Diodes AZV358 User Manual

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DUAL LOW VOLTAGE RAIL-TO-RAIL OUTPUT OPERATIONAL AMPLIFIERS
Description
The AZV358 is dual low voltage (2.7V to 5.5V) operational amplifiers which have rail-to-rail output swing capability. The input common­mode voltage range includes ground. The chip exhibits excellent speed-power ratio, achieving 1MHz of bandwidth and 1V/µs of slew rate with low supply current.
The AZV358 is built with BiCMOS process. It has bipolar input and output stages for improved noise performance, low input offset voltage and higher output current drive.
AZV358 is available in the package of TSSOP-8 and MSOP-8. The small packages save space on pc boards, and enable the design of small portable electronic devices. It also allows the designer to place the device closer to the signal source to reduce noise pickup and increase signal integrity.
AZV358 is also available in standard SOIC-8 package.
DATA SHEET
Pin Assignments
OUTPUT 1
IN 1-
IN 1+
V
EE
Product Line o
Diodes Incorporated
M/G/MM Package
(SOIC-8/TSSOP-8/MSOP-8)
1
2
3
4
8
7
6
5
ZV358
V
CC
OUTPUT 2
IN 2-
IN 2+
Features
For V
Guaranteed 2.7V to 5.5V Performance  No Crossover Distortion  Gain-Bandwidth Product 1MHz  Industrial Temperature Range: -40°C to +85°C  Low Supply Current: 210µA  Rail-to-Rail Output Swing under 10kΩ Load:
V
Functional Block Diagram
=5V and VEE=0V, typical unless otherwise noted
CC
V V
CM
up to VCC -10mV
OH
near to VEE +65mV
OL
: -0.1V to VCC-0.8V
Applications
Active Filters Low Power, Low Voltage Applications  General Purpose Portable Devices  Cellular Phone, Cordless Phone  Battery-Powered Systems
8
V
BIAS 1
V
CC
2,6
IN-
3,5
IN+
4
V
EE
AZV358
Document number: DS36536 Rev. 1 - 4
V
V
BIAS 2
BIAS 3
1,7
OUTPUT
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ZV358
Absolute Maximum Ratings
(@TA=25°C, unless otherwise specified. Note 1)
Symbol Parameter
VCC
TJ
T
STG
T
LEAD
Note 1: Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “Recommended Operating Conditions” is not implied. Exposure to “Absolute Maximum Ratings” for extended periods may affect device reliability.
Power Supply Voltage 6 V
Operation Junction Temperature 150 °C
Storage Temperature Range -65 to 150 °C
Lead Temperature (Soldering, 10 seconds) 260 °C
ESD (Machine Model) 200 V
ESD (Human Body Model) 2000 V
Recommended Operating Conditions
DATA SHEET
Symbol Parameter Min Max Unit
VCC
TA
Supply Voltage 2.7 5.5 V
Ambient Operating Temperature Range -40 85 °C
2.7V Electrical Characteristics
VO=VCC/2 and RL>1M, unless otherwise specified. Note 2)
Symbol Parameter Conditions Min Typ Max Unit
VIO
IB
IIO
VCM
ICC
CMRR
PSRR Power Supply Rejection Ratio
I
SOURCE
I
SINK
VOH
VOL
GBWP Gain Bandwidth Product
ɸM
GM
Input Offset Voltage
Input Bias Current
Input Offset Current
Input Common Mode Voltage
Range
Supply Current
Common Mode Rejection Ratio
Output Short Circuit Current
Output Voltage Swing
Phase Margin
Gain Margin 10 — dB
(@TA=25°C, bold typeface applies over TA=-40°C to 85°C, VCC=2.7V, VEE=0V, VCM=1.0V,
11 250
500
for CMRR50dB -0.1
/2, A
V
O=VCC
load
0V
1.7V
CM
2.7V≤V
CC
=0V
V
O
=2.7V
V
O
=10k to 1.35V
R
L
=200pF
C
L
60 — deg
=1, No
VCL
5V, VO=1V
— 140 340
50 63 —
50 60 — dB
5 20 — mA
10 30 — mA
2.60 2.69
60 180 mV
1 — MHz
Note 2: Limits over the full temperature are guaranteed by design, but not tested in production.
AZV358
Document number: DS36536 Rev. 1 - 4
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Rating
1.7 7
9
5 50
150
1.9 V
420
V
© Diodes Incorporated
Unit
mV
nA
nA
μA
dB
September 2013
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5V Electrical Characteristics
VO=VCC/2 and RL>1M, unless otherwise specified. Note 2)
Symbol Parameter Conditions Min Typ Max Unit
VIO
IB
IIO
VCM
DATA SHEET
ICC
GV
CMRR
PSRR Power Supply Rejection Ratio
I
SOURCE
I
SINK
VOH
VOL
SR Slew Rate
GBWP Gain Bandwidth Product
ɸM
GM
Note 2: Limits over the full temperature are guaranteed by design, but not tested in production.
