Features
Ultra-Small, Low Profile Leadless Surface Mount Package (0.6 *
0.3 * 0.3mm)
Provides ESD Protection per IEC 61000-4-2 Standard:
Air – ±30kV, Contact – ±30kV
1 Channel of ESD Protection
Low Channel Input Capacitance
Typically Used in Cellular Handsets, Portable Electronics,
Communication Systems, Computers and Peripherals
Lead-Free Finish; RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
NEW PRODUCT
Top View Bottom View
D5V0L1B2LP3
LOW CAPACITANCE BIDIRECTIONAL TVS DIODE
Mechanical Data
Case: X3-DFN0603-2
Case Material: Molded Plastic, “Green” Molding Compound. UL
Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Finish Matte Tin over Copper leadframe,
solderable per MIL-STD-202, Method 208
Weight: 0.0002 grams (approximate)
Device Schematic
e3
Ordering Information (Note 4)
D 5V0 L X B X XXX- XX
Voltage Capacitance # of Channels Polarity # of Pins Package Packing
5V0: 5.0 Volts
D5V0L1B2LP3-7 Standard N 7 8 10,000/Tape & Reel
Notes: 1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
X: Extremely Low (<0.5pF)
F: Ultra Low (0.5 ~ 1.0pF)
P: Very Low (1.1 ~ 10pF)
L: Low (10.1 ~ 20pF)
M: Medium (>20pF)
Product Compliance Marking Reel size (inches) Tape width (mm) Quantity per reel
4. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
1: 1 Channel
2: 2 Channels
4: 4 Channels
6: 6 Channels
B: Bidirectional
(Symmetrical)
U: Unidi rectional
A: Bidirectional
(Asymmetrical)
2: 2 Pins
3: 3 Pins
5: 5 Pins
6: 6 Pins
8: 8 Pins
10: 10 Pins
LP3: X3-DFN0603-2
LP: X1-DFN1006-2
LP4: X2-DFN1006-2
WS: SOD323
T: SOD523/SOT523
SO: SOT23/SOT25
W: SOD123/SOT323
TS: TSOT25/TSOT26
S: SOT353/SOT363
V:SOT553/SOT563
7: 7” reel
7B: 7” reel
13: 13” reel
(DFN1006
Package Only)
Marking Information
D5V0L1B2LP3
Document number: DS35533 Rev. 7 - 2
N = Product Type Marking Code
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© Diodes Incorporated
C
T
O
T
C
PACITANC
Maximum Ratings (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Value Unit Conditions
Peak Pulse Power Dissipation
Peak Pulse Current
ESD Protection – Contact Discharge
ESD Protection – Air Discharge
Thermal Characteristics
Characteristic Symbol Value Unit
Package Power Dissipation (Note 5)
Thermal Resistance, Junction to Ambient (Note 5)
NEW PRODUCT
Operating and Storage Temperature Range
Electrical Characteristics (@T
P
PP
I
PP
V
ESD_Contact
V
ESD_Air
P
R
T
, T
J
= +25°C, unless otherwise specified.)
A
D5V0L1B2LP3
84 W
6 A
±30 kV Standard IEC 61000-4-2
±30 kV Standard IEC 61000-4-2
D
θJA
STG
-65 to +150 °C
8/20s, Per Fig. 1
8/20s, Per Fig. 1
250 mW
500 °C/W
Characteristic Symbol Min Typ Max Unit Test Conditions
Reverse Standoff Voltage
Channel Leakage Current (Note 6)
Clamping Voltage, Positive Transients
Breakdown Voltage
Differential Resistance
Channel Input Capacitance
Notes: 5. Device mounted on FR-4 PCB pad layout (2oz copper) as shown on Diodes, Inc. suggested pad layout AP02001, which can be found on our website at
http://www.diodes.com.
