Diodes AP2501, AP2511 User Manual

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AP2501/AP2511

2.5A SINGLE CHANNEL CURRENT-LIMITED POWER SWITCH

Description

The AP2501 and AP2511 are single channel current-limited

integrated high-side power switches optimized for Universal Serial

Bus (USB) and other hot-swap applications. The family of devices

complies with USB standards and is available with both polarities of

Enable input.

The devices have fast short-circuit response time for improved

overall system robustness, and have integrated output discharge

function to ensure completely controlled discharging of the output

voltage capacitor. They provide a complete protection solution for

applications subject to heavy capacitive loads and the prospect of

short circuit, and offer reverse current blocking, over-current, over-

temperature and short-circuit protection, as well as controlled rise

time and under-voltage lockout functionality. A 7ms deglitch

capability on the open-drain Flag output prevents false over-current

reporting and does not require any external components.

All devices are available in SO-8, MSOP-8, MSOP-8EP,

U-DFN3030-8 and U-DFN2020-6 packages.

Features

 Single channel current-limited power switch

 Output discharge function

 Fast short-circuit response time: 2µs

 3.7A accurate current limiting (typ)

 Reverse current blocking

 70mΩ on-resistance (typ)

 Input voltage range: 2.7V – 5.5V

 Built-in soft-start with 0.6ms typical rise time

 Over-current and thermal protection

 Fault report (FLG) with blanking time (7ms typ)

 ESD protection: 2kV HBM, 200V MM

 Active low (AP2501) or active high (AP2511) enable

 Ambient temperature range: -40°C to +85°C

 SO-8, MSOP-8, MSOP-8EP, U-DFN3030-8 and U-DFN2020-6:

Available in “Green” Molding Compound (No Br, Sb)

 Lead-Free Finish; RoHS Compliant (Notes 1 & 2)

 Halogen and Antimony Free. “Green” Device (Note 3)

 UL Recognized, File Number E322375

 IEC60950-1 CB Scheme Certified

Notes: 1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied.

2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.

3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.

Pin Assignments

(Top View)

GND

IN IN

EN

1

2

3

4

8

7

6

5

NC

OUT OUT

FLG

U-DFN3030-8

Typ e E

(Top View)

GND

IN

EN

U-DFN2020-6

Note: Latter with exposed pad

Applications

 LCD TVs & Monitors

 Set-Top-Boxes, Residential Gateways

 Laptops, Desktops, Servers, e-Readers

 Printers, Docking Stations, HUBs

(Top View)

GND

IN

EN

(SO-8)

(Top View)

1

2

3

4

MSOP-8/MSOP-8EP

(dotted line)

NC

OUT

FLG

NC

8

OUT

7

6

OUT

5

FLG

AP2501/AP2511

Document number: DS35577 Rev. 6 - 2

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March 2013

Typical Applications Circuit

Enable Active High (AP2511)

Power Supply

2.7V to 5.5V

10k

Available Options

Part Number Channel

AP2501 1 Active Low

AP2511 1 Active High

Enable Pin

(EN)

OFF

IN

0.1uF

FLG

ON

EN

Recommended Maximum

Continuous Load Current (A)

OUT

GND

2.5A 3.7A

0.1uF 120uF

Typical Current Limit

(A)

AP2501/AP2511

Load

Package

SO-8

MSOP-8

MSOP-8EP U-DFN3030-8 U-DFN2020-6

Pin Descriptions

Pin Number

Pin Name

GND 1 1 2 Ground

IN 2, 3 2, 3

EN 4 4 3 Enable Input. Active low (AP2501) or active high (AP2511).

FLG 5 5

OUT 6, 7 6, 7 5 Voltage Output Pin (all OUT pins must be tied together externally)

NC 8 8 6 No internal connection; recommend tie to OUT pins.

Exposed Pad Exposed Pad Not applicable Exposed Pad

MSOP-8EP,

U-DFN3030-8

AP2501/AP2511

Document number: DS35577 Rev. 6 - 2

SO-8,

MSOP-8

U-DFN2020-6

1 Voltage Input Pin. Connect a 0.1µF or larger ceramic capacitor from IN to

GND as close as possible. (all IN pins must be tied together externally)

4 Over-temperature and over-current fault reporting with 7ms deglitch; active

low open-drain output. FLG is disabled for 7ms after turn-on.

