Diodes DCP69 User Manual

Download

Page 1

Features

• Epitaxial Planar Die Construction

• Complementary NPN Type Available (DCP68)

• Ideally Suited for Automated Assembly Processes

• Ideal for Medium Power Switching or Amplification Applications

• Totally Lead-Free & Fully RoHS compliant (Note 1)

• Halogen and Antimony Free. “Green” Device (Note 2)

• Qualified to AEC-Q101 Standards for High Reliability

SOT223

Top View

Device Schematic

DCP69/-16/-25

20V PNP SURFACE MOUNT TRANSISTOR

Mechanical Data

• Case: SOT223

• Case Material: Molded Plastic, "Green Molding” Compound.

UL Flammability Classification Rating 94V-0

• Moisture Sensitivity: Level 1 per J-STD-020

• Terminals: Finish - Matte Tin

• Solderable per MIL-STD -202, Method 208

• Weight: 0.112 grams (approximate)

Top View

Pin Out Confi

uration

Ordering Information (Note 3)

Part Number

DCP69-13 P12 13 12 2500 DCP69-16-13 P12-16 13 12 2500 DCP69-25-13 P12-25 13 12 2500

Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.

2. Halogen and Antimony free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.

3. For packaging details, go to our website at http://www.diodes.com.

Marking Reel size (inches) Tape width (mm) Quantity per reel

Marking Information

xxx

xxx = Product Type Marking Code P12 = DCP69 P12-16 = DCP69-16 P12-25 = DCP69-25

= Manufacturer’s code marking YWW = Date Code Marking Y = Last digit of year (ex: 1 = 2011) WW = Week code (01 – 53)

DCP69/-16/-25

Document number: DS30798 Rev. 7 - 2

1 of 5

www.diodes.com

April 2012

Page 2

)

Maximum Ratings @T

= 25°C unless otherwise specified

Characteristic Symbol Value Units

Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Collector Current Peak Pulse Current

Thermal Characteristics @T

= 25°C unless otherwise specified

Characteristic Symbol Value Unit Power Dissipation (Note 4) Thermal Resistance, Junction to Ambient Air (Note 4) Power Dissipation (Note 5) Thermal Resistance, Junction to Ambient Air (Note 5) Operating and Storage Temperature Range

DCP69/-16/-25

CBO

CEO

EBO

, T

STG

-25 V

-20 V

-5.0 V

-1.0 A

-2.0 A

1 W

125 °C/W

2 W

62.5 °C/W

-55 to +150 °C

Electrical Characteristics @T

= 25°C unless otherwise specified

Characteristic Symbol Min Typ Max Unit Test Condition

OFF CHARACTERISTICS

Collector-Base Breakdown Voltage Collector-Emitter Breakdown Voltage (Note 6) Emitter-Base Breakdown Voltage

Collector-Base Cutoff Current Emitter-Base Cutoff Current

BV BV BV

CBO

EBO

CBO CEO EBO

-25 — — V

-20 — — V

-5.0 — — V — — — — -100 nA

-100

-10

IC = -100μA, IE = 0 IC = -10mA, IB = 0 IE = -100μA, IC = 0

μA

VEB = -5.0V, IC = 0

= -25V, IE = 0 = -25V, IE = 0, TA = 150°C

ON CHARACTERISTICS (Note 6)

DCP69, DCP69-16, DCP69-25

DC Current Gain

Collector-Emitter Saturation Voltage Base-Emitter Turn-On Voltage

50 60

DCP69 85 — 375

— —

DCP69-16 100 — 250 DCP69-25 160 — 375

CE(sat

BE (on)

— — -0.5 V — —

-0.7

-1.0

—

= -10V, IC = -5.0mA

= -1.0V, IC = -1.0A

= -1.0V, IC = -500mA

IC = -1.0A, IB = -100mA

= -10V, IC = -5.0mA

= -1.0V, IC = -1.0A

SMALL SIGNAL CHARACTERISTICS

Current Gain-Bandwidth Product Output Capacitance

Notes: 4. Device mounted on FR-4 PCB; pad layout as shown on in Diodes Inc. suggested pad layout document, which can be found on our website at

