Page 1
1.5MHz, 2A, STEP DOWN DC-DC CONVERTER AUR9719
Data Sheet
General Description
The AUR9719 is a high efficiency step-down
DC-DC voltage converter. The chip operation is
optimized by peak-current mode architecture with
built-in synchronous power MOS switchers. The
oscillator and timing capacitors are all built-in
providing an internal switching frequency of
1.5MHz that allows the use of small surface mount
inductors and capacitors for portable product
implementations.
Integrated Soft Start (SS), Under Voltage Lock Out
(UVLO), Thermal Shutdown Detection (TSD) and
Short Circuit Protection are designed to provide
reliable product applications.
The device is available in adjustable output voltage
versions ranging from 0.8V to 9×V
voltage range is from 2.7V to 5.5V , and is able to
deliver up to 2.0A.
The AUR9719 is available in DFN-3×3-6 package.
when input
IN
Features
• High Efficiency Buck Power Converter
• Output Current: 2A
• Low R
• Adjustable Output Voltage from
• Wide Operating Voltage Range: 2.7V to 5.5V
•
Built-in Power Switches for Synchronous
Rectification with High Efficiency
• 800mV Feedback Voltage
• 1.5MHz Constant Frequency Operation
• Thermal Shutdown Protection
• Low Drop-out Operation at 90% Duty Cycle
• No Schottky Diode Required
Internal Switch: 100mΩ
DS(ON)
0.8V to 9×VIN
Applications
• LCD TV
• Set Top Box
• Post DC-DC Voltage Regulation
• PDA and Notebook Computers
DFN-3×3-6
Figure 1. Package Type of AUR9719
Nov. 2011 Rev. 1. 0 BCD Semiconductor Manufacturing Limited
1
Page 2
Data Sheet
1.5MHz, 2A, STEP DOWN DC-DC CONVERTER AUR9719
Pin Configuration
D Package
(DFN-3×3-6)
Pin 1 Mark
1
Expose d
2
Figure 2. Pin Configuration of AUR9719 (Top View)
Pad
6
5
43
Pin Description
Pin
Number
1 FB INPUT Output voltage feedback pin
2 GND GROUND Ground pin
3 SW OUTPUT Switch output pin
4 VIN_SW INPUT Power supply input for the MOSFET switch
5 VIN_A INPUT Supply input for the analog circuit
6 EN INPUT Enable pin. Active high
Pin Name I/O Function
Nov. 2011 Rev. 1. 0 BCD Semiconductor Manufacturing Limited
2
Page 3
Data Sheet
1.5MHz, 2A, STEP DOWN DC-DC CONVERTER AUR9719
Functional Block Diagram
FB
EN
6
Saw-tooth
Generator
Bias
Generator
Soft
Start
1
-
+
Error
Amplifier
Oscillator
+
+
-
Modulator
-
+
Over Voltage
Bandgap
Reference
Comparator
Over Current
Comparator
Control
Logic
Reverse Inductor
Current Comparator
VIN_A
5
Current
Sensing
Buffer &
Dead Time
Control
Logic
-
+
VIN_SW
4
2
3
SW
GND
Figure 3. Functional Block Diagram of AUR9719
Ordering Information
AUR9719 A
Circuit Type
A: Adjustable Output
5
Package
D: DFN-3×3-6
G: Green
Package
DFN-3×3-6 -40 to 80°C AUR9719AGD 9719A Tape & Reel
Temperature
Range
Part Number Marking ID Packing Type
BCD Semiconductor's Pb-free products, as designated with "G" in the part number, are RoHS compliant and
green.
Nov. 2011 Rev. 1. 0 BCD Semiconductor Manufacturing Limited
3
Page 4
Data Sheet
1.5MHz, 2A, STEP DOWN DC-DC CONVERTER AUR9719
Absolute Maximum Ratings (Note 1)
Parameter Symbol Value Unit
Supply Input Voltage (VIN_SW) V
Supply Input Voltage (VIN_A) V
Voltage from VIN_SW to VIN_A Pin V
SW Pin Switch Voltage VSW
SW Pin Switch Current ISW 3.2 A
Enable Voltage VEN
Power Dissipation (On PCB, TA=25°C) PD
Thermal Resistance (Junction to Ambient, Simulation) θJA
Operating Junction Temperature TJ
Operating Temperature TOP
Storage Temperature T
ESD (Human Body Model) V
ESD (Machine Model) VMM
Note 1: Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to
the device. These are stress ratings only, and functional operation of the device at these or any other conditions
beyond those indicated under “Recommended Operating Conditions” is not implied. Exposure to “Absolute
Maximum Ratings” for extended periods may affect device reliability.
