Diodes BC857BLP User Manual

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Features

• Epitaxial Die Construction

• Complementary NPN Type Available (BC847BLP)

• Ultra-Small Leadless Surface Mount Package

• “Lead Free”, RoHS Compliant (Note 1)

• Halogen and Antimony Free "Green" Device (Note 2)

• Qualified to AEC-Q101 Standards for High Reliability

DFN1006-3

Bottom View Device S

BC857BLP

50V PNP SMALL SIGNAL SURFACE MOUNT TRANSISTOR

Mechanical Data

• Case: DFN1006-3

• Case Material: Molded Plastic, "Green" Molding Compound. UL

Flammability Classification Rating 94V-0

• Moisture Sensitivity: Level 1 per J-STD-020

• Terminals: Finish ⎯ NiPdAu over Copper leadframe. Solderable

per MIL-STD-202, Method 208

• Weight: 0.0009 grams

mbol

Top View

Pin-Out

Ordering Information (Note 3)

Product Marking Reel size (inches) Tape width (mm) Quantity per reel

BC857BLP-7 3W 7 8mm 3,000

BC857BLP-7B 3W 7 8mm 10,000

Notes: 1. No purposefully added lead.

2. Halogen and Antimony Free. Diodes Inc's "Green" policy can be found on our website at http://www.diodes.com.

3. For packaging details, go to our website at http://www.diodes.com.

Marking Information

BC857BLP

Document number: DS30526 Rev. 10 - 2

BC857BLP-7 BC857BLP-7B

3W3W

Top View

Dot Denotes

Collector Side

Top View

Bar Denotes Base

and Emitter Side

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3W = Product Type Marking Code

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P, P

Maximum Ratings @T

= 25°C unless otherwise specified

Characteristic Symbol Value Unit

Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Collector Current

CBO

CEO

EBO

-50 V

-45 V

-5.0 V

-100 mA

Thermal Characteristics

Characteristic Symbol Value Unit

Power Dissipation (Note 4) @TA = 25°C PD Thermal Resistance, Junction to Ambient Air (Note 4) @TA = 25°C Operating and Storage Temperature Range

TJ, T

STG

Electrical Characteristics @T

= 25°C unless otherwise specified

Characteristic (Note 5) Symbol Min Typ Max Unit Test Condition Collector-Base Breakdown Voltage Collector-Emitter Breakdown Voltage Emitter-Base Breakdown Voltage DC Current Gain

Collector-Emitter Saturation Voltage

Base-Emitter Saturation Voltage

Base-Emitter Voltage

Collector-Cutoff Current

Gain Bandwidth Product Collector-Base Capacitance

Notes: 4. Device mounted on FR-4 PCB, Diodes Inc. suggested pad layout document can be found on our website at http://www.diodes.com.

5. Short duration pulse test used to minimize self-heating effect.

CBO

CEO

EBO

hFE

CE(sat)

BE(sat)

BE(on)

CBO

-50 — — V

-45 — — V

-5 — — V

220 260 475 —

— —

—

-600 — -670

— —

-90

-250

-700

-850 — —

-710 —

—

100 — — MHz

— 3.0 — pF

300

250 mW 500

-55 to +150

IC = 10μA, IB = 0 IC = 10mA, IB = 0 IE = 1μA, IC = 0 VCE = -5.0V, IC = -2.0mA

-300

-650

-750

-820

-15

-4.0

IC = -10mA, IB = -0.5mA

IC = -100mA, IB = -5.0mA IC = -10mA, IB = -0.5mA

IC = -100mA, IB = -5.0mA VCE = -5.0V, IC = -2.0mA

VCE = -5.0V, IC = -10mA VCB = -30V

nA µA

VCB = -30V, TA = 150°C VCE = -5.0V, IC = -10mA,

f = 100MHz VCB = -10V, f = 1.0MHz

BC857BLP

°C/W

°C

250

N (mW)

200

I A

150

DISSI

100

R = 500 C/W

h , DC CURRENT GAIN

0 255075100125150

T , AMBIENT TEMPERATURE (°C)

Fig. 1 Power Dissipation

vs. Ambient Temperature (Note 4)

Fig. 2

I , COLLECTOR CURRENT (mA)

Typical DC Current Gain vs. Collector Current

BC857BLP

Document number: DS30526 Rev. 10 - 2

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CTO

TER

BC857BLP

350

300

250

-EMI

T = -55ºC

T = 25ºC

T = 85ºC

200

LLE

150

T = 125ºC

T = 150ºC

100

SATURATION VOLTAGE (mV)

(CE)SAT

V = 5V

I , COLLECTOR CURRENT (mA)

Fig. 3 Typical Collector-Emitter Saturation

Vol tage vs. Collector Current

100

BE(ON)

V , BASE-EMITTER TURN-ON VOLT AGE (mV)

I , COLLECTOR CURRENT (mA)

Fig. 4

Ty pi cal Base-E m i tter Turn- O n Vo ltage

vs. Collector Current

1100

(BE)SAT

V , BASE-EMITTER SATURATION VOLTAGE (V)

I , COLLECTOR CURRENT (mA)

Typical Base-Emitter Saturation Voltage

Fig. 5

vs. Collector Current

Package Outline Dimensions

BC857BLP

Document number: DS30526 Rev. 10 - 2

DFN1006-3

Dim Min Max Typ

A 0.47 0.53 0.50 A1 0 0.05 0.03 b1 0.10 0.20 0.15 b2 0.45 0.55 0.50

D 0.95 1.075 1.00

E 0.55 0.675 0.60

⎯ ⎯

0.35

L1 0.20 0.30 0.25 L2 0.20 0.30 0.25 L3

⎯ ⎯

0.40

All Dimensions in mm

L1L3

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BC857BLP

Suggested Pad Layout

DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).

Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages.

Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorize d application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.

Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks.

Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:

A. Life support devices or systems are devices or systems which:

1. are intended to implant into the body, or

2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the

labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the

failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and

acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.

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Dimensions Value (in mm)

Z 1.1 G1 0.3 G2 0.2

X 0.7 X1 0.25

IMPORTANT NOTICE

LIFE SUPPORT

Y 0.4

C 0.7

BC857BLP

Document number: DS30526 Rev. 10 - 2

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February 2011