The AUR9713 is a high efficiency step-down
DC-DC voltage converter. The chip operation is
optimized using constant frequency, peak-current
mode architecture with built-in synchronous power
MOS switchers and internal compensators to reduce
external part counts. It is automatically switching
between the normal PWM mode and LDO mode to
offer improved system power efficiency covering a
wide range of loading conditions.
The oscillator and timing capacitors are all built-in
providing an internal switching frequency of
1.5MHz that allows the use only small surface mount
inductors and capacitors for portable product
implementations. Additional features included
integrated Soft Start (SS), Under Voltage Lock OUT
(UVLO).
The device is available in adjustable output voltage
versions ranging from 1V to 3.3V, and is able to
deliver up to 1A.
The AUR9713 is available in TSOT-23-5 package.
Features
• High Efficiency Buck Power Converter
• Low Quiescent Current
• Output Current: 1A
• Adjustable Output Voltage from 1V to 3.3V
• Wide Operating Voltage Range: 2.5V to 5.5V
•
Built-in Power Switches for Synchronous
Rectification with High Efficiency
• Feedback Voltage: 600mV
• 1.5MHz Constant Frequency Operation
• Automatic PWM/LDO Mode Switching Control
• Thermal Shutdown Protection
• Low Drop-out Operation at 100% Duty Cycle
• No Schottky Diode Required
Applications
• Mobile Phone, Digital Camera and MP3 Player
• Headset, Radio and Other Hand-held Instrument
• Post DC-DC Voltage Regulation
• PDA and Notebook Computer
TSOT-23-5
Figure 1. Package Type of AUR9713
Mar. 2012 Rev. 1. 1 BCD Semiconductor Manufacturing Limited
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Page 2
Data Sheet
1.5MHz, 1A, STEP DOWN DC-DC CONVERTER AUR9713
Pin Configuration
H Package
(TSOT-23-5)
EN
GND
LX
Figure 2. Pin Configuration of AUR9713 (Top View)
1
2
34
5
FB
VIN
Pin Description
Pin Number Pin Name Function
1 EN Enable signal input, active high
2 GND
3 LX Connected to inductor
This pin is the GND reference for the NMOS power stage. It
must be connected to the system ground
4 VIN Power supply input
5 FB Feedback voltage from the output
Mar. 2012 Rev. 1. 1 BCD Semiconductor Manufacturing Limited
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Data Sheet
1.5MHz, 1A, STEP DOWN DC-DC CONVERTER AUR9713
Functional Block Diagram
Figure 3. Functional Block Diagram of AUR9713
Ordering Information
AUR9713
Circuit Type
A: Adjustable Output
Package
TSOT-23-5 -40 to 80°C AUR9713AGH 9713AG Tape & Reel
Temperature
Range
Part Number Marking ID Packing Type
BCD Semiconductor's Pb-free products, as designated with "G" in the part number, are RoHS compliant and
green.
Mar. 2012 Rev. 1. 1 BCD Semiconductor Manufacturing Limited
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Package
H: TSOT-23-5
G: Green
Page 4
Data Sheet
1.5MHz, 1A, STEP DOWN DC-DC CONVERTER AUR9713
Absolute Maximum Ratings (Note 1)
Parameter Symbol Value Unit
Supply Input Voltage VIN
Enable Input Voltage VEN
Output Voltage V
Power Dissipation (On PCB, TA=30°C) PD
Thermal Resistance (Junction to Ambient, Simulation) θJA
Thermal Resistance (Junction to Case, Simulation) θJC
Operating Junction Temperature TJ
Operating Temperature TO
Storage Temperature TS
ESD (Human Body Model) V
ESD (Machine Model) VMM
Note 1: Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to
the device. These are stress ratings only, and functional operation of the device at these or any other conditions
beyond those indicated under “Recommended Operating Conditions” is not implied. Exposure to “Absolute
Maximum Ratings” for extended periods may affect device reliability.
