-1.0 A
-2.0 A
Thermal Characteristics
Characteristic Symbol Value Unit
Power Dissipation (Note 4) @ TA = 25°C PD Thermal Resistance, Junction to Ambient Air @ TA = 25°C (Note 4) Operating and Storage Temperature Range
R
JA
T
, T
J
STG
Electrical Characteristics @T
= 25°C unless otherwise specified
A
Characteristic Symbol Min Typ Max Unit Test Conditions
OFF CHARACTERISTICS (Note 5)
Collector-Base Breakdown Voltage Collector-Emitter Breakdown Voltage Emitter-Base Breakdown Voltage
Collector-Base Cutoff Current Emitter-Base Cutoff Current
V
CBO
V
CEO
V
EBO
I
CBO
I
EBO
-25
-20
-5.0
⎯ ⎯ ⎯ ⎯
-100
-10
-100 nA
ON CHARACTERISTICS (Note 5)
DCX69, DCX69-16, DCX69-25
DC Current Gain
Collector-Emitter Saturation Voltage Base-Emitter Turn-On Voltage
50 60
DCX69 85
h
FE
DCX69-16 100 DCX69-25 160
V
CE(SAT
V
BE(ON)
⎯ ⎯
⎯ ⎯
⎯ ⎯
⎯ ⎯
375 250 375
-0.5 V
-0.7
-1.0
SMALL SIGNAL CHARACTERISTICS Current Gain-Bandwidth Product Output Capacitance
Notes: 4. Device mounted on FR-4 PCB; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which can be found on our website at
http://www.diodes.com.
5. Measured under pulsed conditions. Pulse width = 300μs. Duty cycle ≤2%.
f
T
C
obo
40 200
17
⎯ ⎯
DCX69/-16/-25
Document number: DS31264 Rev. 6 - 2
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1 W
125 °C/W
-55 to +150 °C
V
I
= -100μA, IE = 0
C
V
I
= -10mA, IB = 0
C
V
I
= -100μA, IC = 0
E
nA μA
= -25V, IE = 0
V
CB
= -25V, IE = 0, TA = 150°C
V
CB
VEB = -5.0V, IC = 0
V
= -10V, IC = -5.0mA
CE
= -1.0V, IC = -1.0A
V
CE
VCE = -1.0V, IC = -500mA ⎯ V
= -1.0V, IC = -500mA
CE
= -1.0V, IC = -500mA
V
CE
IC = -1.0A, IB = -100mA
= -10V, IC = -5mA
V
CE
V
V
= -1.0V, IC = -500mA
CE
V
= -5.0V, IC = -50mA,
CE
MHz
f = 100MHz
pF
VCB = -10V, f = 1MHz
April 2012
© Diodes Incorporated
Page 3
P, P
O
R
P
T
O
N
C
O
C
TOR CUR
REN
T
C CUR
RENT G
C
O
CTO
R
T
TER
T
T
R
TURN-O
OLTAG
T
TER
DCX69/-16/-25
1.0
0.8
(mW) I
0.6
A
DISSI
0.4
WE
D
0.2
350
300
250
AIN
200
150
FE
100
h, D
50
0
0
25 50
T , AMBIENT TEMPERATURE (°C)
A
75 100 125
150
Fig. 1 Power Dissipation vs.
Ambient Temperature ( Note 4)
V = -1V
CE
T = 150°C
A
T = 85°C
A
T = 25°C
A
T = -55°C
A
1.8
1.6
I = -10mA
1.4
(A)
1.2
1.0
B
I = -8mA
B
I = -6mA
B
0.8
LLE
0.6
0.4
C
-I ,
I = -4mA
B
I = -2mA
B
0.2 0
012345678910
-V , COLLECTOR EMITTER VOLTAGE (V)
CE
Fig. 2 Typical Collector Current
vs. Collector-Emitter Voltage
0.6
0.5
-EMI
0.4
0.3
LLE
0.2
SATURATION VOLTAGE (V)
CE(SAT)
-V ,
0.1
I/I = 10
CB
T = 150°C
A
T = 85°C
A
T = 25°C
A
T = -55°C
A
0
0.001 0.01 0.1 1 10
-I , COLLECTOR CURRENT (A)
C
Fig. 3 Typical DC Current Gain
vs. Collector Current (DCX69-16)
1.2
0
0.001 0.01 0.1 1 10
-I , COLLECTOR CURRENT (A)
Fig. 4 Typical Collector-Emitter Saturation Voltage
C
vs. Collector Current
1.2
E (V)
1.0
1.0
N V
0.8
T = -55°C
A
0.6
T = 25°C
E
A
T = 85°C
A
0.4
T = 150°C
A
0.2
BE(ON)
0
-V , BASE-EM I
0.001 0.01 0.1 1 10
-I , COLLECTOR CURRENT (A)
C
Fig. 5 Typical Base-Emitter Turn-On Voltage
V = -1V
CE
vs. Collector Current
DCX69/-16/-25
Document number: DS31264 Rev. 6 - 2
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0.8
T = -55°C
A
0.6
T = 25°C
A
T = 85°C
A
0.4
BE(SAT)
-V , BASE-EMI
T = 150°C
A
SATURATION VOLTAGE (V)
I/I = 10
0.2
0
0.001 0.01 0.1 1 10
-I , COLLECTOR CURRENT (A)
C
CB
Fig. 6 Typical Base-Emitter Saturation Voltage
vs. Collector Current
April 2012
© Diodes Incorporated
Page 4
CUR
RENT G
T
H PRODUCT
H
DCX69/-16/-25
60
z)
250
(M
50
f = 1MHz
200
40
150
30
100
20
OBO
10
C , OUTPUT CAPACITANCE (pF)
0
0.01 0.1 1 10 100
Fig. 7 Typical Output Ca pacita nce Charact eristics
V , REVERSE VOLTAGE (V)
R
AIN-BANDWID
V = -5V
50
T
0
f,
CE
f = 100MHz
020406080100
-I , COLLECTOR CURRENT (mA)
Fig. 8 Typical Gain-Bandwidth Product vs. Collector Current
C
Package Outline Dimensions
D1
E
B1
B
8
°
e1
(
4
X
)
D
0
0
2
.
0
R
C
SOT89
Dim Min Max
A 1.40 1.60 B 0.44 0.62
H
L
e
B1 0.35 0.54
C 0.35 0.43 D 4.40 4.60
D1 1.52 1.83
E 2.29 2.60 e 1.50 Typ
e1 3.00 Typ
H 3.94 4.25
A
L 0.89 1.20 All Dimensions in mm
Suggested Pad Layout
Y3
Y
DCX69/-16/-25
Document number: DS31264 Rev. 6 - 2
X (3x)
X1
X2 (2x)
Y2
Dimensions Value (in mm)
X 0.900
X1 1.733
Y1
Y4
X2 0.416
Y 1.300 Y1 4.600 Y2 1.475 Y3 0.950
C
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Y4 1.125
C 1.500
April 2012
© Diodes Incorporated
Page 5
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorize d application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2012, Diodes Incorporated
www.diodes.com
DCX69/-16/-25
DCX69/-16/-25
Document number: DS31264 Rev. 6 - 2
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April 2012
© Diodes Incorporated
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