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Features
• Fast Switching Speed: Maximum of 4ns
• Low Forward Voltage: Maximum of 0.715V at 1mA
• Low Capacitance: Maximum of 2pF
• Surface Mount Package Ideally Suited for Automated Insertion
• For General Purpose Switching Applications
• Lead-Free Finish; RoHS Compliant (Notes 1 & 2)
• Halogen and Antimony Free. “Green” Device (Note 3)
SOT23
TOP VIEW
Green
BAL99
SURFACE MOUNT SWITCHING DIODE
Mechanical Data
• Case: SOT23
• Case Material: Molded Plastic, “Green” Molding Compound. UL
Flammability Classification Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020D
• Terminals: Solderable per MIL-STD-202, Method 208
• Lead Free Plating (Matte Tin Finish annealed over Alloy 42
leadframe).
• Polarity: See Diagram
• Weight: 0.008 grams (approximate)
TOP VIEW
Internal Schematic
e3
Ordering Information (Note 4 & 5)
Part Number Case Packaging
BAL99-7-F SOT23 3000/Tape & Reel
Notes: 1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied.
2. See http://www.diodes.com for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.
4. For packaging details, go to our website at http://www.diodes.com/datasheets/ap02007.pdf.
5. Product manufactured with Date Code V9 (week 33, 2008) and newer are built with Green Molding Compound. Product manufactured prior to Date Code
V9 are built with Non-Green Molding Compound and may contain Halogens or Sb
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
Fire Retardants.
2O3
Marking Information
KJF
Date Code Key
Year 1998 1999 2000 2001 2002 ….. 2012 2013 2014 2015 2016 2017 2018 2019 2020
Code J K L M N ….. Z A B C D E F G H
Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec
Code 1 2 3 4 5 6 7 8 9 O N D
K = SAT (Shanghai Assembly / Test site)
JF = Product Type Marking Code
YM
YM = Date Code Marking
Y = Year ex: Z = 2012
M = Month ex: 9 = September
CJF
C = CAT (Chengdu Assembly / Test site)
JF = Product Type Marking Code
YM
YM = Date Code Marking
Y = Year ex: Z = 2012
M = Month ex: 9 = September
BAL99
Document number: DS12009 Rev. 16 - 2
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© Diodes Incorporated
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)
θ
(BR)
Maximum Ratings (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Value Unit
Non-Repetitive Peak Reverse Voltage
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltage
Forward Continuous Current (Note 6)
Non-Repetitive Peak Forward Surge Current @ t = 1.0µs
@ t = 1.0s
Thermal Characteristics
Characteristic Symbol Value Unit
Power Dissipation (Note 6)
Thermal Resistance Junction to Ambient Air (Note 6)
Operating and Storage Temperature Range
VRM
V
RRM
V
RWM
VR
V
R(RMS
IFM
I
FSM
PD
R
TJ , T
JA
STG
BAL99
100 V
75 V
53 V
300 mA
2.0
1.0
350 mW
357
-65 to +150
A
°C/W
°C
Electrical Characteristics (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Min Max Unit Test Condition
Reverse Breakdown Voltage (Note 7)
Forward Voltage
Reverse Current (Note 7)
Total Capacitance
Reverse Recovery Time
Notes: 6. Part mounted on FR-4 board with recommended pad layout, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
7. Short duration pulse test used to minimize self-heating effect.
V
R
VF
IR ⎯
CT
trr
75
⎯
⎯
⎯
⎯
0.715
0.855
1.0
1.25
2.5
50
30
25
2.0 pF
4.0 ns
V
IR = 100µA
IF = 1.0mA
IF = 10mA
V
IF = 50mA
IF = 150mA
VR = 75V
µA
VR = 75V, TJ = +150°C
µA
µA
VR = 25V, TJ = +150°C
nA
VR = 20V
VR = 0, f = 1.0MHz
IF = IR = 10mA,
I
= 0.1 x IR, RL = 100Ω
rr
BAL99
Document number: DS12009 Rev. 16 - 2
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© Diodes Incorporated
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P, P
O
R
PATIO
N
N
TAN
TANEO
US FORWARD CUR
REN
T
NSTAN
TANEO
US R
R
CUR
REN
T
C, TOT
CAPACITANC
F
BAL99
(mW)
DISSI
WE
D
10,000
(nA)
1,000
SE
EVE
500
400
300
200
100
100
0
0
T , AMBIENT TEMPERATURE (°C)
A
Figure 1 Power Derating Curve
100
200
(A)
S
F
I, I
0.001
)
E (p
1
0.1
0.01
0
V , INSTANTANEOUS FORWARD VOLTAGE (V)
F
Figure 2 Typical Forward Characteristics
2.0
1.8
1.6
1.4
1.2
1.0
1.00.5
1.5
0.8
AL
0.6
T
0.4
0.2
0.0
0
Figur e 4 Total Capacitance vs . Re ve r se Voltage
10
V , DC REVERSE VOLTAGE (V)
R
20
4030
I, I
10
1
R
0.1
0
20 40
V , INSTANTANEOUS REVERSE VOLTAGE (V)
R
Figure 3 Typica l Re v er se Charac t e r i stics
60 80 100
Package Outline Dimensions
K
J
A
Dim Min Max Typ
A 0.37 0.51 0.40
B 1.20 1.40 1.30
C
B
C 2.30 2.50 2.40
D 0.89 1.03 0.915
F 0.45 0.60 0.535
G 1.78 2.05 1.83
H
H 2.80 3.00 2.90
J 0.013 0.10 0.05
K1
F
D
G
L
M
K 0.903 1.10 1.00
K1 - - 0.400
L 0.45 0.61 0.55
M 0.085 0.18 0.11
α
BAL99
Document number: DS12009 Rev. 16 - 2
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www.diodes.com
SOT23
0° 8° -
All Dimensions in mm
July 2012
© Diodes Incorporated
Page 4
BAL99
Suggested Pad Layout
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorize d application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2012, Diodes Incorporated
www.diodes.com
Y
Z
X
E
C
IMPORTANT NOTICE
LIFE SUPPORT
Dimensions Value (in mm)
Z 2.9
X 0.8
Y 0.9
C
E
2.0
1.35
BAL99
Document number: DS12009 Rev. 16 - 2
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July 2012
© Diodes Incorporated
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