Input Offset Voltage
Input Bias Current
Input Offset Current
Input Common Mode Voltage
Range
Supply Current
Large Signal Voltage Gain
Common Mode Rejection Ratio
Output Short Circuit Current
Output Voltage Swing
Phase Margin
Gain Margin 10 — dB
(@TA=25°C, bold typeface applies over TA=-40oC to 85oC, VCC=5V, VEE=0V, VCM=2.0V,
15 250
500
for CMRR50dB -0.1 4.2 V
V
O=VCC
load
=2k
R
L
4V
0V
CM
2.7V≤V
CC
=1V
V
CM
=0V
V
O
=5V
V
O
R
=2k to 2.5V
L
RL=10k to 2.5V
R
=2k to 2.5V
L
RL=10k to 2.5V
=200pF
C
L
60 — deg
/2, A
=1, No
VCL
5V, VO=1V,
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Diodes Incorporated
615
84 100 —
80 — —
50 63 —
50 60 —
5 60 — mA
10 160 — mA
4.7 4.96
4.6
4.9 4.99
4.8
120 300
400
65 180
280
1 — V/μs
1 — MHz
1.7 7
9
5 50
150
210 440
ZV358
mV
nA
nA
μA
dB
dB
dB
V
mV
AZV358
Document number: DS36536 Rev. 1 - 4
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ZV358
Performance Characteristics
Supply Current vs. Supply Voltage Supply Current vs. Temperature
DATA SHEET
300
VO=VCC/2
No Load
250
200
150
100
Supply Current (A)
50
TA= -40oC
TA=25oC
TA=85oC
0
0123456
Supply Voltage (V)
300
280
260
240
220
200
180
160
Supply Current (A)
140
120
100
-40 -20 0 20 40 60 80
Temperature (OC)
VCC=5V
VCC=2.7V
Slew Rate vs. Supply Voltage Output Short Circuit Current vs. Supply Voltage
1.2
1.1
1.0
0.9
0.8
0.7
0.6
0.5
0.4
Slew Rate (V/S)
0.3
0.2
0.1
0.0
2.5 3.0 3.5 4.0 4.5 5.0 5.5
Falling Edge Rising Edge
Supply Voltage (V)
AV=1
=1Vp-p
V
IN
R
=10K to 1/2V
L
60
VEE=0V
V
short to V
O
(mA)
CC
50
SOURCE
40
30
20
Output Short Circuit Current_I
10
2.5 3.0 3.5 4.0 4.5 5.0 5.5
EE
Supply Voltage (V)
Output Short Circuit Current vs. Supply Voltage Output Short Circuit Current vs. Temperature
160
VEE=0V
V
short to V
O
140
(mA)
SINK
120
100
80
60
40
20
Output Short Circuit Current_I
0
2.53.03.54.04.55.05.5
CC
Supply Voltage (V)
100
90
80
(mA)
Source
70
60
50
40
30
20
10
Output Short Circuit Current _ I
0
-40 -20 0 20 40 60 80
Temperature (OC)
VEE=0V
V
VCC=5V
VCC=2.7V
O
to V
VO=VCC/2
No Load
EE
AZV358
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ZV358
Performance Characteristics
Output Short Circuit Current vs. Temperature Output Voltage vs. Output Source Current
DATA SHEET
AZV358
Document number: DS36536 Rev. 1 - 4
200
180
(mA)
160
SINK
140
120
100
80
60
40
Output Short Circuit Current_I
20
0
-40.0 -20.0 0.0 20.0 40.0 60.0 80.0
Output Voltage vs. Output Source Current Output Voltage vs. Output Sink Current
10
VCC=2.7V
=0V
V
EE
(V)
CC
1
0.1
0.01
-Output Voltage Reference to V
O
V
1E-3
0.1 1 10
Source Current (mA)
Output Voltage vs. Output Sink Current Output Voltage Swing vs. Supply Voltage
10
1
Output Voltage (V)
0.1
110
(Cont.)
VEE=0V
V
to V
O
CC
VCC=5V
VCC=2.7V
O
Temperature (
C)
VCC=2.7V
V
=0V
EE
Sink Current (mA)
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10
(V)
- Output Voltage Referenced to V V
VCC=5V, VEE=0
CC
1
0.1
0.01
O
1E-3
0.1 1 10 100
10
1
Output Voltage (V)
0.1
0.1 1 10 100
100
90
80
70
60
50
40
30
Output Voltage Swing (mV)
20
10
0
2.5 3.0 3.5 4.0 4.5 5.0 5.5
Source Current (mA)
Sink Current (mA)
Negative Swing_V
Positive Swing_VCC-V
Supply Voltage (V)
OL
VCC=5V
=0
V
EE
RL=10K to VCC/2
OH
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Performance Characteristics
(Cont.)