OUT
HBM
0 to 6.5
-0.3 to VIN+0.3
-0.3 to VIN+0.3
0.96
98.4
35.2
160
-40 to 85
-55 to 150
2000
200
V
V
V
W
°C/W
°C/W
°C
°C
°C
V
V
Recommended Operating Conditions
Parameter Symbol Min Max Unit
Supply Input Voltage VIN 2.5 5.5 V
Junction Temperature Range TJ -20 125 °C
Ambient Temperature Range TA -40 80 °C
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Data Sheet
1.5MHz, 1A, STEP DOWN DC-DC CONVERTER AUR9713
Electrical Characteristics
VIN=3.6V, V
Parameter Symbol Conditions MinTyp Max Unit
Input Voltage Range VIN 2.5 5.5 V
=2.5V, V
OUT
=0.6V, L=2.2µH, CIN=4.7µF, C
REF
=10µF, TA=25°C, I
OUT
MAX
=1A.
Shutdown Current I
Regulated1Feedback
Voltage
Regulated Output
Voltage Accuracy
∆V
Peak Inductor
Current
Oscillator Frequency f
PMOSFET RON R
NMOSFET RON R
Quiescent Current IQ I
LX Leakage Current ILX
V
OFF
For Adjustable Output Voltage 0.5850.6 0.615 V
V
FB
OUT/VOUT
I
OSC
ON(P)
ON(N)
PK
V
VIN=3.6V, I
VIN=2.5V, I
=0 0.1 1 µA
EN
=2.5V to 5.5V;
V
IN
=0 to 1A
I
OUT
V
=3V, VFB=0.5V or
IN
=90%, Duty Cycle<35%
V
OUT
=3.6V 1.2 1.5 1.8 MHz
IN
=200mA 0.28 Ω
OUT
=200mA 0.38 Ω
OUT
=0mA, VFB=V
LOAD
=5V, VEN=0V, VLX=0V or
V
IN
+5% 100 µA
REF
5V
-3 3 %
1.5 A
0.01 0.1 µA
Feedback Current IFB 30 nA
EN Leakage Current IEN 0.01 0.1 µA
EN High-level Input
Voltage
EN Low-Level Input
Voltage
Under Voltage Lock
Out
VIN=2.5V to 5.5V 1.5 V
V
EN_H
V
V
EN_L
=2.5V to 5.5V 0.6 V
IN
1.8 V
Hysteresis 0.1 V
Thermal Shutdown TSD 150 °C
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Data Sheet
1.5MHz, 1A, STEP DOWN DC-DC CONVERTER AUR9713
Typical Performance Characteristics
Figure 4. Efficiency vs. Output Current Figure 5. Efficiency vs. Load Current
Figure 6. Efficiency vs. Load Current Figure 7. LDO Mode Efficiency vs. Load Current
Mar. 2012 Rev. 1. 1 BCD Semiconductor Manufacturing Limited
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Data Sheet
1.5MHz, 1A, STEP DOWN DC-DC CONVERTER AUR9713
Typical Performance Characteristics (Continued)
Figure 8. Output Voltage vs. Output Current
Figure 10. Output Voltage vs. Temperature Figure 11. Frequency vs. Temperature
Figure 9. UVLO Threshold vs. Temperature
Mar. 2012 Rev. 1. 1 BCD Semiconductor Manufacturing Limited
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Data Sheet
1.5MHz, 1A, STEP DOWN DC-DC CONVERTER AUR9713
Typical Performance Characteristics (Continued)
Figure 12. Frequency vs. Input Voltage Figure 13. Output Current Limit vs. Temperature
V
OUT
200mV/div
VLX
2V/div
VEN
2V/div
Time 400ns/div
Figure 14. Frequency vs. Input Voltage Figure 15. Waveform of V
=4.5V, V
IN
=1.5V, L=2.2µH
OUT
Mar. 2012 Rev. 1. 1 BCD Semiconductor Manufacturing Limited
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Data Sheet
1.5MHz, 1A, STEP DOWN DC-DC CONVERTER AUR9713
Typical Performance Characteristics (Continued)
VEN
2V/div
V
OUT
1V/div
V
LX
2V/div
Time 200µs/div
Figure 16. Soft Start
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Data Sheet
1.5MHz, 1A, STEP DOWN DC-DC CONVERTER AUR9713
Application Information
The basic AUR9713 application circuit is shown in
Figure 18, external components selection is determined
by the load current and is critical with the selection of
inductor and capacitor values.