Exposed pad. It should be externally connected to GND and thermal mass for enhanced thermal impedance. It should not be used as electrical ground conduction path.

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Function

March 2013

Functional Block Diagram

AP2501/AP2511

IN

UVLO

Current

Sense

Discharge

OUT

Control

EN

Driver

Thermal

Current

Limit

FLG

Deglitch

Sense

GND

Absolute Maximum Ratings (@T

= +25°C, unless otherwise specified.)

A

Symbol Parameter Rating Unit

ESD HBM Human Body Model ESD Protection 2 kV

ESD MM Machine Model ESD Protection 200 V

VIN Input Voltage (Note 4) -0.3 to +6.5 V

V

Output Voltage (Note 4) -0.3 to 6.5 or VIN +0.3 V

OUT

V

Enable Voltage (Note 4) -0.3 to 6.5 or VIN +0.3 V

EN , VFLG

I

Maximum Continuous Load Current Internal Limited A

LOAD

T

Maximum Junction Temperature 150 °C

JMAX

TST Storage Temperature Range (Note 5) -65 to +150 °C

Notes: 4. All voltages referred to GND pin. Maximums are the lower of VIN + 0.3 and 6.5V

5. UL Recognized Rating from -30°C to +70°C (Diodes qualified T

Caution: Stresses greater than the 'Absolute Maximum Ratings' specified above, may cause permanent damage to the device. These are stress ratings only; functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability may be affected by exposure to absolute maximum rating conditions for extended periods of time.

Semiconductor devices are ESD sensitive and may be damaged by exposure to ESD events. Suitable ESD precautions should be taken when handling and transporting these devices

from -65°C to +150°C)

ST

Recommended Operating Conditions (@T

= +25°C, unless otherwise specified.)

A

Symbol Parameter Min Max Unit

V

IN

I

OUT

VIH High-Level Input Voltage on EN 2.0 VIN V

VIL Low-Level Input Voltage on EN 0 0.8 V

TA Operating Ambient Temperature (Note 6), -40 +85 °C

Input voltage 2.7 5.5 V

Output Current 0 2.5 A

Note: 6. T

AP2501/AP2511

Document number: DS35577 Rev. 6 - 2

A(MAX)

= +70°C if V

≤ 4.1V and I

IN

= 2.5A to keep device from going into thermal protection.

OUT

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AP2501/AP2511

Electrical Characteristics (@ T

Symbol Parameter Conditions (Note 7) Min Typ Max Unit

V

Input UVLO VIN rising 1.6 2.0 2.4 V

UVLO

ΔV

Input UVLO Hysteresis VIN decreasing 50 mV

UVLO

I

R

I

SHORT

T

I

LEAK-EN

I

LEAK-O

T

R

T

Notes: 7. Pulse-testing techniques maintain junction temperature close to ambient temperature; thermal effects must be taken into account separately.

8. The discharge function is active when the device is disabled (when enable is de-asserted or during power-up power-down when V discharge function offers a resistive discharge path for the external storage capacitor for limited time.

9. Device mounted on 2” x 2” FR-4 substrate PCB, 2oz copper, with minimum recommended pad layout.

10. Device mounted on 2” x 2” FR-4 substrate PCB, 2oz copper, with minimum recommended pad on top layer and thermal vias to bottom layer ground plane.

11. Device mounted on 1"x1" FR-4 substrate PCB, 2oz copper, with minimum recommended padon top layer and thermal vias to bottom layer ground

Input Shutdown Current Disabled, OUT = open 0.1 1.0 µA

SHDN

I

Input Quiescent Current Enabled, OUT = open 60 100 µA

Q

Input Leakage Current Disabled, OUT grounded 0.1 1.0 µA

LEAK

I

Reverse Leakage Current Disabled, V

REV

Switch on-resistance

DS(ON)

Over-Load Current Limit (Note 7) V

LIMIT

I

Current limiting trigger threshold Output Current Slew rate (<100A/s) 3.7 A

TRIG

Short-Circuit Current Limit Enabled into short circuit 3.7 A

Short-Circuit Response Time V

SHORT

V

EN Input Logic Low Voltage VIN = 2.7V to 5.5V 0.8 V

IL

V

EN Input Logic High Voltage VIN = 2.7V to 5.5V 2 V

IH

EN Input leakage VIN = 5V, V

Output leakage current Disabled, V

Output turn-on delay time CL = 1µF, R

D(ON)