6. Measured under pulsed conditions. Pulse width = 300μS. Duty cycle ≤ 2%.

http://www.diodes.com

5. Device mounted on FR-4 PCB with 1in.

copper pad layout

obo

40 200 — MHz — 17 — pF

VCE = -5.0V, IC = -50mA, f = 100MHz VCB = -10V, f = 1 MHz

DCP69/-16/-25

Document number: DS30798 Rev. 7 - 2

2 of 5

www.diodes.com

April 2012

Page 3

P, P

OWER

CTO

R CUR

REN

C CUR

RENT G

CTO

TER

R T

OLT

TURAT

DCP69/-16/-25

2.0

1.8

1.6

(A)

1.4

I = -10mA

(mW) I

1.2

DISSI

0.8

0.4

1.2

1.0

0.8

LLE

0.6

0.4

-I ,

I = -8mA

I = -6mA

I = -4mA

I = -2mA

0.2

25 50

T , AMBIENT TEMPERATURE (°C)

100 125

Fig. 1 Power Dissipation vs. Ambient Temperature

350

300

T = 150°C

250

AIN

T = 85°C

V = -1V

150

012345678910

-V , COLLECTOR EMITTER VOL TAGE (V)

Fig. 2 Typical Collector Current

vs. Collector-Emitter Voltage

0.6

0.5

-EMI

0.4

I/I = 10

200

0.3

LLE

0.2

SATURATION VOLTAGE (V)

CE(SAT)

-V ,

0.1

T = 150°C

T = 85°C

T = 25°C

T = -55°C

150

100

h, D

T = 25°C

T = -55°C

0.001 0.01 0.1 1 10

-I , COLLECTOR CURRENT (A)

Fig. 3 Typical DC Current Gain

vs. Collecto r Current (DCP69-16)

1.2 E (V) A

1.0

N V

0.8 N-

T = -55°C

0.6

T = 25°C

T = 85°C

0.4

T = 150°C

0.2

BE(ON)

-V , BASE- EMI

0.001 0.01 0.1 1 10

-I , COLLECTOR CURRENT (A)

Fig. 5 Typical Base-Emitter Turn-On Voltage

V = -1V

vs. Collector Current

0.001 0.01 0.1 1 10

-I , COLLECTOR CURRENT (A)

Fig. 4 Typical Collector-Emitter Saturation Voltage

vs. Collector Current

1.2

E (V) A

1.0

L V

0.8

T = -55°C

0.6

T = 25°C

T = 85°C

0.4

T = 150°C

I/I = 10

0.2

0.001 0.01 0.1 1 10

BE(SAT)

-V , BASE-EMI

-I , COLLECTOR CURRENT (A)

Fig. 6 T y pical Base-Emitter Saturation Voltage

vs. Collector Current

DCP69/-16/-25

Document number: DS30798 Rev. 7 - 2

3 of 5

www.diodes.com

April 2012

Page 4

DCP69/-16/-25

f = 1MHz

250

200

150

100

CAPACITANCE (pF)

V = -5V

obo

0.01 0.1 1 10 100

Fig. 7 Typical Output Capacitance Characteristics

V , REVERSE VOLTAGE (V)

f , CURRENT GAIN-BANDWIDTH PRODUCT (MHz)

020406080100

Fig. 8 Typical Gain-Bandwidth Product vs. Collector Current

-I , COLLECTOR CURRENT (mA)

f = 100MHz

Package Outline Dimensions

Suggested Pad Layout

Dim Min Max Typ

SOT223

A 1.55 1.65 1.60 A1 0.010 0.15 0.05 b1 2.90 3.10 3.00 b2 0.60 0.80 0.70

C 0.20 0.30 0.25

D 6.45 6.55 6.50

E 3.45 3.55 3.50 E1 6.90 7.10 7.00

e — — 4.60 e1 — — 2.30

L 0.85 1.05 0.95

Q 0.84 0.94 0.89

All Dimensions in mm

Dimensions Value (in mm)

X1 3.3 X2 1.2 Y1 1.6 Y2 1.6 C1 6.4 C2 2.3

DCP69/-16/-25

Document number: DS30798 Rev. 7 - 2

4 of 5

www.diodes.com

April 2012

Page 5

IMPORTANT NOTICE

DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).

Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages.

Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorize d application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.

Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks.

LIFE SUPPORT

Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:

A. Life support devices or systems are devices or systems which:

1. are intended to implant into the body, or

2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the

labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the

failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and

acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.

www.diodes.com

DCP69/-16/-25

Document number: DS30798 Rev. 7 - 2

5 of 5

www.diodes.com

April 2012