Diodes BAS16VV User Manual

SURFACE MOUNT SWITCHING DIODE ARRAY
Features
Fast Switching Speed
Low Forward Voltage: Maximum of 0.715V at 1mA
Fast Reverse Recovery: Maximum of 4ns
Low Capacitance: Maximum of 1.5pF
Low Leakage Current
Ultra-Small Surface Mount Package
Thermally Efficient Copper Alloy leadframe for High Power
Dissipation
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Top View
SOT563
Bottom View
Mechanical Data
Case: SOT563
Case Material: Molded Plastic, “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Matte Tin Finish annealed over Copper Alloy
leadframe (Lead Free Plating). Solderable per MIL-STD-202, Method 208
Weight: 0.003 grams (approximate)
Top View
BAS16V
Ordering Information (Note 4)
Part Number Case Packaging
BAS16V V-7 SOT563 3000/Tape & Reel
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.
4. For Packaging Details, go to our website at http://www.diodes.com.
Marking Information
Date Code Key
Year 2012 2013 2014 2015 2016 2017 2018
Code Z A B C D E F
Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec
Code 1 2 3 4 5 6 7 8 9 O N D
KJP
YM
BAS16VV
Document number: DS35791 Rev. 3 - 2
KJP = Product Type Marking Code YM = Date Code Marking Y = Year (ex: Z = 2012) M = Month (ex: 9 = September)
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)
μ
θ
(BR)
P, P
O
R
P
TIO
N
N
T
N
T
NEO
U
F
O
RWARD C
URR
N
T
Maximum Ratings (@T
= 25°C unless otherwise specified.)
A
Characteristic Symbol Value Unit
Non-Repetitive Peak Reverse Voltage Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage DC Blocking Voltage
RMS Reverse Voltage Forward Continuous Current (Note 5)
Non-Repetitive Peak Forward Surge Current
@ t = 1.0 @ t = 1.0ms
s
V
V
V
R(RMS
V
RRM RWM
V
I
I
FSM
FM
RM
R
@ t = 1.0s
Thermal Characteristics
Characteristic Symbol Value Unit
Power Dissipation (Note 5) Thermal Resistance Junction to Ambient Air (Note 5) Operating and Storage Temperature Range
Electrical Characteristics (@T
= 25°C unless otherwise specified.)
A
Characteristic Symbol Min Max Unit Test Condition
Reverse Breakdown Voltage (Note 6)
Forward Voltage
Leakage Current (Note 6)
Total Capacitance Reverse Recovery Time
Notes: 5. Device mounted on FR-4 PCB, on minimum recommended, 2oz copper pad layout.
6. Short duration pulse test used to minimize self-heating effect.
350
300
Note 5
T
V
R
V
F
I
R
C
T
t
rr
P
D
R
JA
, T
J
STG
(A) E
100
-55 to +150
0.715
0.855
1.0
1.25
0.5 50 30 30 nA
1.5 pF
4.0 ns
1
BAS16V
100 V
100 V
71 V
200 mA
4.0
1.0
0.5
350 mW 357
V
IR = 100μA
= 1.0mA
I
F
IF = 10mA
V
IF = 50mA IF = 150mA
μA μA μA
= 80V
V
R
= 80V, TJ = 150°C
V
R
= 25V, TJ = 150°C
V
R
VR = 25V VR = 0, f = 1.0MHz
= IR = 10mA,
I
F
= 0.1 x IR, RL = 100Ω
I
rr
A
°C/W
°C
250
(mW)
0.1
A
200
DISSI WE
D
150
100
50
R = 357°C/W
JA
θ
0
250 50 75 100 125 150
T , AMBIENT TEMPERATURE ( C)
A
Fig. 1 Power Derating Curve, Total Package
°
S
0.01
A A
S
F
I, I
0.001
0 0.4 0.8 1.2 1.6
V , INSTANTA NEOU S FORWARD VOLTAGE ( V)
F
Fig. 2 Typical For ward Char acteristics , Per E lement
BAS16VV
Document number: DS35791 Rev. 3 - 2
2 of 4
www.diodes.com
June 2012
© Diodes Incorporated
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