TR Output turn-on rise time CL = 1µF, R

Output turn-off delay time CL = 1µF, R

D(OFF)

TF Output turn-off fall time CL = 1µF, R

FLG output FET on-resistance I

FLG

I

FLG Off Current V

FOH

FLG Blanking Time

BLANK

T

Discharge time CL= 1µF, VIN = 5V, disabled to V

DIS

R

Discharge resistance (Note 8) VIN = 5V, disabled, I

DIS

Thermal Shutdown Threshold Enabled 140

SHDN

Thermal Shutdown Hysteresis 20

HYS

Thermal Resistance Junction-to-

θJA

Ambient

= +25°C, VIN = +5.0V, C

A

= 0V, V

IN

V

= 5V, I

IN

VIN = 3.3V, I

= 5V, V

IN

= 0V to I

OUT

= 10mA 20 40 Ω

FLG

= 5V 0.01 1.00 µA

FLG

= 1A

OUT

= 4.5V -40°C≤ TA ≤85°C 2.8 3.7 4.6 A

OUT

= 0V and 5.5V 0.01 1.00 µA

EN

= 0V 0.5 1 µA

OUT

LOAD

Assertion or deassertion due to overcurrent and over-temperature condition

= 0.1µF, CL = 1µF,unless otherwise specified.)

IN

OUT

= 5V, I

at VIN 0.01 1.00 µA

REV

= 25oC 70 78

T

A

-40°C ≤ TA ≤ 85°C 105

= 25oC 90 108

T

= 1A

= I

(OUT shorted to ground) 2 µs

LIMIT

A

-40°C ≤ TA ≤ 85°C 135

= 5Ω 0.1 ms

= 5Ω 0.6 1.5 ms

= 5Ω 0.1 ms

= 5Ω 0.05 0.10 ms

4 7 15 ms

< 0.5V 0.6 ms

OUT

= 1mA 100 Ω

OUT

SO-8 (Note 9) 96

MSOP-8 (Note 9) 130

MSOP-8EP (Note 10) 92

U-DFN3030-8 (Note 10) 84

U-DFN2020-6 (Note 11) 90

mΩ

C

C/W

< V

UVLO

). The

IN

AP2501/AP2511

Document number: DS35577 Rev. 6 - 2

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Typical Performance Characteristics

AP2501/AP2511

V

EN

V

OUT

50%

T

D(ON)

T

10%

R

Turn-On Delay and Rise Time

Vout 2V/div

Ven 5V/div

Iin 1A/div

Device Enable

V

EN

V

OUT

50%

T

D(ON)

90%

50%

T

D(OFF)

90%

10%

T

F

Figure 1 Voltage Waveforms: AP2501 (left), AP2511 (right)

All Enable Plots are for Enable Active Low

Turn-Off Delay and Fall Time

TA=25°C Vin=5V CL=1uF Rout=2.5Ω

Vout 2V/div

Ven 5V/div

Device Disable

Iin 1A/div

T

10%

50%

T

R

90%

D(OFF)

90%

10%

TA=25°C Vin=5V CL=1uF Rout=2.5Ω

T

F

Turn-On Delay and Rise Time

Vout 2V/div

Device Enable Ven 5V/div

Iin 1A/div

AP2501/AP2511

Document number: DS35577 Rev. 6 - 2

TA=25°C Vin=5V CL=120uF Rout=2.5Ω

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Turn-Off Delay and Fall Time

Vout 2V/div

Ven 5V/div

Device Disable

Iin 1A/div

TA=25°C Vin=5V CL=120uF Rout=2.5Ω

March 2013

Typical Performance Characteristics (cont.)