IN_SW
IN_A
IN(SW_A)
STG
HBM
0 to 6.0
0 to 6.0
-0.3 to 0.3
-0.3 to
V
+0.3
IN_SW
-0.3 to
V
+0.3
IN_A
2.49
40.11
150
-40 to 85
-55 to 150
2000
200
V
V
V
V
V
W
°C/W
°C
°C
°C
V
V
Recommended Operating Conditions
Parameter Symbol Min Max Unit
Supply Input Voltage VIN 2.7 5.5 V
Junction Temperature Range TJ -20 125 °C
Ambient Temperature Range TA -40 80 °C
Nov. 2011 Rev. 1. 0 BCD Semiconductor Manufacturing Limited
4
Page 5
Data Sheet
1.5MHz, 2A, STEP DOWN DC-DC CONVERTER AUR9719
Electrical Characteristics
V
IN_SW=VIN_A=VEN
specified.
=5V, V
=1.2V, VFB=0.8V, L=3.3µH, CIN=4.7µF, C
OUT
=22µF, TA=25°C, unless otherwise
OUT
Parameter Symbol Test Condition Min Typ Max Unit
Input Voltage Range V
Shutdown Current I
IN
OFF
Active Current ION VFB=0.95V 460 µA
Regulated Feedback
Voltage
V
FB
VIN=V
IN_SW=VIN_A
2.7 5.5 V
VEN=0V 4 µA
For Adjustable Output Voltage 0.784 0.8 0.816 V
Regulated Output
Voltage Accuracy
Peak Inductor
Current
Oscillator Frequency f
PMOSFET RON R
NMOSFET RON R
EN Input High
Threshold Voltage
EN Input Low
Threshold Voltage
∆V
/V
OUT
OUT
=2.7V to 5.5V, I
V
IN
2A
=10mA to
OUT
-3 3 %
IPK 2.2 3.2 A
1.2 1.5 1.8 MHz
OSC
ISW=0.75A 100 mΩ
ON(P)
ISW=0.75A 100 mΩ
ON(N)
1.5 V
V
EN_H
V
0.4 V
EN_L
EN Input Current IEN 2 µA
Soft-start Time tSS 450 µs
Maximum Duty
Cycle
D
90 %
MAX
Rising 2.4
Under Voltage Lock
Out Threshold
V
UVLO
Falling 2.3
V
Hysteresis 0.1
Thermal Shutdown TSD Hysteresis=30°C 150 °C
Nov. 2011 Rev. 1. 0 BCD Semiconductor Manufacturing Limited
5
Page 6
Data Sheet
1.5MHz, 2A, STEP DOWN DC-DC CONVERTER AUR9719
Typical Performance Characteristics
100
90
80
70
60
50
40
30
Efficiency (%)
20
10
0
0.0 0.5 1.0 1.5 2.0
Output Current (A)
V
OUT
Figure 4. Efficiency vs. Output Current (V
VIN=3.3V
VIN=4.2V
VIN=5.0V
VIN=5.5V
=1.0V
=1.0V) Figure 5. Efficiency vs. Output Current (V
OUT
100
90
80
70
60
50
40
30
Efficiency (%)
20
V
10
0
0.0 0.5 1.0 1.5 2.0
=1.2V
OUT
Output Current (A)
OUT
VIN=3.3V
VIN=4.2V
VIN=5.0V
VIN=5.5V
=1.2V)
100
90
80
70
60
50
40
30
Efficiency (%)
20
10
0
0.0 0.5 1.0 1.5 2.0
Output Current (A)
V
=1.8V
OUT
VIN=3.3V
VIN=4.2V
VIN=5.0V
VIN=5.5V
Figure 6. Efficiency vs. Output Current (V
=1.8V) Figure 7. Efficiency vs. Output Current (V
OUT
100
90
80
70
60
50
40
30
Efficiency (%)
20
10
0
0.0 0.5 1.0 1.5 2.0
V
OUT
Output Current (A)
OUT
VIN=3.3V
VIN=4.2V
VIN=5.0V
VIN=5.5V
=2.5V
=2.5V)
Nov. 2011 Rev. 1. 0 BCD Semiconductor Manufacturing Limited
6
Page 7
Data Sheet
1.5MHz, 2A, STEP DOWN DC-DC CONVERTER AUR9719
Typical Performance Characteristics (Continued)
