V
ternal Schematic
Features
• Fast Switching Speed
• Ultra-Small Surface Mount Package
• For General Purpose Switching Applications
• Two “BAV70” Circuits In One Package
• Lead Free/RoHS Compliant (Note 1)
• "Green" Device (Note 2)
ADVANCE INFORMATION
Top View
SOT563
Bottom View
BAV70D
SURFACE MOUNT SWITCHING DIODE ARRAY
Mechanical Data
• Case: SOT563
• Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020
• Terminals: Matte Tin Finish annealed over Copper Alloy
leadframe (Lead Free Plating). Solderable per MIL-STD-202,
Method 208
• Orientation: See Diagram
• Weight: 0.003 grams (approximate)
C
A1 A
In
1
Top View
A
A
2
2
C
2
1
Ordering Information (Note 3)
Part Number Case Packaging
BAV70DV-7 SOT563 3000/Tape & Reel
Notes: 1. No purposefully added lead.
2. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com.
3. For packaging details, go to our website at http://www.diodes.com.
Marking Information
Date Code Key
Year 2011 2012 2013 2014 2015 2016 2017
Code Y Z A B C D E
Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec
Code 1 2 3 4 5 6 7 8 9 O N D
BXA
YM
BXA = Product Type Marking Code
YM = Date Code Marking
Y = Year (ex: Y = 2011)
M = Month (ex: 9 = September)
BAV70DV
Document number: DS35311 Rev. 4 - 2
1 of 4
www.diodes.com
January 2012
© Diodes Incorporated
V
)
θ
(BR)
P
P
OWER
PAT
O
T
T
O
U
O
RWAR
C
U
R
R
T
Maximum Ratings @T
= 25°C unless otherwise specified
A
Characteristic Symbol Value Unit
Non-Repetitive Peak Reverse Voltage
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Forward Continuous Current (Note 4)
Average Rectified Output Current (Note 4)
Non-Repetitive Peak Forward Surge Current @ t = 1.0μs
@ t = 1.0s
Thermal Characteristics
Characteristic Symbol Value Unit
Power Dissipation (Note 4)
Thermal Resistance Junction to Ambient Air (Note 4)
Operating and Storage Temperature Range
V
T
V
RM
V
RRM
V
RWM
V
R(RMS
I
FM
I
O
I
FSM
P
R
, T
J
R
D
JA
STG
BAV70D
100 V
75 V
53 V
300 mA
150 mA
2.0
1.0
A
200 mW
625 °C/W
-65 to +150
°C
Electrical Characteristics @T
ADVANCE INFORMATION
= 25°C unless otherwise specified
A
Characteristic Symbol Min Max Unit Test Condition
Reverse Breakdown Voltage (Note 5)
Forward Voltage
Reverse Current (Note 5)
Total Capacitance
Reverse Recovery Time
Notes: 4. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which can
be found on our website at http://www.diodes.com.
5. Short duration pulse test used to minimize self-heating effect.
V
V
⎯
F
I
⎯
R
C
⎯
T
t
⎯
rr
250
75
R
⎯
0.715
0.855
1.0
1.25
2.5
50
30
25
2.0 pF
4.0 ns
V
IF = 2.5μA
= 1.0mA
I
F
= 10mA
I
F
V
I
= 50mA
F
= 150mA
I
F
V
μA
μA
μA
nA
R
V
R
V
R
V
R
VR = 0, f = 1.0MHz
= IR = 10mA,
I
F
I
rr
= 75V
= 75V, TJ = 150°C
= 25V, TJ = 150°C
= 20V
= 0.1 x IR, RL = 100Ω
1,000
(mA)
200
Note 4
EN
100
N (mW)
I
150
D
10
DISSI
S F
100
,
D
50
0
0125175
25 10050 75 150
T , AMBIENT TEMPERATURE ( C)
A
°
Fig. 1 Power Derating Curve, Total Package
1
ANE
0.1
AN
0.01
F
I , INS
0 0.2 0.4 0.6 0.8 1.0 1.2
V , INSTANTANEOUS FORWARD VOLTAGE (V)
F
Fig. 2 Typical Forward Characteristics, Per Element
BAV70DV
Document number: DS35311 Rev. 4 - 2
2 of 4
www.diodes.com
January 2012
© Diodes Incorporated
V
TANT
O
US R
R
C
U
R
RENT
C, TOT
CAPACITAN
C
(µA)
SE
EVE
ANE
0.001
R
I, INS
0.0001
100
10
1
0.1
0.01
020406080100
V , INSTANTANEOUS REVERSE VOLT AGE (V)
R
Fig. 3 Typical Reverse Characteristics, Per Element
Package Outline Dimensions
ADVANCE INFORMATION
K
Suggested Pad Layout
G
Z
Y
BAV70D
1.60
1.50
E (pF)
1.40
AL
1.30
T
1.20
110100
Fig. 4 T otal Capacitance vs. Reverse Voltage, Per Element
A
B
C
D
G
M
H
C2
X
C2
L
Dimensions Value (in mm)
Z 2.2
C1
G 1.2
X 0.375
Y 0.5
C1 1.7
C2 0.5
V , DC REVERSE VOLT AGE (V)
R
Dim Min Max Typ
SOT563
A 0.15 0.30 0.20
B 1.10 1.25 1.20
C 1.55 1.70 1.60
D - - 0.50
G 0.90 1.10 1.00
H 1.50 1.70 1.60
K 0.55 0.60 0.60
L 0.10 0.30 0.20
M 0.10 0.18 0.11
All Dimensions in mm
BAV70DV
Document number: DS35311 Rev. 4 - 2
3 of 4
www.diodes.com
January 2012
© Diodes Incorporated
V
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorize d application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
ADVANCE INFORMATION
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2012, Diodes Incorporated
www.diodes.com
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
IMPORTANT NOTICE
LIFE SUPPORT
BAV70D
BAV70DV
Document number: DS35311 Rev. 4 - 2
4 of 4
www.diodes.com
January 2012
© Diodes Incorporated
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