Diodes BAS16LP User Manual
A
Features
• Fast Switching Speed
• Ultra-Small Leadless Surface Mount Package
• For General Purpose Switching Applications
• Lead Free By Design/RoHS Compliant (Note 1)
• "Green" Device (Note 2)
• Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
• Case: X1-DFN1006-2
• Case Material: Molded Plastic, "Green" Molding Compound.
• Moisture Sensitivity: Level 1 per J-STD-020
• Terminal Connections: See Marking Information
• Terminals: Finish - NiPdAu over Copper leadframe. Solderable
• Weight: 0.0009 grams (approximate)
X1-DFN1006-2
Bottom View
SURFACE MOUNT SWITCHING DIODE
UL Flammability Classification Rating 94V-0
per MIL-STD-202, Method 208
BAS16LP
Ordering Information (Note 3)
Part Number Case Packaging
BAS16LP-7 X1-DFN1006-2 3,000/Tape & Reel
BAS16LP-7B X1-DFN1006-2 10,000/Tape & Reel
Notes: 1. No purposefully added lead.
2. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com.
3. For packaging details, go to our website at http://www.diodes.com.
Marking Information
BAS16LP
Document number: DS30505 Rev. 12 - 2
BAS16LP-7 BAS16LP-7B
A6A6
Top View
Dot Denotes
Cathode Side
Top View
Bar Denotes
Cathode Side
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6 = Product Type Marking Code
April 2011
© Diodes Incorporated
)
θ
(BR)
P, P
O
R
PATIO
N
T
T
O
US F
O
R
R
CUR
RENT
Maximum Ratings @T
= 25°C unless otherwise specified
A
Characteristic Symbol Value Unit
Non-Repetitive Peak Reverse Voltage
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Forward Continuous Current
Average Rectified Output Current
Non-Repetitive Peak Forward Surge Current @ t = 1.0μs
@ t = 1.0s
Thermal Characteristics
Characteristic Symbol Value Unit
Power Dissipation (Note 4)
Thermal Resistance Junction to Ambient Air (Note 4)
Operating and Storage Temperature Range
V
T
V
RM
V
RRM
V
RWM
V
R
R(RMS
I
FM
I
O
I
FSM
P
D
R
JA
, T
J
STG
BAS16LP
100 V
75 V
53 V
300 mA
200 mA
2.0
1.0
A
250 mW
500
°C/W
-65 to +150 °C
Electrical Characteristics @T
= 25°C unless otherwise specified
A
Characteristic Symbol Min Max Unit Test Condition
Reverse Breakdown Voltage (Note 5)
Forward Voltage
Leakage Current (Note 5)
Total Capacitance
Reverse Recovery Time
Notes: 4. Part mounted on FR-4 PC board with recommended pad layout, which can be found on our website at http://www.diodes.com.
5. Short duration pulse test used to minimize self-heating effect.
V
V
⎯
F
I
⎯
R
C
⎯
T
t
⎯
rr
75
R
⎯
0.715
0.855
1.0
1.25
1.0
50
30
25
2.0 pF
4.0 ns
V
IR = 100μA
I
F
I
F
V
I
F
I
F
V
μA
μA
μA
nA
R
V
R
V
R
V
R
VR = 0, f = 1.0MHz
= IR = 10mA,
I
F
I
rr
= 1.0mA
= 10mA
= 50mA
= 150mA
= 75V
= 75V, TJ = 150°C
= 25V, TJ = 150°C
= 20V
= 0.1 x IR, RL = 100Ω
300
250
(mA)
(mW)
200
D
150
WA
DISSI
WE
100
D
50
0
0 25 50 75 100 125 150
T , AMBIENT TEMPERATURE (°C)
A
Fig. 1 Power Derating Curve
ANE
AN
F
I , INS
0
V , INSTANTANEOUS FORWARD VOLTAGE (V)
F
Fig. 2 Typical Forward Characteristics
1.5
BAS16LP
Document number: DS30505 Rev. 12 - 2
2 of 4
www.diodes.com
April 2011
© Diodes Incorporated
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