1. Inductor Selection
For most applications, the value of inductor is chosen
based on the required ripple current with the range of
2.2µH to 4.7µH.
I−
1
=∆
V
OUTL
Lf
×
The largest ripple current occurs at the highest input
voltage. Having a small ripple current reduces the ESR
loss in the output capacitor and improves the efficiency.
The highest efficiency is realized at low operating
frequency with small ripple current. However, larger
value inductors will be required. A reasonable starting
point for ripple current setting is △I
maximum ripple current stays below a specified
value, the inductor should be chosen according to the
following equation:
=
L
V
[
OUT
MAXIf
∆×
L
The DC current rating of the inductor should be at
least equal to the maximum output current plus half
the highest ripple current to prevent inductor core
saturation. For better efficiency, a lower
DC-resistance inductor should be selected.
2. Capacitor Selection
The input capacitance, CIN, is needed to filter the
trapezoidal current at the source of the top MOSFET.
To prevent large ripple voltage, a low ESR input
capacitor sized for the maximum RMS current must
be used. The maximum RMS capacitor current is
given by:
It indicates a maximum value at V
I
RMS=IOUT
commonly used for design because even significant
Mar. 2012 Rev. 1. 1 BCD Semiconductor Manufacturing Limited
II
×=
OMAXRMS
/2. This simple worse-case condition is
V
OUT
)1(
V
IN
=40%I
L
V
1][
)(
V
OUT
−
MAXV
IN
VVV
)]([−
OUTINOUT
IN
=2V
IN
1
2
MAX
]
)(
OUT
. For a
, where
deviations do not much relieve. The selection of C
is determined by the Effective Series Resistance
(ESR) that is required to minimize output voltage
ripple and load step transients, as well as the amount
of bulk capacitor that is necessary to ensure that the
control loop is stable. Loop stability can be also
checked by viewing the load step transient response
as described in the following section. The output
ripple, △V
, is determined by:
OUT
[
ESRIV
LOUT
+∆≤∆
8
1
××
]
Cf
OUT
The output ripple is the highest at the maximum input
voltage since △I
increases with input voltage.
L
3. Load Transient
A switching regulator typically takes several cycles to
respond to the load current step. When a load step
occurs, V
to △I
resistance of output capacitor. △I
charge or discharge C
signal used by the regulator to return V
immediately shifts by an amount equal
OUT
×ESR, where ESR is the effective series
LOAD
also begins to
LOAD
generating a feedback error
OUT
OUT
steady-state value. During the recovery time, V
can be monitored for overshoot or ringing that would
indicate a stability problem.
4. Output Voltage Setting
The output voltage of AUR9713 can be adjusted by a
resistive divider according to the following formula:
VV
REFOUT
R
1
R
2
V
The resistive divider senses the fraction of the output
voltage as shown in Figure 17.
VOUT
R1
R2
FB
AUR9713
GND
Figure 17. Setting the Output Voltage
10
R
1
+×=+×=
R
2
OUT
to its
OUT
)1(6.0)1(
Page 11
+×=
Data Sheet
1.5MHz, 1A, STEP DOWN DC-DC CONVERTER AUR9713
Application Information (Continued)
5.Efficiency Considerations
The efficiency of switching regulator is equal to the
output power divided by the input power times 100%.
It is usually useful to analyze the individual losses to
determine what is limiting efficiency and which
change could produce the largest improvement.
Efficiency can be expressed as:
Efficiency=100%-L1-L2-…..
Where L1, L2, etc. are the individual losses as a
percentage of input power.
Although all dissipative elements in the regulator
produce losses, two major sources usually account for
most of the power losses: V
2
I
R losses. The VIN quiescent current loss dominates
the efficiency loss at very light load currents and the
2
I
R loss dominates the efficiency loss at medium to
heavy load currents.
5.1 The V
quiescent current loss comprises two
IN
parts: the DC bias current as given in the electrical
characteristics and the internal MOSFET switch gate
charge currents. The gate charge current results from
switching the gate capacitance of the internal power
MOSFET switches. Each cycle the gate is switched
from high to low, then to high again, and the packet
of charge, dQ moves from V
resulting dQ/dt is the current out of V
typically larger than the internal DC bias current. In
continuous mode,
QQfI+×=
Where Q
and QN are the gate charge of power
P
PMOSFET and NMOSFET switches. Both the DC
bias current and gate charge losses are proportional to
the V
input voltages.