100
90
80
70
60
50
40
30
Efficiency (%)
20
10
0
0.0 0.5 1.0 1.5 2.0
Output Current (A)
Figure 8. Efficiency vs. Output Current (V
1.24
1.23
1.22
1.21
1.20
1.19
1.18
Output Voltage (V)
1.17
1.16
0.0 0.5 1.0 1.5 2.0
Output Current (A)
Figure 10. Load Regulation (V
=1.2±0.03V) Figure 11. Load Regulation (V
OUT
V
OUT
V
OUT
VIN=4.2V
VIN=5.0V
VIN=5.5V
=3.3V
OUT
VIN=3.3V
VIN=4.2V
VIN=5.0V
VIN=5.5V
=1.2+0.03V
=3.3V)
1.03
1.02
1.01
1.00
0.99
Output Voltage (V)
0.98
0.97
0.0 0.5 1.0 1.5 2.0
Output Current (A)
Figure 9. Load Regulation (V
1.85
1.84
1.83
1.82
1.81
1.80
1.79
1.78
Output Voltage (V)
1.77
1.76
1.75
0.0 0.5 1.0 1.5 2.0
=1.0±0.03V)
OUT
V
Output Current (A)
OUT
VIN=3.3V
VIN=4.2V
VIN=5.0V
VIN=5.5V
V
=1.0+0.03V
OUT
VIN=3.3V
VIN=4.2V
VIN=5.0V
VIN=5.5V
=1.8+0.03V
OUT
=1.8±0.03V)
Nov. 2011 Rev. 1. 0 BCD Semiconductor Manufacturing Limited
7
Page 8
Data Sheet
1.5MHz, 2A, STEP DOWN DC-DC CONVERTER AUR9719
Typical Performance Characteristics (Continued)
2.56
2.54
2.52
2.50
2.48
Output Voltage (V)
2.46
2.44
0.0 0.5 1.0 1.5 2.0
Output Current (A)
V
OUT
VIN=3.3V
VIN=4.2V
VIN=5.0V
VIN=5.5V
=2.5+0.03V
3.40
3.38
3.36
3.34
3.32
3.30
3.28
3.26
Output Voltage (V)
3.24
V
3.22
3.20
0.0 0.5 1.0 1.5 2.0
Output Current (A)
=3.3+0.03V
OUT
VIN=4.2V
VIN=5.0V
VIN=5.5V
Figure 12. Load Regulation (V
=2.5±0.03V) Figure 13. Load Regulation (V
OUT
=3.3±0.03V)
OUT
Output Voltage (V)
1.24
1.23
1.22
1.21
1.20
1.19
1.18
1.17
1.16
I
= 0A
OUT
I
= 2A
OUT
V
=1.2+0.03V
OUT
TA= 25OC
3.0 3.5 4.0 4.5 5.0 5.5
Input Voltage (V)
1.03
1.02
1.01
1.00
0.99
Output Voltage (V)
0.98
0.97
3.0 3.5 4.0 4 .5 5.0 5.5
Input Voltage (V)
I
I
V
=1.0+0.03V
OUT
TA=25OC
=0A
OUT
=2A
OUT
Figure 14. Line Regulation (V
=1.0±0.03V) Figure 15. Line Regulation (V
OUT
=1.2±0.03V)
OUT
Nov. 2011 Rev. 1. 0 BCD Semiconductor Manufacturing Limited
8
Page 9
Data Sheet
1.5MHz, 2A, STEP DOWN DC-DC CONVERTER AUR9719
Typical Performance Characteristics (Continued)
1.85
1.84
1.83
1.82
1.81
1.80
1.79
1.78
Output Voltage (V)
1.77
1.76
1.75
3.0 3.5 4.0 4.5 5.0 5.5
Input Voltage (V)
V
OUT
TA= 25OC
I
=0A
OUT
I
=2A
OUT
=1.8+0.03V
2.56
2.54
2.52
2.50
2.48
Output Voltage (V)
2.46
2.44
3.5 4.0 4.5 5.0 5.5
Input Voltage (V)
I
I
V
=2.5+0.03V
OUT
TA= 25OC
=0A
OUT
=2A
OUT
Figure 16. Line Regulation (V
=1.8±0.03V) Figure 17. Line Regulation (V
OUT
=2.5±0.03V)
OUT
3.40
3.38
3.36
3.34
3.32
3.30
3.28
3.26
Output Voltage (V)
3.24
3.22
3.20
4.0 4.5 5.0 5.5
Input Voltage (V)
I
I
V
=3.3+0.03V
OUT
TA= 25OC
= 0A
OUT
= 2A
OUT