Device Enabled Into Short-Circuit

AP2501/AP2511

Inrush Current

Ven 5V/div

Iin 1A/div

Vout 2V/div

Iin 2A/div

FLG 5V/div

Full-Load to Short-Circuit

Transient Response

Output Short Circuit

Device Turns off and Re-enables Into Current-Limit

TA=25°C Vin=5V CL=120uF Rout=1Ω

TA=25°C Vin=5V Rout=2Ω

Ven 5V/div

CL=220uF

Iin 1A/div

CL=470uF

CL=120uF

Short-Circuit to Full-Load

Recovery Response

Output Short Circuit Removed

Vout 2V/div

Iin 2A/div

FLG 5V/div

Short Circuit Present Device Thermal Cycles

TA=25°C Vin=5V CL=120uF,220uF,470uF Rout=2.5Ω

=25°C

T

A

Vin=5V Rout=2Ω

No-Load to Short-Circuit

Transient Response

Vout 2V/div

Iin 2A/div

FLG 5V/div

Output Short Circuit

Device Enable Current-Limit

AP2501/AP2511

Document number: DS35577 Rev. 6 - 2

TA=25°C Vin=5V

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Short-Circuit to No-Load

Recovery Response

Output Short Circuit Removed Vout

2V/div

Iin 2A/div

Short Circuit Present Device

FLG 5V/div

Thermal Cycles

=25°C

T

A

Vin=5V

March 2013

Typical Performance Characteristics (cont.)

Power ON

FLG 5V/div

Iout 1A/div

Vout 5V/div

Vin 5V/div

TA=25°C Vin=5V Rout=2.5Ω CL=120uF

AP2501/AP2511

Short-Circuit with Blanking Time and

Recovery

FLG 5V/div

Vout 5V/div

Iout 2A/div

=25°C

T

A

Vin=5V

UVLO Increasing

Vout 2V/div

Vin 2A/div

AP2501/AP2511

Document number: DS35577 Rev. 6 - 2

TA=25°C Vin=5V Rout=33Ω CL=120uF

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Vout 2A/div

Vin 2V/div

UVLO Decreasing

TA=25°C Vin=5V Rout=33Ω CL=120uF

March 2013

TUR

N-OFF T

RN-O

UPPLY

C

U

R

N

T OUT

P

U

T

U

RN-O

M

E

AP2501/AP2511

Typical Performance Characteristics (cont.)

150 140

130 120

110 100

(µs)

90

80

N TI

70 60

50

T

40 30

20 10

0

3.53.02.0 2.5 6.05.04.0 4.5 5.5

C = 1µF

L

R = 5



L

T = 25°C

A

INPUT VOLTAGE (V)

Turn-On Time vs. Input Voltage

1000

900

800

700

600

500

N TIME (µs)

400

300

TU

200

100

0

3.53.02.0 2.5 6.05.04.0 4.5 5.5

C = 1µF

L



R = 5

L

T = 25°C

A

INPUT VOLTAGE (V)

Rise Time vs. Input Voltage

100

V = 5.5V

90

80

V = 5V

IN

70

60

V = 2.7V

50

V =3.3V

IN

40

30

20

10

SUPPLY CURRENT OUTPUT ENABLED (µA)

0

-50 -25 0 25 50 75 100 125

Supply Current, Output Enabled vs. Temperature

TEMPERATURE ( C)

AP2501/AP2511

Document number: DS35577 Rev. 6 - 2



www.diodes.com

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200

180

160

140

120

IME (µs)

100

80

60

40

20

0

3.53.02.0 2.5 6.05.04.0 4.5 5.5

INPUT VOLTAGE (V)

Turn-Off Time vs. Input Voltage

100

90

80

70

60

50

40

FAL L TIME (µs)

30

20

10

0

3.53.02.0 2.5 6.05.04.0 4.5 5.5

INPUT VOLTAGE (V)

Rise Time vs. Input Voltage

0.30

0.25

0.20

DISABLED (µA)

0.15

0.10

V = 5V

IN

V = 5.5V

0.05

0.00

-0.05

E

-0.10

V = 2.7V

IN

-0.15

-0.20

-0.25

-0.30

S

-50 -25 0 25 50 75 100 125 TEMPERATURE ( C)

Supply Current, Output Disabled vs. Temperature

C = 1µF

L

R = 5



L

T = 25°C

A

C = 1µF

L



R = 5

L

T = 25°C

A

IN

V =3.3V

IN



March 2013

U

NDERVOLTAG

O

CKOUT

2

THRESH

O

T

RIP CUR

RENT

5

Typical Performance Characteristics (cont.)

180 170 160 150 140 130 120



110 100

90 80

DS(ON)

R (m)

70 60 50 40 30 20 10

0

-50

V = 2.7V

IN

V =3.3V

IN

V = 5.5V

IN

V = 5V

IN

-25

0255075100125 TEMPERATURE ( C)

R vs. Temperature

DS(ON)



AP2501/AP2511

4.5

4.4

4.3

4.2

V =3.3V

IN

4.1

4.0

3.9

3.8

3.7

V = 5V

IN

3.6

3.5

3.4 33

3.2

3.1

SHORT-CIRCUIT OUTPUT CURRENT(A)

3.0

-25

-50

0255075 100 125

TEMPERATURE ( C)

Short-Circuit Output Current vs. Temperature

V = 2.7V

IN

V = 5.5V

IN



(V)

E L

2.