Output Voltage Swing vs. Temperature Gain and Phase vs. Frequency and Resistive Load
DATA SHEET
100
90
80
Negative Swing_V
70
60
50
40
30
Output Voltage Swing (mV)
20
10
Positive Swing_VCC-V
0
-40-200 20406080
OL
OH
Temperature (OC)
RL=10K to VCC/2
VCC=5V
VCC=2.7V
VCC=5V
VCC=2.7V
80
70
60
50
40
30
20
Open Loop Gain (dB)
10
VCC=2.5V, VEE=-2.5V
0
=0
C
L
-10
RL=620
RL=2K
RL=100K
10k 100k 1M
RL=620
RL=2K
RL=100K
Gain
Frequency (Hz)
Phase Margin
Gain and Phase vs. Frequency and Capacitive Load Gain and Phase vs. Frequency and Capacitive Load
80
70
60
50
40
30
20
10
Open Loop Gain (dB)
0
-10
VCC=2.5V, VEE=-2.5V
R
-20
-30
CL=100pF
CL=200pF
CL=470pF
CL=1000pF
CL=100pF
CL=200pF
CL=470pF
CL=1000pF
Phase Margin
Gain
=620
L
10k 100k 1M
Frequency (Hz)
100
90
80
70
60
50
40
30
20
10
0
-10
-20
-30
-40
80
70
60
50
40
Open Loop Gain (dB)
-10
-20
30
20
10
0
Phase Margin (Degree)
CL=100pF
CL=200pF
CL=1000pF
CL=100pF
CL=200pF
CL=1000pF
10k 100k 1M
Phase Margin
Gain
Frequency (Hz)
THD+N vs. Frequency Non-Inverting Input Small Signal Pulse Response
1
VCC=2.5V, VEE=-2.5V
=10K
R
L
AV=1
VIN
VCC=5V,VEE=0V
=2K
R
L
V
=100mVp-p
IN
Unity Gain
0.1
THD+N (%)
0.01
VO=1Vp-p
VO=2.5Vp-p
V
OUT
1E-3
100 1k 10k 100k
20
Frequency (Hz)
VCC=2.5V
V
=-2.5V
EE
=100K
R
L
100
80
60
40
20
0
-20
100
90
80
70
60
50
40
30
20
10
0
-10
-20
-30
-40
Phase Margin (Degree)
Phase Margin (Degree)
AZV358
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Performance Characteristics
(Cont.)
Non-Inverting Input Large Signal Pulse Response Non-Inverting Input Small Signal Response
VIN
VCC=5V,VEE=0V R
=2K
L
=1Vp-p
V
IN
Unity Gain
VIN
VCC=2.5V V C R V Unity Gain
V
OUT
DATA SHEET
Non-Inverting Input Small Signal Response
VIN
VCC=2.5V V
=-2.5V
EE
C
=200pF
L
R
=2K
L
V
=100mVp-p
IN
Unity Gain
V
OUT
=-2.5V
EE
=50pF
L
=2K
L
=100mVp-p
IN
V
OUT
AZV358
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Ordering Information
Package
Temperature
Range
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AZV358
-
Circuit Type
Package M: SOIC-8 G: TSSOP-8 MM: MSOP-8
Part Number Marking ID
Lead Free Green Lead Free Green
E1: Lead Free G1: Green
Blank: Tube TR: Tape & Reel
ZV358
Packing Type
DATA SHEET
SOIC-8 -40 to 85°C
TSSOP-8 -40 to 85°C
MSOP-8 -40 to 85°C
AZV358M-E1 AZV358M-G1 AZV358M-E1 AZV358M-G1 Tube
AZV358MTR-E1 AZV358MTR-G1 AZV358M-E1 AZV358M-G1 Tape & Reel
AZV358G-E1 AZV358G-G1 EG3E GG3E Tube
AZV358GTR-E1 AZV358GTR-G1 EG3E GG3E Tape & Reel
AZV358MM-E1 AZV358MM-G1 AZV358MM-E1 AZV358MM-G1 Tube
AZV358MMTR-E1 AZV358MMTR-G1 AZV358MM-E1 AZV358MM-G1 Tape & Reel
BCD Semiconductor's Pb-free products, as designated with "E1" suffix in the part number, are RoHS compliant. Products with “G1” suffix are available in green packages.