EN Threshold Voltage (V)
1.10
1.05
1.00
0.95
0.90
0.85
0.80
0.75
0.70
0.65
0.60
High Level
Low Level
V
=1.2V
OUT
I
=500mA
OUT
TA=25oC
3.0 3.5 4.0 4.5 5.0 5.5
Input Voltage (V)
Figure 18. Line Regulation (V
=3.3±0.03V) Figure 19.EN Threshold Voltage vs. Input Voltage
OUT
Nov. 2011 Rev. 1. 0 BCD Semiconductor Manufacturing Limited
9
Page 10
Data Sheet
1.5MHz, 2A, STEP DOWN DC-DC CONVERTER AUR9719
Typical Performance Characteristics (Continued)
1.8
1.7
1.6
1.5
1.4
Frequency (MHz)
1.3
1.2
V
=1.2V
OUT
I
=1A
OUT
TA=25oC
3.0 3.5 4.0 4.5 5.0 5.5
Input Voltage (V)
50
45
C)
o
40
35
Temperature (
30
25
0.0 0.5 1.0 1.5 2.0
VIN=5.0V
V
V
=3.3V
OUT
=1.0V
OUT
Output Current (A)
Figure 20.Frequency vs. Input Voltage Figure 21.Temperature vs. Output Current
Figure 22. Start Up through EN Figure 23. Shut Down through EN
(VIN=5V, VEN=0V to 5V, V
OUT
=3.3V, I
=2.0A) (V
OUT
=5V, VEN=5V to 0V, V
IN
OUT
=3.3V, I
=2.0A)
OUT
Nov. 2011 Rev. 1. 0 BCD Semiconductor Manufacturing Limited
10
Page 11
Data Sheet
1.5MHz, 2A, STEP DOWN DC-DC CONVERTER AUR9719
Typical Performance Characteristics (Continued)
Figure 24. Output Ripple Voltage Figure 25. Output Ripple Voltage
(V
IN
=5.0V, V
OUT
=1.0V, I
=1.0A) (VIN=5.0V, V
OUT
OUT
=1.0V, I
OUT
=2.0A)
Figure 26. Output Ripple Voltage Figure 27. Output Ripple Voltage
(VIN=5.0V, V
OUT
=3.3V, I
=1.0A) ( VIN=5.0V, V
OUT
OUT
=3.3V, I
OUT
=2.0A)
Nov. 2011 Rev. 1. 0 BCD Semiconductor Manufacturing Limited
11
Page 12
Data Sheet
1.5MHz, 2A, STEP DOWN DC-DC CONVERTER AUR9719
Typical Performance Characteristics (Continued)
Figure 28. Load Transition Figure 29. Load Transition
(VIN=5.0V, V
OUT
=1.0V, I
=0.1 to 1A) (VIN=5.0V, V
OUT
OUT
=1.0V, I
=0.1 to 2A)
OUT
Figure 30. Load Transition Figure 31. Load Transition
(VIN=5.0V, V
OUT
=3.3V, I
=0.1A to 1.0A) (VIN=5.0V, V
OUT
OUT
=3.3V, I
OUT
=0.1A to 2.0A)
Nov. 2011 Rev. 1. 0 BCD Semiconductor Manufacturing Limited
12
Page 13
Data Sheet
1.5MHz, 2A, STEP DOWN DC-DC CONVERTER AUR9719
Typical Performance Characteristics (Continued)
Figure 32. Short Circuit Protection Figure 33. Short Circuit Recovery
(V
=5V, V
IN
OUT
=3.3V, I
=2.0A) (VIN=5V, V
OUT
OUT
=3.3V, I
OUT
=2.0A)
Nov. 2011 Rev. 1. 0 BCD Semiconductor Manufacturing Limited
13
Page 14
Data Sheet
1.5MHz, 2A, STEP DOWN DC-DC CONVERTER AUR9719
Application Information
The basic AUR9719 application circuit is shown in
Figure 36, external components selection is determined
by the load current and is critical with the selection of
inductor and capacitor values.