2.1

2.0

UVLO Rising

1.9

UVLO Falling

1.8

1.7

1.6

-50

-25

0255075100125 TEMPERATURE ( C)

Undervoltage Lockout vs. Temperature



4.

C = 120µF

4.4

(A)

4.3

L

T = 25°C

A

4.2

4.1

4.0

3.9

LD

3.8

3.7

3.6

3.5

2.5

2.0

3.5 4.0 4.5 5.0 5.5 6.03.0

INPUT VOLTAGE (V)

Threshold Trip Current vs. Input Voltage

AP2501/AP2511

Document number: DS35577 Rev. 6 - 2

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AP2501/AP2511

Application Note

Power Supply Considerations

A 0.1μF to 2.2μF X7R or X5R ceramic bypass capacitor placed between IN and GND, close to the device, is recommended. When an external

power supply is used, or an additional ferrite bead is added to the input, high inrush current may cause voltage spikes higher than the device

maximum input rating during short circuit condition. In this case a 2.2μF or bigger capacitor is recommended. Placing a high-value electrolytic

capacitor on the input and output pin(s) is recommended when the output load is heavy. This precaution reduces power-supply transients that

may cause ringing on the input. Additionally, bypassing the output with a 0.1μF to 1.0μF ceramic capacitor improves the immunity of the device

to short circuit transients.

Over-Current and Short Circuit Protection

An internal sensing FET is employed to check for over-current conditions. Unlike current-sense resistors, sense FETs do not increase the

series resistance of the current path. When an over-current condition is detected, the device maintains a constant output current and reduces

the output voltage accordingly. Complete shutdown occurs only if the fault stays long enough to activate thermal limiting.

Three possible overload conditions can occur. In the first condition, the output has been shorted to GND before the device is enabled or before

VIN has been applied. The AP2501/AP2511 senses the short circuit and immediately clamps output current to a certain safe level namely I

LIMIT

.

In the second condition, an output short or an overload occurs while the device is enabled. At the instance the overload occurs, higher inrush

current may flow for a very short period of time before the current limit function can react. The input capacitor(s) rapidly discharge through the

device, activating current limit circuitry. Protection is achieved by momentarily opening the P-MOS high-side power switch and then

gradually turning it on. After the current limit function has tripped (reached the over-current trip threshold), the device switches into current

limiting mode and the current is clamped at I

LIMIT

.

In the third condition, the load has been gradually increased beyond the recommended operating current. The current is permitted to rise until

the current-limit threshold (I

) is reached or until the thermal limit of the device is exceeded. The AP2501/AP2511 is capable of delivering

TRIG

current up to the current-limit threshold without damaging the device. Once the threshold has been reached, the device switches into its current

limiting mode and is set at I

LIMIT

.

FLG Response

When an over-current or over-temperature shutdown condition is encountered, the FLG open-drain output goes active low after a nominal 7-ms

deglitch timeout. The FLG output remains low until both over-current and over-temperature conditions are removed.

Connecting a heavy capacitive load to the output of the device can cause a momentary over-current condition, which

does not trigger the FLG due to the 7-ms deglitch timeout. The AP2501/AP2511 is designed to eliminate false over-current reporting without the

need of external components to remove unwanted pulses.

Power Dissipation and Junction Temperature

The low on-resistance of the internal MOSFET allows the small surface-mount packages to pass large current. Using the maximum operating

ambient temperature (T

P

= R

D

DS(ON)

) and R

A

2

× I

, the power dissipation can be calculated by:

DS(ON)

Finally, calculate the junction temperature:

T

= PD x R

J

JA



+ TA

Where: T R P

= Ambient temperature C

A

= Thermal resistance

JA



= Total power dissipation

D

Thermal Protection

Thermal protection prevents the IC from damage when heavy-overload or short-circuit faults are present for extended periods of time. The

AP2501/AP2511 implements a thermal sensing to monitor the operating junction temperature of the power distribution switch. Once the die

temperature rises to approximately 140°C due to excessive power dissipation in an over-current or short-circuit condition the internal thermal

sense circuitry turns the power switch off, thus preventing the power switch from damage. Hysteresis is built into the thermal sense circuit

allowing the device to cool down approximately 20°C before the switch turns back on. The switch continues to cycle in this manner until the load

fault or input power is removed. The FLG open-drain output is asserted when an over-temperature shutdown or over-current occurs with 7-ms

deglitch.