5.2 I
resistance, R
and this effect will be more serious at higher
IN
2
R losses are calculated from internal switch
and external inductor resistance RL.
SW
In continuous mode, the average output current
flowing through the inductor is chopped between
power PMOSFET switch and NMOSFET switch.
Then, the series resistance looking into the LX pin is
quiescent current and
IN
to ground. The
IN
)(
NPGATE
that is
IN
a function of both PMOSFET R
and NMOSFET
DS(ON)
R
Therefore, to obtain the I
R
resistance and the duty cycle (D):
DS(ON)
)(
DRDRR
−×
()()
2
R losses, simply add RSW to
and multiply the result by the square of the
L
1
NONDSPONDSSW
average output current.
Other losses including C
and C
IN
ESR dissipative
OUT
losses and inductor core losses generally account for
less than 2 % of total additional loss.
6. Thermal Characteristics
In most applications, the part does not dissipate much
heat due to its high efficiency. However, in some
conditions when the part is operating in high ambient
temperature with high R
resistance and high
DS(ON)
duty cycles, such as in LDO mode, the heat
dissipated may exceed the maximum junction
temperature. To avoid the part from exceeding
maximum junction temperature, the user should do
some thermal analysis. The maximum power
dissipation depends on the layout of PCB, the thermal
resistance of IC package, the rate of surrounding
airflow and the temperature difference between
junction and ambient.
7. PCB Layout Considerations
When laying out the printed circuit board, the
following checklist should be used to optimize the
performance of AUR9713.
1) The power traces, including the GND trace, the LX
trace and the VIN trace should be kept direct, short
and wide.
2) Put the input capacitor as close as possible to the
VIN and GND pins.
3) The FB pin should be connected directly to the
feedback resistor divider.
4) Keep the switching node, LX, away from the
sensitive FB pin and the node should be kept small
area.
Mar. 2012 Rev. 1. 1 BCD Semiconductor Manufacturing Limited
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Data Sheet
1.5MHz, 1A, STEP DOWN DC-DC CONVERTER AUR9713
Typical Application
Note 3:
When R2=300kΩ to 60 kΩ, the I
component selection.
VV
REFOUT
+×= ;
V
OUT
3.3 450 100 13 2.2
R
1
)1(
R
2
=2µA to 10µA, and R1×C1 should be in the range between 3×10
R2
Figure 18. Typical Application Circuit of AUR9713
Table 1. Component Guide
(V)
R1 (kΩ)R2 (kΩ)
C1 (pF)
L1 (µH)
-6
and 6×10-6 for
2.5 320 100 18 2.2
1.8 200 100 30 2.2
1.2 100 100 56 2.2
1.0 66 100 91 2.2
Mar. 2012 Rev. 1. 1 BCD Semiconductor Manufacturing Limited
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Data Sheet
1.5MHz, 1A, STEP DOWN DC-DC CONVERTER AUR9713
Mechanical Dimensions
TSOT-23-5 Unit: mm(inch)
5
°
4
X
7
°
GAUGE PLANE
Mar. 2012 Rev. 1. 1 BCD Semiconductor Manufacturing Limited
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BCD Semiconductor Manufacturing Limited
IMPORTANT NOTICE
IMPORTANT NOTICE
BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifi-
BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifi-
cations herein. BCD SemiconductorManufacturing Limited does not assume any responsibility for use of any its products for any
cations herein. BCD Semiconductor Manufacturing Limited does not assume any responsibility for use of any its products for any
particular purpose, nordoes BCD Semiconductor Manufacturing Limited assume anyliability arising out ofthe application or use
particular purpose, nor does BCD Semiconductor Manufacturing Limited assume any liability arising out of the application or use
of any its products or circuits. BCD Semiconductor Manufacturing Limited does not convey any license under its patent rights or
of any its products or circuits. BCD Semiconductor Manufacturing Limited does not convey any license under its patent rights or
other rights nor the rights of others.
other rights nor the rights of others.
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