1. Inductor Selection
For most applications, the value of inductor is chosen
based on the required ripple current with the range of
1µH to 6.8µH.
I −
1
=∆
V
OUTL
Lf
×
The largest ripple current occurs at the highest input
voltage. Having a small ripple current reduces the ESR
loss in the output capacitor and improves the efficiency.
The highest efficiency is realized at low operating
frequency with small ripple current. However, larger
value inductors will be required. A reasonable starting
point for ripple current setting is △I
maximum ripple current stays below a specified
value, the inductor should be chosen according to the
following equation:
=
L
V
[
OUT
MAXIf
∆×
L
The DC current rating of the inductor should be at
least equal to the maximum output current plus half
the highest ripple current to prevent inductor core
saturation. For better efficiency, a lower
DC-resistance inductor should be selected.
2. Capacitor Selection
The input capacitance, CIN, is needed to filter the
trapezoidal current at the source of the top MOSFET.
To prevent large ripple voltage, a low ESR input
capacitor sized for the maximum RMS current must
be used. The maximum RMS capacitor current is
given by:
It indicates a maximum value at V
I
RMS=IOUT
commonly used for design because even significant
Nov. 2011 Rev. 1. 0 BCD Semiconductor Manufacturing Limited
II
×=
OMAXRMS
/2. This simple worse-case condition is
V
OUT
)1(
V
IN
=40%I
L
V
1][
)(
V
OUT
−
MAXV
IN
VVV
)]([ −
OUTINOUT
IN
=2V
IN
1
2
MAX
]
)(
OUT
. For a
, where
deviations do not much relieve. The selection of C
is determined by the Effective Series Resistance
(ESR) that is required to minimize output voltage
ripple and load step transients, as well as the amount
of bulk capacitor that is necessary to ensure that the
control loop is stable. Loop stability can be also
checked by viewing the load step transient response
as described in the following section. The output
ripple, △V
, is determined by:
OUT
[
ESRIV
LOUT
+∆≤∆
8
1
××
]
Cf
OUT
The output ripple is the highest at the maximum input
voltage since △I
increases with input voltage.
L
3. Load Transient
A switching regulator typically takes several cycles to
respond to the load current step. When a load step
occurs, V
to △I
resistance of output capacitor. △I
charge or discharge C
signal used by the regulator to return V
immediately shifts by an amount equal
OUT
×ESR, where ESR is the effective series
LOAD
also begins to
LOAD
generating a feedback error
OUT
OUT
steady-state value. During the recovery time, V
can be monitored for overshoot or ringing that would
indicate a stability problem.
4. Output Voltage Setting
The output voltage of AUR9719 can be adjusted by a
resistive divider according to the following formula:
VV
REFOUT
R
1
R
2
V
The resistive divider senses the fraction of the output
voltage as shown in Figure 34.