AP2501/AP2511

Document number: DS35577 Rev. 6 - 2

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AP2501/AP2511

Application Note (cont.)

Under-voltage Lockout (UVLO)

Under-voltage lockout function (UVLO) keeps the internal power switch from being turned on until the power supply has reached at least 2V,

even if the switch is enabled. Whenever the input voltage falls below approximately 2V, the power switch is quickly turned off. This facilitates the

design of hot-insertion systems where it is not possible to turn off the power switch before input power is removed.

Discharge Function

The discharge function of the device is active when enable is disabled or de-asserted. The discharge function with the N-MOS power switch

implementation is activated and offers a resistive discharge path for the external storage capacitor. This is designed for discharging any residue

of the output voltage when either no external output resistance or load resistance is present at the output.

Ordering Information

Part Number Package Code Packaging

AP25X1S-13 S SO-8 2500/Tape & Reel -13

AP25X1M8-13 M8 MSOP-8 2500/Tape & Reel -13

AP25X1MP-13 MP MSOP-8EP 2500/Tape & Reel -13

AP25X1FGE-7 FGE U-DFN3030-8 3000/Tape & Reel -7

AP25X1SN-7 SN U-DFN2020-6 3000/Tape & Reel -7

Quantity Part Number Suffix

7”/13” Tape and Reel

Marking Information

(1) SO-8

AP2501/AP2511

Document number: DS35577 Rev. 6 - 2

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March 2013

Marking Information (cont.)

AP2501/AP2511

(2) MSOP-8

(3) MSOP-8EP

(4) U-DFN3030-8

(5) U-DFN2020-6

( Top View )

XX : Identification Code

Y

XX

W

XY

: Year : 0~9 : Week : A~Z : 1~26 week;

W

a~z : 27~52 week; z represents

52 and 53 week

: A~Z : Internal Code

X

Part Number Package Identification Code

AP2501FGE-7 U-DFN3030-8 BP

AP2511FGE-7 U-DFN3030-8 BR

( Top View )

XX : Identification Code

Y

XX

W

XY

: Year : 0~9

W

: Week : A~Z : 1~26 week;

a~z : 27~52 week; z represents

52 and 53 week

: A~Z : Internal Code

X

Part Number Package Identification Code

AP2501SN-7 U-DFN2020-6 DP

AP2511SN-7 U-DFN2020-6 DR

AP2501/AP2511

Document number: DS35577 Rev. 6 - 2

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March 2013

AP2501/AP2511

Package Outline Dimensions (All dimensions in mm.)

Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.

1. Package type: SO-8

2. Package type: MSOP-8

e

b

D

x

y

1

b

AP2501/AP2511

Document number: DS35577 Rev. 6 - 2

A2

e

A1

E1

A2

E

A1

A3

A

Gauge Plane

Seating Plane

A3

A

0.25

h

Detail ‘A’

°

45

4

x

1

Detail C

E3

E1

0.254

L

7°~9

4

x

1

0

°

L

0

°

See Detail C

www.diodes.com

Gauge Plane Seating Plane

°

Detail ‘A’

a

c

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Dim Min Max Typ

SO-8

Dim Min Max

A - 1.75 A1 0.10 0.20 A2 1.30 1.50 A3 0.15 0.25

b 0.3 0.5

D 4.85 4.95

E 5.90 6.10

E1 3.85 3.95

e 1.27 Typ

h - 0.35

L 0.62 0.82

0 8



All Dimensions in mm

MSOP-8

A - 1.10 A1 0.05 0.15 0.10 A2 0.75 0.95 0.86 A3 0.29 0.49 0.39

b 0.22 0.38 0.30

c 0.08 0.23 0.15 D 2.90 3.10 3.00 E 4.70 5.10 4.90

E1 2.90 3.10 3.00 E3 2.85 3.05 2.95

e - - 0.65

L 0.40 0.80 0.60

a 0° 8° 4°

x - - 0.750

y - - 0.750

All Dimensions in mm

March 2013

AP2501/AP2511

Package Outline Dimensions (cont.) (All dimensions in mm.)

Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.

3. Package type: MSOP-8EP

D

x

y

E

E2

D1

4. Package type: U-DFN3030-8 Type E

5. Package type: U-DFN2020-6

1

e

A1

A

D

8Xb

A3

A2

A

A1

E

E2

Z (x4)

E3

E1

D

D2

e

Pin#1 ID

A

A1

D

D2

D2/2

E

E2

e

AP2501/AP2511

Document number: DS35577 Rev. 6 - 2

b

Gauge Plane Seating Plane

See Detail C

b (x8)

A3

L

0.25

4

X

c

A3

L (x8)

SEATING PLANE

4

X

1

0

°

1

0

°

L

Detail C

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a

MSOP-8EP

Dim Min Max Typ

A - 1.10 A1 0.05 0.15 0.10 A2 0.75 0.95 0.86 A3 0.29 0.49 0.39

b 0.22 0.38 0.30

c 0.08 0.23 0.15

D 2.90 3.10 3.00 D1 1.60 2.00 1.80

E 4.70 5.10 4.90 E1 2.90 3.10 3.00 E2 1.30 1.70 1.50 E3 2.85 3.05 2.95

e - - 0.65

L 0.40 0.80 0.60

a 0° 8° 4°

x - - 0.750

y - - 0.750

All Dimensions in mm

U-DFN3030-8

Dim Min Max Typ

A1 0 0.05 0.02 A3

D2 2.15 2.35 2.25

E2 1.40 1.60 1.50

Dim Min Max Typ

A1 0 0.05 0.03 A3

D2 1.45 1.65 1.55

E2 0.76 0.96 0.86

All Dimensions in mm

Type E

A 0.57 0.63 0.60

 

b 0.20 0.30 0.25

D 2.95 3.05 3.00

E 2.95 3.05 3.00

e

 

L 0.30 0.60 0.45

Z

 

All Dimensions in mm

U-DFN2020-6

A 0.57 0.63 0.60

 

b 0.20 0.30 0.25

D 1.95 2.075 2.00

e

 

E 1.95 2.075 2.00

L 0.30 0.40 0.35

0.15

0.65

0.40

0.15

0.65

March 2013

AP2501/AP2511

Suggested Pad Layout

Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.

(1) Package type: SO-8

(2) Package type: MSOP-8

Y

X

C2

X C

C1

Dimensions Value (in mm)

X 0.60

Y 1.55 C1 5.4 C2 1.27

Y

(3) Package type: MSOP-8EP

Y1

X C

G

Y2

AP2501/AP2511

Document number: DS35577 Rev. 6 - 2

Y

Y1

X1

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Dimensions Value (in mm)

C 0.650 X 0.450 Y 1.350

Y1 5.300

Dimensions

C 0.650 G 0.450 X 0.450

X1 2.000

Y 1.350 Y1 1.700 Y2 5.300

Value

(in mm)

March 2013

AP2501/AP2511

Suggested Pad Layout (cont.)

Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.

(4) Package type: U-DFN3030-8 Type E

(5) Package type: U-DFN2020-6

Y

(x8)

X (x8) C

YC

AP2501/AP2511

Document number: DS35577 Rev. 6 - 2

X2

C1

Y Z

X1

Y1

Y2

G

www.diodes.com

16 of 18

Dimensions Value (in mm)

C 0.65

C1 2.35

X 0.30

Y 0.65 Y1 1.60 Y2 2.75

Dimensions Value (in mm)

Z 1.67

G 0.15

X1 0.90 X2 0.45

Y 0.37 C 0.65

March 2013

Taping Orientation (Note 12)

For U-DFN2020-6 and U-DFN3030-8 Type E

AP2501/AP2511

Note: 12. The taping orientation of the other package type can be found on our website at http://www.diodes.com/datasheets/ap02007.pdf

AP2501/AP2511

Document number: DS35577 Rev. 6 - 2

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www.diodes.com

March 2013

AP2501/AP2511

DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).

Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages.

Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.

Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks.

This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the final and determinative format released by Diodes Incorporated.

Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:

A. Life support devices or systems are devices or systems which:

1. are intended to implant into the body, or

2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the

labeling can be reasonably expected to result in significant injury to the user.

B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness.

Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.

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IMPORTANT NOTICE

LIFE SUPPORT

AP2501/AP2511

Document number: DS35577 Rev. 6 - 2

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March 2013