Diodes CTA2N1P User Manual

NEW PRODUCT
Combines MMBT4401 type transistor with BSS84 type MOSFET
Small Surface Mount Package
PNP/N-Channel Complement Available: CTA2P1N
Lead Free/RoHS Compliant (Note 2)
"Green" Device (Note 3 and 4)

Mechanical Data

Case: SOT-363
Case Material: Molded Plastic. UL Flammability
Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020C
Terminals: Solderable per MIL-STD-202, Method 208
Lead Free Plating (Matte Tin Finish annealed over Alloy 42
leadframe).
Terminal Connections: See Diagram
Marking Information: A03, See Page 6
Ordering Information: See Page 6
Weight: 0.006 grams (approximate)

CTA2N1P

COMPLEX TRANSISTOR ARRAY

A
A03
H
K
J
Q1
CQ1G
E
Q1
D
Q2
B
Q1
SOT-363
Dim Min Max
A 0.10 0.30
C
B
B 1.15 1.35 C 2.00 2.20 D 0.65 Nominal F 0.30 0.40 H 1.80 2.20
M
J
0.10
K 0.90 1.00
L
F
S
Q2
Q2
D
Q2
L 0.25 0.40 M 0.10 0.25 α
All Dimensions in mm
0°
Maximum Ratings, Total Device @T
= 25°C unless otherwise specified
A
Characteristic Symbol Value Unit
Power Dissipation (Note 1) Thermal Resistance, Junction to Ambient (Note 1) Operating and Storage Temperature Range
R
Tj, T
Pd
θ
JA STG
Maximum Ratings, Q1, MMBT4401 NPN Transistor Element @T
150 mW 833
-55 to +150
= 25°C unless otherwise specified
A
Characteristic Symbol Value Unit
Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Collector Current - Continuous
V V V
CBO CEO EBO
IC
Maximum Ratings, Q2, BSS84 P-Channel MOSFET Element @T
60 V 40 V
6.0 V
600 mA
= 25°C unless otherwise specified
A
Characteristic Symbol Value Unit
Drain-Source Voltage Drain-Gate Voltage R
1.0MΩ V
GS
Gate-Source Voltage Continuous Drain Current Continuous
Notes: 1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout
Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
document AP02001, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. No purposefully added lead.
3. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
4. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date
V
V
DSS DGR GSS
ID
-50 V
-50 V
±20 V
-130 mA
DS30295 Rev. 7 - 2 1 of 6
www.diodes.com
°C/W
°C
CTA2N1P
© Diodes Incorporated
NEW PRODUCT
Electrical Characteristics, Q1, MMBT4401 NPN Transistor Element @T
Characteristic Symbol Min Max Unit Test Condition
OFF CHARACTERISTICS (Note 5)
Collector-Base Breakdown Voltage Collector-Emitter Breakdown Voltage Emitter-Base Breakdown Voltage Collector Cutoff Current Base Cutoff Current
ON CHARACTERISTICS (Note 5)
DC Current Gain
Collector-Emitter Saturation Voltage
Base-Emitter Saturation Voltage
SMALL SIGNAL CHARACTERISTICS
Output Capacitance Input Capacitance Input Impedance Voltage Feedback Ratio Small Signal Current Gain Output Admittance
Current Gain-Bandwidth Product
SWITCHING CHARACTERISTICS
Delay Time Rise Time Storage Time Fall Time
V
(BR)CBO
V
(BR)CEO
V
(BR)EBO
I
CEX
IBL
hFE
V
CE(SAT)
V
BE(SAT)
Ccb Ceb
hie
hre
hfe
hoe
fT
td tr ts tf
60 40
6.0
⎯ ⎯
20 40 80
100
40
0.75
0.40
0.75
0.95
⎯ ⎯
1.0 15
0.1 8.0 x 10-4 40 500
1.0 30
250
⎯ ⎯ ⎯ ⎯
⎯ ⎯ ⎯
V V
V 100 nA 100 nA
⎯ ⎯ ⎯
300
V
1.2
V
6.5 pF 30 pF
kΩ
⎯ μS
MHz
15 ns 20 ns
225 ns
30 ns
= 25°C unless otherwise specified
A
IC = 100μA, IE = 0 IC = 1.0mA, IB = 0 IE = 100μA, IC = 0 V
= 35V, V
CE
V
= 35V, V
CE
IC = 100µA, V
EB(OFF) EB(OFF)
= 1.0V
CE
= 0.4V = 0.4V
IC = 1.0mA, VCE = 1.0V IC = 10mA, VCE = 1.0V IC = 150mA, V
CE
= 1.0V
IC = 500mA, VCE = 2.0V IC = 150mA, IB = 15mA
IC = 500mA, IB = 50mA IC = 150mA, IB = 15mA
IC = 500mA, IB = 50mA
VCB = 5.0V, f = 1.0MHz, IE = 0 VEB = 0.5V, f = 1.0MHz, IC = 0
V
= 10V, IC = 1.0mA,
CE
f = 1.0kHz
VCE = 10V, IC = 20mA, f = 100MHz
VCC = 30V, IC = 150mA, V
= 2.0V, IB1 = 15mA
BE(off)
VCC = 30V, IC = 150mA, IB1 = IB2 = 15mA
Electrical Characteristics, Q2, BSS84 P-Channel MOSFET Element @T
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 5)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Body Leakage
BV
I
I
GSS
DSS
DSS
-50
⎯ ⎯ ⎯
⎯ ⎯
-15
-60
-100
±10
V
µA µA
nA nA
ON CHARACTERISTICS (Note 5)
Gate Threshold Voltage Static Drain-Source On-Resistance Forward Transconductance
V
GS(th)
R
DS (ON)
gFS
-0.8
.05
-2.0 V
10
Ω
S
DYNAMIC CHARACTERISTICS
Input Capacitance Output Capacitance Reverse Transfer Capacitance
C
C
oss
C
iss
⎯ ⎯
rss
45 pF 25 pF 12 pF
SWITCHING CHARACTERISTICS
Turn-On Delay Time Turn-Off Delay Time
Notes: 5. Short duration pulse test used to minimize self-heating effect.
t
D(ON)
t
D(OFF)
⎯ ⎯
10 18
⎯ ⎯
ns ns
DS30295 Rev. 7 - 2 2 of 6
www.diodes.com
= 25°C unless otherwise specified
A
VGS = 0V, ID = -250µA V
= -50V, VGS = 0V, TJ = 25°C
DS
V
= -50V, VGS = 0V, TJ = 125°C
DS
V
= -25V, VGS = 0V, TJ = 25°C
DS
VGS = ±20V, V
DS
= 0V
VDS = VGS, ID = -1mA VGS = -5V, ID = 0.100A V
= -25V, ID = 0.1A
DS
VDS = -25V, V
GS
= 0V
f = 1.0MHz
V
= -30V, ID = -0.27A,
DD
R
= 50Ω, V
GEN
GS
= -10V
CTA2N1P
© Diodes Incorporated
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