Features
• Ultra-Small Surface Mount Package
• Low Forward Voltage Drop
• Fast Switching
• PN Junction Guard Ring for Transient and ESD Protection
• Lead Free/RoHS Compliant (Note 1)
• "Green" Device (Note 2 and 3)
• Qualified to AEC-Q101 Standards for High Reliability
Top View BAT54T BAT54AT BAT54CT BAT54ST
BAT54T /AT /CT /ST
SURFACE MOUNT SCHOTTKY BARRIER DIODE
Mechanical Data
• Case: SOT-523
• Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020
• Terminals: Finish - Solderable per MIL-STD-202, Method 208
• Lead Free Plating (Matte Tin Finish annealed over Alloy 42
leadframe).
• Polarity: See Diagrams Below
• Weight: 0.002 grams (approximate)
Ordering Information (Note 4)
Part Number Case Packaging
BAT54T-7-F SOT-523 3000/Tape & Reel
BAT54AT-7-F SOT-523 3000/Tape & Reel
BAT54CT-7-F SOT-523 3000/Tape & Reel
BAT54ST-7-F SOT-523 3000/Tape & Reel
Notes: 1. No purposefully added lead.
Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
4. For packaging details, go to our website at http://www.diodes.com.
2. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com.
3. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date
Marking Information
Date Code Key
Year 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015
Code N P R S T U V W X Y Z A B C
Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec
Code 1 2 3 4 5 6 7 8 9 O N D
xx
YM
BAT54T /AT /CT /ST
Document number: DS30259 Rev. 11 - 2
xx = Product Type Marking Code
L1 = BAT54T
L2 = BAT54AT
L3 = BAT54CT
L4 = BAT54ST
YM = Date Code Marking
Y = Year (ex: N = 2002)
M = Month (ex: 9 = September)
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© Diodes Incorporated
θ
(BR)
N
TAN
T
N
O
US F
O
RWARD C
URREN
T
Maximum Ratings @T
= 25°C unless otherwise specified
A
Characteristic Symbol Value Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
Forward Continuous Current (Note 5)
Repetitive Peak Forward Current
Forward Surge Current @ t < 1.0s
V
V
I
I
RRM
RWM
VR
I
FM
FRM
FSM
Thermal Characteristics
Characteristic Symbol Value Unit
Power Dissipation (Note 5)
Thermal Resistance, Junction to Ambient (Note 5)
Operating and Storage Temperature Range
Electrical Characteristics @T
= 25°C unless otherwise specified
A
Characteristic Symbol Min Typ Max Unit Test Condition
Reverse Breakdown Voltage (Note 6)
Forward Voltage
Reverse Leakage Current (Note 6)
Total Capacitance
Reverse Recovery Time
Notes: 5. Device mounted on FR-4 PC board with recommended pad layout, which can be found on our website at
http://www.diodes.com/datasheets/ap02001.pdf.
6. Short duration pulse test used to minimize self-heating effect.
V
V
F
I
⎯ ⎯
R
C
⎯ ⎯
T
t
rr
1
(A)
T
R
P
D
R
JA
, T
J
STG
30
⎯ ⎯
⎯ ⎯
100
-65 to +125
⎯ ⎯
240
320
400
500
1000
2.0
10 pF
5.0 ns
BAT54T /AT /CT /ST
30 V
200 mA
300 mA
600 mA
150 mW
833
V
IR = 100μA
I
= 0.1mA
F
= 1mA
I
F
mV
I
= 10mA
F
= 30mA
I
F
I
= 100mA
F
μA
V
R
= 25V
VR = 1.0V, f = 1.0MHz
= 10mA through IR = 10mA
I
F
= 1.0mA, RL = 100Ω
to I
R
°C/W
°C
0.1
10
1
0.01
0.1
E
A
0.001
0.01
S
F
I, I
0.0001
0
0.2
V , INSTANTANEOUS FORWARD VOLTAGE (V)
F
0.6
0.8
Fig. 1 Typical Forwar d C haracter istics
1.00.4
0.001
5101520
0
V , INSTANTANEOUS REVERSE VOLTAGE (V)
R
Fig. 2 Typical Reverse Characteristics
25
30
BAT54T /AT /CT /ST
Document number: DS30259 Rev. 11 - 2
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C, TOT
CAP
C
TAN
C
F
P, P
OWER
PATIO
12
10
)
E (p
8
I
A
6
AL
4
T
2
0
0
Fig. 3 T otal Capacitance vs. Reverse Voltage
10 15
5
V , DC REVERSE VOLTAGE (V)
R
20
25
30
200
N (mW)
DISSI
100
D
0
0255075100125
T , AMBIENT TEMPERATURE ( C)
A
Fig. 4 Power Derating Curve
BAT54T /AT /CT /ST
°
Package Outline Dimensions
K
J
A
Dim Min Max Typ
C
B
G
H
N
D
L
M
SOT-523
A 0.15 0.30 0.22
B 0.75 0.85 0.80
C 1.45 1.75 1.60
D
⎯ ⎯
G 0.90 1.10 1.00
H 1.50 1.70 1.60
J 0.00 0.10 0.05
K 0.60 0.80 0.75
L 0.10 0.30 0.22
M 0.10 0.20 0.12
N 0.45 0.65 0.50
0° 8°
α
All Dimensions in mm
0.50
⎯
Suggested Pad Layout
BAT54T /AT /CT /ST
Document number: DS30259 Rev. 11 - 2
Y
Z
X E
C
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Dimensions Value (in mm)
Z 1.8
X 0.4
Y 0.51
C 1.3
E 0.7
October 2010
© Diodes Incorporated
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorize d application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2010, Diodes Incorporated
www.diodes.com
BAT54T /AT /CT /ST
BAT54T /AT /CT /ST
Document number: DS30259 Rev. 11 - 2
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