Page 1
A
Features
• Fast Switching Speed
• Ultra-Small Leadless Surface Mount Package
• For General Purpose Switching Applications
• Lead Free By Design/RoHS Compliant (Note 1)
• "Green" Device (Note 2)
• Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
• Case: X1-DFN1006-2
• Case Material: Molded Plastic, "Green" Molding Compound.
• Moisture Sensitivity: Level 1 per J-STD-020
• Terminal Connections: See Marking Information
• Terminals: Finish - NiPdAu over Copper leadframe. Solderable
• Weight: 0.0009 grams (approximate)
X1-DFN1006-2
Bottom View
SURFACE MOUNT SWITCHING DIODE
UL Flammability Classification Rating 94V-0
per MIL-STD-202, Method 208
BAS16LP
Ordering Information (Note 3)
Part Number Case Packaging
BAS16LP-7 X1-DFN1006-2 3,000/Tape & Reel
BAS16LP-7B X1-DFN1006-2 10,000/Tape & Reel
Notes: 1. No purposefully added lead.
2. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com.
3. For packaging details, go to our website at http://www.diodes.com.
Marking Information
BAS16LP
Document number: DS30505 Rev. 12 - 2
BAS16LP-7 BAS16LP-7B
A6A6
Top View
Dot Denotes
Cathode Side
Top View
Bar Denotes
Cathode Side
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1 of 4
6 = Product Type Marking Code
April 2011
© Diodes Incorporated
Page 2
)
θ
(BR)
P, P
O
R
PATIO
N
T
T
O
US F
O
R
R
CUR
RENT
Maximum Ratings @T
= 25°C unless otherwise specified
A
Characteristic Symbol Value Unit
Non-Repetitive Peak Reverse Voltage
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Forward Continuous Current
Average Rectified Output Current
Non-Repetitive Peak Forward Surge Current @ t = 1.0μs
@ t = 1.0s
Thermal Characteristics
Characteristic Symbol Value Unit
Power Dissipation (Note 4)
Thermal Resistance Junction to Ambient Air (Note 4)
Operating and Storage Temperature Range
V
T
V
RM
V
RRM
V
RWM
V
R
R(RMS
I
FM
I
O
I
FSM
P
D
R
JA
, T
J
STG
BAS16LP
100 V
75 V
53 V
300 mA
200 mA
2.0
1.0
A
250 mW
500
°C/W
-65 to +150 °C
Electrical Characteristics @T
= 25°C unless otherwise specified
A
Characteristic Symbol Min Max Unit Test Condition
Reverse Breakdown Voltage (Note 5)
Forward Voltage
Leakage Current (Note 5)
Total Capacitance
Reverse Recovery Time
Notes: 4. Part mounted on FR-4 PC board with recommended pad layout, which can be found on our website at http://www.diodes.com.
5. Short duration pulse test used to minimize self-heating effect.
V
V
⎯
F
I
⎯
R
C
⎯
T
t
⎯
rr
75
R
⎯
0.715
0.855
1.0
1.25
1.0
50
30
25
2.0 pF
4.0 ns
V
IR = 100μA
I
F
I
F
V
I
F
I
F
V
μA
μA
μA
nA
R
V
R
V
R
V
R
VR = 0, f = 1.0MHz
= IR = 10mA,
I
F
I
rr
= 1.0mA
= 10mA
= 50mA
= 150mA
= 75V
= 75V, TJ = 150°C
= 25V, TJ = 150°C
= 20V
= 0.1 x IR, RL = 100Ω
300
250
(mA)
(mW)
200
D
150
WA
DISSI
WE
100
D
50
0
0 25 50 75 100 125 150
T , AMBIENT TEMPERATURE (°C)
A
Fig. 1 Power Derating Curve
ANE
AN
F
I , INS
0
V , INSTANTANEOUS FORWARD VOLTAGE (V)
F
Fig. 2 Typical Forward Characteristics
1.5
BAS16LP
Document number: DS30505 Rev. 12 - 2
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April 2011
© Diodes Incorporated
Page 3
μ
0.001
R
I , INSTANTANEOUS REVERSE CURRENT ( A)
0.0001
100
10
1
0.1
0.01
20
10
0
V , INSTANTANEOUS REVERSE VOLTAGE (V)
R
Fig. 3 Typical Reverse Characteristics
30 40
50
60
70
1.0
0.8
0.6
0.4
T
C , TOTAL CAPACITANCE (pF)
0.2
0
0 4 81216202428323640
V , REVERSE VOLT AGE (V)
R
Fig. 4 Typical Total Capacitance
Package Outline Dimensions
A
X1-DFN1006-2
A1
D
E
L
R
e
b
Dim Min Max Typ
A 0.47 0.53 0.50
A1 0 0.05 0.03
b 0.45 0.55 0.50
D 0.95 1.075 1.00
E 0.55 0.675 0.60
e - - 0.40
L 0.20 0.30 0.25
R 0.05 0.15 0.10
All Dimensions in mm
Suggested Pad Layout
X
Y
BAS16LP
Document number: DS30505 Rev. 12 - 2
C
Dimensions Value (in mm)
Z 1.1
G 0.3
X 0.7
Y 0.4
G
Z
3 of 4
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C 0.7
BAS16LP
f = 1MHz
April 2011
© Diodes Incorporated
Page 4
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorize d application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2011, Diodes Incorporated
www.diodes.com
BAS16LP
BAS16LP
Document number: DS30505 Rev. 12 - 2
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April 2011
© Diodes Incorporated
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