VOUT
R1
R2
FB
AUR9719
GND
Figure 34. Setting the Output Voltage
14
R
+×=+×=
R
OUT
to its
OUT
1
)1(8.0)1(
2
Page 15
+×=
Data Sheet
1.5MHz, 2A, STEP DOWN DC-DC CONVERTER AUR9719
Application Information (Continued)
5. Short-Circuit Protection
When AUR9719 output node is shorted to GND, as
V
drop under 0.4V, chip will enter soft-start to
FB
protect itself, when short circuit is removed, and V
rise over 0.4V, AUR9719 enter normal operation
again. If AUR9719 reach OCP threshold while short
circuit, AUR9719 will enter soft-start cycle until the
current under OCP threshold.
6. Efficiency Considerations
The efficiency of switching regulator is equal to the
output power divided by the input power times 100%.
It is usually useful to analyze the individual losses to
determine what is limiting efficiency and which
change could produce the largest improvement.
Efficiency can be expressed as:
Efficiency=100%-L1-L2-…..
Where L1, L2, etc. are the individual losses as a
percentage of input power.
Although all dissipative elements in the regulator
produce losses, two major sources usually account for
most of the power losses: V
2
I
R losses. The VIN quiescent current loss dominates
the efficiency loss at very light load currents and the
2
I
R loss dominates the efficiency loss at medium to
heavy load currents.
6.1 The V
quiescent current loss comprises two
IN
parts: the DC bias current as given in the electrical
characteristics and the internal MOSFET switch gate
charge currents. The gate charge current results from
switching the gate capacitance of the internal power
MOSFET switches. Each cycle the gate is switched
from high to low, then to high again, and the packet
of charge, dQ moves from V
resulting dQ/dt is the current out of V
typically larger than the internal DC bias current. In
continuous mode,
QQfI +×=
Where Q
and QN are the gate charge of power
P
PMOSFET and NMOSFET switches. Both the DC
bias current and gate charge losses are proportional to
the V
input voltages.
Nov. 2011 Rev. 1. 0 BCD Semiconductor Manufacturing Limited
and this effect will be more serious at higher
IN
quiescent current and
IN
to ground. The
IN
)(
NPGATE
that is
IN
FB
15
2
6.2 I
R losses are calculated from internal switch
resistance, R
and external inductor resistance RL.
SW
In continuous mode, the average output current
flowing through the inductor is chopped between
power PMOSFET switch and NMOSFET switch.
Then, the series resistance looking into the LX pin is
a function of both PMOSFET R
R
resistance and the duty cycle (D):
DS(ON)
() ()
Therefore, to obtain the I
R
and multiply the result by the square of the
L
average output current.
Other losses including C
losses and inductor core losses generally account for
less than 2 % of total additional loss.
7. Thermal Characteristics
In most applications, the part does not dissipate much
heat due to its high efficiency. However, in some
conditions when the part is operating in high ambient
temperature with high R
duty cycles, such as in LDO mode, the heat
dissipated may exceed the maximum junction
temperature. To avoid the part from exceeding
maximum junction temperature, the user should do
some thermal analysis. The maximum power
dissipation depends on the layout of PCB, the thermal
resistance of IC package, the rate of surrounding
airflow and the temperature difference between
junction and ambient.
8. PCB Layout Considerations
When laying out the printed circuit board, the
following checklist should be used to optimize the
performance of AUR9719.
1) The power traces, including the GND trace, the LX
trace and the VIN trace should be kept direct, short
and wide.
2) Put the input capacitor as close as possible to the
VIN and GND pins.
3) The FB pin should be connected directly to the
feedback resistor divider.
4) Keep the switching node, LX, away from the
sensitive FB pin and the node should be kept small
area.
and NMOSFET
DS(ON)
)(
DRDRR
−×
1
NONDSPONDSSW
2
R losses, simply add RSW to
and C
IN
DS(ON)
ESR dissipative
OUT
resistance and high
Page 16
Data Sheet
1.5MHz, 2A, STEP DOWN DC-DC CONVERTER AUR9719
Application Information (Continued)
Figure 35. Layout Example of AUR9719
Nov. 2011 Rev. 1. 0 BCD Semiconductor Manufacturing Limited
16
Page 17
Data Sheet
1.5MHz, 2A, STEP DOWN DC-DC CONVERTER AUR9719
Typical Application
Note 2:
AUR9719
R
1
)1(
VV
REFOUT
+×= .
