Self-protected low side MOSFET. Monolithic over temperature, over
current, over voltage (active clamp) and ESD protected logic level
power MOSFET intended as a general purpose switch.
Features
•Short circuit protection with auto restart
•Over-voltage protection (active clamp)
•Thermal shutdown with auto restart
•Over-current protection
•Input protection (ESD)
•High continuous current rating
Note:
The tab is connected to the drain pin, and must
be electrically isolated from the source pin.
Connection of significant copper to the tab is
recommended for best thermal performance.
•Especially suited for loads with a high in-rush current such as lamps and motors.
•All types of resistive, inductive and capacitive loads in switching applications.
•
C compatible power switch for 12V and 24V DC applications.
•Automotive rated.
•Replaces electromechanical relays and discrete circuits.
•Linear mode capability - the current-limiting protection circuitry is designed to de-activate at
low Vds, in order not to compromise the load current during normal operation. The design
maximum DC operating current is therefore determined by the thermal capability of the
package/board combination, rather than by the protection circuitry.
Drain-source voltage for short circuit protectionV
DS(SC)
Continuous input voltageV
Peak input voltageV
Operating temperature rangeT
Storage temperature rangeT
Power dissipation at T
=25°C
A
Continuous drain current @ V
Continuous drain current @ V
Pulsed drain current @ V
Continuous source current (body diode)
(a)
=10V; TA=25°C
IN
=5V; TA=25°C
IN
=10VI
IN
(a)
(a)
(a)
Pulsed source current (body diode)I
Unclamped single pulse inductive energyE
Load dump protectionV
LoadDump
Electrostatic discharge (human body model)V
DS
60V
36V
IN
IN
,-40 to +150°C
j
stg
P
D
I
D
I
D
DM
I
S
S
AS
-0.2 ... +10V
-0.2 ... +20V
-55 to +150°C
2.5W
1.6A
1.4A
5A
3A
5A
550mJ
80V
ESD
4000V
DIN humidity category, DIN 40 040E
IEC climatic category, DIN IEC 68-140/150/56
Thermal resistance
ParameterSymbolLimitUnit
Junction to ambient
Junction to ambient
Junction to ambient
NOTES:
(a) For a device surface mounted on 37mm x 37mm x 1.6mm FR4 board with a high coverage of single sided 2oz weight
copper.
(b) For a device surface mounted on FR4 board and measured at t<=10s.
(c) For a device mounted on FR4 board with the minimum copper required for electrical connections.
(*) Protection features may operate outside spec for V
(†) The drain current is limited to a reduced value when V
(‡) Integrated protection functions are designed to prevent IC destruction under fault conditions described in the
datasheet. Fault conditions are considered as "outside" normal operating range. Protection functions are not designed
for continuous, repetitive operation.
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