6. Short duration pulse test used to minimize self-heating effect.
V
RWM
I
V
V
R
C
RM
CL
BR
DIF
T
— — 5 V —
—
—
—
—
—
6 7 8 V
—
—
—
10 100 nA
7.0 9.0
8.7 10.7
10.5 12.0
11.5 14.0
V
I
I
V
I
I
IR = 1mA
0.2 — Ω
15 18
12.5 —
pF
IR = 1A, tp = 8/20μS
V
V
= 5V
RWM
= 1A, tp = 8/20μS, Figure 1
PP
= 3A, tp = 8/20μS, Figure 1
PP
= 5A, tp = 8/20μS, Figure 1
PP
= 6A, tp = 8/20μS, Figure 1
PP
= 0V, f = 1MHz
R
= 2.5V, f = 1MHz
R
18
f = 1MHz
100
Peak Value I
17
pp
16
E (pF)
15
Half Value I /2
50
PppP
I , PEAK PULSE CURRENT (%I )
8x20 Waveform
0
0
as defined by R.E.A.
20 40
t, TIME (µs)
Figure 1 Pulse Waveform
D5V0L1B2LP3
Document number: DS35533 Rev. 7 - 2
pp
14
A
13
AL
12
,
T
11
60
10
01 2 3 4 56
V , REVERSE VOLTAGE (V)
R
Figure 2 Typical Total Capacitance vs. Reverse Voltage
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P
P
U
RATIN
G
O
F
GE CUR
R
N
T
C
HAR
GE CUR
REN
T
NEW PRODUCT
D5V0L1B2LP3
100
75
%
50
LSE DE
100
(nA)
E
10
T = 125°C
A
T = -55°C
A
T = 150°C
A
T = 25°C
A
T = 85°C
A
1
EAK
25
PEAK POWER OR CURRENT
0
14
12
0
25 50
T , AMBIENT TEMPERATURE (°C)
A
75 100 125
Figure 3 Pulse Derating Curve
150
175 200
R
I, LEAKA
0.1
0123456
V , REVERSE VOLTAGE (V)
R
Figure 4 Typical Reverse Characteristics
120
Rise time = 0.7ns to 1ns
100
(%)
10
80
8
V(V)
C
6
60
53
4
2
0
01234567
Figure 5 Typical Peak Clamping Voltage V vs.
I (A)
PP
Peak Pulse Current I
C
PP
50
IEC 61000-4-2 Contact Discharge
40
30
20
Positive
10
0
-10
-20
Negative
-30
40
27
ESD
I, DIS
20
0
-10 0 10 20 30 40 50 60 70 80 90 100
TIME (ns)
Figure 6 ESD Discharge Current Wave Form
IEC 6100-4-2 (330 /150pF)
40
35
IEC 61000-4-2 +8kV Contact Discharge
30
25
20
C-ESD
15
V (V)
10
5
0
-40
01020
V (kV)
ESD
30 40
Figure 7 Typical Clamping Voltage vs.
Contact Discharge Voltage
D5V0L1B2LP3
Document number: DS35533 Rev. 7 - 2
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-5
0 20 40 60 80 100 120 140 160 180 200
t (ns)
Figure 8 Typical Clamping Performance
@ 8kV Contact Discharge
© Diodes Incorporated
July 2013
5
IEC 61000-4-2 -8kV Contact Discharge
t (ns)
@ -8kV Contact Discharge
NEW PRODUCT
0
-5
-10
-15
C-ESD
-20
V (V)
-25
-30
-35
-40
0 20 40 60 80 100 120 140 160 180 200
Figure 9 Typical Clamping Performance
Package Outline Dimensions
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
A
Dim Min Max Typ
A 0.27 0.35 0.30
A1 (2x)
D
e
E
L (2x )
b (2x)
A1 0.00 0.03 0.02
b 0.19 0.29 0.24
D 0.595 0.645 0.62
E 0.295 0.345 0.32
e - - 0.355
L 0.14 0.24 0.19
All Dimensions in mm
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for latest version.
Y (2x)
X (2x)
Z
C
Dimensions Value (in mm)
C 0.355
X 0.230
Y 0.300
Z 0.610
D5V0L1B2LP3
X3-DFN0603-2
D5V0L1B2LP3
Document number: DS35533 Rev. 7 - 2
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© Diodes Incorporated
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
NEW PRODUCT
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2013, Diodes Incorporated
www.diodes.com
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
IMPORTANT NOTICE
LIFE SUPPORT
D5V0L1B2LP3
D5V0L1B2LP3
Document number: DS35533 Rev. 7 - 2
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