R
2
Figure 36. Typical Application Circuit of AUR9719
Table 1. Component Guide
V
(V)
OUT
3.3 31.25 10 3.3
2.5 21.5 10 3.3
1.8 12.5 10 3.3
R1 (kΩ) R2 (kΩ)L1 (µH)
1.2 5 10 3.3
1.0 3 10 3.3
Nov. 2011 Rev. 1. 0 BCD Semiconductor Manufacturing Limited
17
Page 18
Data Sheet
1.5MHz, 2A, STEP DOWN DC-DC CONVERTER AUR9719
Mechanical Dimensions
DFN-3×3-6 Unit:mm(inch)
Nov. 2011 Rev. 1. 0 BCD Semiconductor Manufacturing Limited
18
Page 19
BCD Semiconductor Manufacturing Limited
IMPORTANT NOTICE
IMPORTANT NOTICE
BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifi-
BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifi-
cations herein. BCD Semiconductor Manufacturing Limited does not assume any responsibility for use of any its products for any
cations herein. BCD Semiconductor Manufacturing Limited does not assume any responsibility for use of any its products for any
particular purpose, nor does BCD Semiconductor Manufacturing Limited assume any liability arising out of the application or use
particular purpose, nor does BCD Semiconductor Manufacturing Limited assume any liability arising out of the application or use
of any its products or circuits. BCD Semiconductor Manufacturing Limited does not convey any license under its patent rights or
of any its products or circuits. BCD Semiconductor Manufacturing Limited does not convey any license under its patent rights or
other rights nor the rights of others.
other rights nor the rights of others.
http://www.bcdsemi.com
MAIN SITE
MAIN SITE
- Headquarters
BCD Semiconductor Manufacturing Limited
BCD Semiconductor Manufactur ing Limited
- Wafer Fab
No. 1600, Zi Xing Road, Shanghai ZiZhu Science-based Industrial Park, 200241, China
Shanghai SIM-BCD Semiconductor Manufacturing Limited
Tel: +86-21-24162266, Fax: +86-21-24162277
800, Yi Shan Road, Shanghai 200233, China
Tel: +86-21-6485 1491, Fax: +86-21-5450 0008
REGIONAL SALES OFFICE
Shenzhen Office
REGIONAL SALES OFFICE
Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd., Shenzhen Office
Shenzhen Office
Unit A Room 1203, Skyworth Bldg., Gaoxin Ave.1.S., Nanshan District, Shenzhen,
Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd. Shenzhen Office
China
Advanced Analog Circuits (Shanghai) Corporation Shenzhen Office
Tel: +86-755-8826 7951
Room E, 5F, Noble Center, No.1006, 3rd Fuzhong Road, Futian District, Shenzhen 518026, China
Fax: +86-755-8826 7865
Tel: +86-755-8826 7951
Fax: +86-755-8826 7865
- Wafer Fab
BCD Semiconductor Manufacturing Limited
Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd.
- IC Design Group
800 Yi Shan Road, Shanghai 200233, China
Advanced Analog Circuits (Shanghai) Corporation
Tel: +86-21-6485 1491, Fax: +86-21-5450 0008
8F, Zone B, 900, Yi Shan Road, Shanghai 200233, China
Tel: +86-21-6495 9539, Fax: +86-21-6485 9673
Taiwan Office
BCD Semiconductor (Taiwan) Company Limited
Taiwan Office
4F, 298-1, Rui Guang Road, Nei-Hu District, Taipei,
BCD Semiconductor (Taiwan) Company Limited
Tai wan
4F, 298-1, Rui Guang Road, Nei-Hu District, Taipei,
Tel: +886-2-2656 2808
Taiwan
Fax: +886-2-2656 2806
Tel: +886-2-2656 2808
Fax: +886-2-2656 2806
USA Office
BCD Semiconductor Corp.
USA Office
30920 Huntwood Ave. Hayward,
BCD Semiconductor Corporation
CA 94544, USA
30920 Huntwood Ave. Hayward,
Tel : +1-510-324-2988
CA 94544, U.S.A
Fax: +1-510-324-2788
Tel : +1-510-324-2988
Fax: +1-510-324-2788
Loading...