Page 1
Features
• Surface Mount Package Ideally Suited for Automated Insertion
• Very Low Leakage Current
• Lead Halogen and Antimony Free, RoHS Compliant
"Green" Device (Notes 1 and 2)
• Qualified to AEC-Q101 Standards for High Reliability
SOT23
Top View
BAS116
SURFACE MOUNT LOW LEAKAGE DIODE
Mechanical Data
• Case: SOT23
• Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020
• Terminals: Matte Tin Finish annealed over Alloy 42 leadframe
(Lead Free Plating). Solderable per MIL-STD-202, Method 208
• Polarity: See Diagram
• Weight: 0.008 grams (approximate)
Top View
Internal Schematic
Ordering Information (Note 3)
Part Number Qualification Case Packaging
BAS116-7-F Commercial SOT23 3,000/Tape & Reel
BAS116-13-F Commercial SOT23 10,000/Tape & Reel
BAS116Q-7-F Automotive SOT23 3,000/Tape & Reel
BAS116Q-13-F Automotive SOT23 10,000/Tape & Reel
Notes: 1. No purposefully added lead. Halogen and Antimony Free.
3. For packaging details, go to our website at http://www.diodes.com.
2. Product manufactured with Date Code V9 (week 33, 2008) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code V9 are built with Non-Green Molding Compound and may contain Halogens or Sb
Fire Retardants.
2O3
Marking Information
Date Code Key
Year 2001 2002 ….. 2009 2010 2011 2012 2013 2014 2015 2016 2017
Code M N ….. W X Y Z A B C D E
Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec
Code 1 2 3 4 5 6 7 8 9 O N D
BAS116
Document number: DS30233 Rev. 10 - 2
XXX
YM
www.diodes.com
XXX = Product Type Marking Code; K50, K54
YM = Date Code Marking
Y = Year (ex: Y = 2011)
M = Month (ex: 9 = September)
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November 2011
© Diodes Incorporated
Page 2
)
θ
(BR)
P
P
OWER
PAT
O
N
O
R
R
C
URR
T
Maximum Ratings @T
= 25°C unless otherwise specified
A
Characteristic Symbol Value Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Forward Continuous Current (Note 4)
Repetitive Peak Forward Current
Non-Repetitive Peak Forward Surge Current @ t = 1.0μs
@ t = 1.0ms
@ t = 1.0s
Thermal Characteristics
Characteristic Symbol Value Unit
Power Dissipation (Note 4) @TA = 25°C
Thermal Resistance Junction to Ambient Air (Note 4) @TA = 25°C R
Operating and Storage Temperature Range
T
V
V
V
R(RMS
I
I
, T
J
RRM
RWM
V
I
FM
FRM
FSM
P
R
D
JA
STG
BAS116
85 V
60 V
215 mA
500 mA
4.0
1.0
A
0.5
250 mW
500
-65 to +150
°C/W
°C
Electrical Characteristics @T
= 25°C unless otherwise specified
A
Characteristic Symbol Min Typ Max Unit Test Condition
Reverse Breakdown Voltage (Note 5)
V
85
R
⎯ ⎯
0.90
Forward Voltage
V
⎯ ⎯
F
1.0
1.1
1.25
Leakage Current (Note 5)
Total Capacitance
Reverse Recovery Time
Notes: 4. Part mounted on FR-4 PC board with recommended pad layout, which can be found on our website at http://www.diodes.com.
5. Short duration pulse test used to minimize self-heating effect.
I
⎯ ⎯
R
⎯
C
T
⎯ ⎯
t
rr
2
5.0
80
⎯
3.0
V
IR = 100μA
I
= 1.0mA
F
I
= 10mA
F
V
= 50mA
I
F
I
= 150mA
F
V
nA
R
nA
V
R
pF
VR = 0, f = 1.0MHz
I
= IR = 10mA,
F
μs
I
= 0.1 x IR, RL = 100Ω
rr
300
250
R = 500°C/W
θ
JA
300
250
(mW)
I
200
(mA)
200
EN
150
DISSI
150
D
= 75V
= 75V, Tj = 150°C
Note 4
100
,
D
50
0
0 25 50 75 100 125 150
T , AMBIENT TEMPERATURE (°C)
A
Fig. 1 Power Derating Curve
WA
100
F
I, F
50
0
050100150200
T , AMBIENT TEMPERATURE ( C)
A
°
Fig. 2 Current Derating Curve
BAS116
Document number: DS30233 Rev. 10 - 2
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November 2011
© Diodes Incorporated
Page 3
R
R
C
URR
N
T
BAS116
1,000
10
V = 75V
R
100
(nA)
10
1
T = 150°C
A
T = 125°C
A
T = 85°C
A
T = 25°C
A
0.1
0.01
F
I , INSTANTANEOUS FORWARD CURRENT (mA)
0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
V , INSTANTANEOUS FORWARD VOLTAGE (V)
F
Fig. 3 Typical Forward Charact er istics
E
SE
EVE
R
I,
0.1
1
0
50
T , AMBIENT TEMPERATURE ( C)
A
Fig. 4 Typical Reverse Characteristics
150100 200
°
Package Outline Dimensions
K
J
A
SOT23
Dim Min Max Typ
A 0.37 0.51 0.40
C
B
B 1.20 1.40 1.30
C 2.30 2.50 2.40
D 0.89 1.03 0.915
F 0.45 0.60 0.535
H
K1
F
D
G
L
M
G 1.78 2.05 1.83
H 2.80 3.00 2.90
J 0.013 0.10 0.05
K 0.903 1.10 1.00
K1 - - 0.400
L 0.45 0.61 0.55
M 0.085 0.18 0.11
0° 8° -
α
All Dimensions in mm
Suggested Pad Layout
BAS116
Document number: DS30233 Rev. 10 - 2
Y
Z
C
Dimensions Value (in mm)
Z 2.9
X 0.8
Y 0.9
C 2.0
E 1.35
X E
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IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorize d application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2011, Diodes Incorporated
www.diodes.com
BAS116
BAS116
Document number: DS30233 Rev. 10 - 2
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November 2011
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