AZV358
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Package Outline Dimensions
DATA SHEET
4.700(0.185)
5.100(0.201)
°
7
7
°
1.27 0( 0. 05 0)
TYP
(All dimensions in mm(inch).)
SOIC-8
1.350(0.053)
1.750(0.069)
0.67 5( 0. 02 7)
0.72 5( 0. 02 9)
0.100(0.004)
0.300(0.012)
0.320(0.013) TYP
°
8
°
8
D
2
D
1
:
0
5.800( 0. 22 8)
6.200( 0. 24 4)
1.000(0.039)
TYP
Option 1
0.300(0.012)
0.510(0.020)
Note: Eject hole , oriented hole and mold mark is optional
AZV358
Document number: DS36536 Rev. 1 - 4
R0.15 0(0.0 06)
3.800(0.150)
4.000(0.157)
0.150(0.006)
0.250(0.010)
0.900(0.035) TYP
Option 2
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0
°
8
°
1 ° 7 °
1
R
0
.
5
0.450(0.017)
0.800(0.031)
0.350(0.014) TYP
.
Option 1
0
0
6
)
.
0
0
(
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Package Outline Dimensions
0.050(0.002)
0.150(0.006)
DATA SHEET
0.800(0.031)
1.050(0.041)
2.900(0.114)
3.100(0.122)
1.200(0.047)
(Cont.) (All dimensions in mm(inch).)
TSSOP-8
0.09 0(0.0 04)
MAX
0.20 0(0.0 08)
SEE DETAIL A
12 °
TOP & BOTTOM
R0.090(0.004)
0.400 (0.01 6)
TYP
0.650 (0.02 6)
Note: Eject hole, oriented hole and mold mark is optional.
AZV358
Document number: DS36536 Rev. 1 - 4
1.950(0.077)
TYP
4.300(0.169)
4.500(0.177)
0.190(0.007)
0.300(0.012)
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6.400(0.252)
TYP
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SEATING PLANE
0.250(0.010) TYP
DETAIL A
R0.090(0.004)
GAGE PLAN E
0.450(0.018)
0.75 0(0.0 30)
1.000(0.039) REF
0° 8°
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Package Outline Dimensions
4.700 (0.185 )
DATA SHEET
5.100 (0.201 )
(Cont.) (All dimensions in mm(inch).)
MSOP-8
0.300(0.012)TYP
0. 650( 0.0 26)TYP
)
)
0
8
0
0
0
0
.
.
0
2.900(0.114)
3.100(0.122)
`
0
(
(
0
0
0
0
0
2
.
.
0
0
Y
P
T
)
6
0
0
.
0
(
0
1
5
.
0
)
) 2
4
2
1 1
1
.
. 0
0
(
( 0
0
0
0.400(0.016)
0
0.800(0.031)
9
1
.
. 2
3
0
°
8
°
0
.
7
(
5
0
0
.
0
)
3
0
(
0
0
.
0
)
3
0
.
0
.
1
.
8
9
7
8
0
(
3
0
0
0
.
)
1
)
7
2
0
(
4
0
0
0
.
Note: Eject hole, oriented hole and mold mark is optional.
AZV358
Document number: DS36536 Rev. 1 - 4
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Suggested Pad Layout
DATA SHEET
SOIC-8
Grid
placement
courtyard
ZG
Y
EX
Dimensions
Value 6.900/0.272 3.900/0.154 0.650/0.026 1.500/0.059 1.270/0.050
Z
(mm)/(inch)
G
(mm)/(inch)
X
(mm)/(inch)
Y
(mm)/(inch)
E
(mm)/(inch)
AZV358
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Suggested Pad Layout
DATA SHEET
(Cont.)
TSSOP-8
GZ
Y
E
E1
X
Dimensions
Z
(mm)/(inch)
G
(mm)/(inch)
X
(mm)/(inch)
Y
(mm)/(inch)
E
(mm)/(inch)
E1
(mm)/(inch)
Value 7.720/0.304 4.160/0.164 0.420/0.017 1.780/0.070 0.650/0.026 1.950/0.077
AZV358
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Suggested Pad Layout
DATA SHEET
(Cont.)
G
MSOP-8
E
X
Z
Y
Dimensions
Value 5.500/0.217 2.800/0.110 0.450/0.018 1.350/0.053 0.650/0.026
Z
(mm)/(inch)
G
(mm)/(inch)
X
(mm)/(inch)
Y
(mm)/(inch)
E
(mm)/(inch)
AZV358
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DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
DATA SHEET
final and determinative format released by Diodes Incorporated.
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A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
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2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
IMPORTANT NOTICE
LIFE SUPPORT
AZV358
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