Page 1
Green
Description
The AP2401 and AP2411 are single channel current-limited
integrated high-side power switches optimized for Universal Serial
Bus (USB) and other hot-swap applications. The family of devices
complies with USB standards and is available with both polarities of
enable input.
The devices have fast short-circuit response time for improved overall
system robustness, and have integrated output discharge function to
ensure completely controlled discharging of the output voltage
capacitor. They provide a complete protection solution for applications
subject to heavy capacitive loads and the prospect of short circuit,
and offer reverse current blocking, over-current, over-temperature
and short-circuit protection, as well as controlled rise time and
under-voltage lockout functionality. A 7ms deglitch capability on the
open-drain Flag output prevents false over-current reporting and does
not require any external components. AP2401 and AP2411 will be
latched off after 7ms deglitch.
All devices are available in SO-8, MSOP-8, MSOP-8EP,
U-DFN3030-8 and U-DFN2020-6 packages.
2.0A SINGLE CHANNEL CURRENT-LIMITED
Pin Assignments
GND
GND
IN
IN
EN
Note: Latter with exposed pad
AP2401/AP2411
POWER SWITCH WITH LATCH-OFF
(Top View)
1
IN
2
IN
3
4
EN FLG
SO-8
(Top View)
1
2
3
4
MSOP-8/MSOP-8EP
(dotted line)
(Top View)
8
7
6
5
NC
OUT
OUT
8
7
6
5
NC
OUT
OUT
FLG
1
Features
Single Channel Current-Limited Power Switch
Output Discharge Function
Output Current Latch-Off when OCP Triggered
Fast Short-Circuit Response Time: 2µs
2.5A Accurate Current Limiting
Reverse Current Blocking
70m On-Resistance
Input Voltage Range: 2.7V - 5.5V
Built-In Soft-Start with 0.6ms Typical Rise Time
Over-Current and Thermal Protection
Fault Report (FLG) with Blanking Time (7ms typ)
ESD Protection: 2kV HBM, 200V MM
Active Low (AP2401) or Active High (AP2411) Enable
Ambient Temperature Range: -40°C to +85°C
SO-8, MSOP-8, MSOP-8EP, U-DFN3030-8 and U-DFN2020-6:
Available in “Green” Molding Compound (No Br, Sb)
Lead-Free Finish; RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
UL Recognized, File Number E322375
IEC60950-1 CB Scheme Certified
Notes: 1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
AP2401/AP2411
Document number: DS35113 Rev. 6 - 2
www.diodes.com
Applications
LCD TVs & Monitors
Set-Top-Boxes, Residential Gateways
Laptops, Desktops, Servers, e-Readers
Printers, Docking Stations, HUBs
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GND
IN
IN
EN
2
3
4
U-DFN3030-8
U-DFN2020-6
8
7
6
5
NC
OUT
OUT
FLG
March 2013
© Diodes Incorporated
Page 2
Typical Applications Circuit
Enable Active High
Power Supply
2.7V to 5.5V
10k
ON
0.1uF
IN
FLG
EN
GND
OUT
0.1uF
AP2401/AP2411
Load
120uF
OFF
Available Options
Part
Number
AP2401 1 Active Low
AP2411 1 Active High
Channel
Enable Pin
(EN)
Recommended Maximum
Continuous Load Current
(A)
2 2.5
Typical Output Latch-Off
Current Limit
(A)
Pin Descriptions
Pin Name
GND 1 1 2 Ground
IN
EN 4 4 3 Enable Input. Active low (AP2401) or active high (AP2411).
FLG 5 5
OUT
NC
Exposed Pad — Exposed Pad Exposed Pad
SO-8,
MSOP-8
2, 3 2, 3
6, 7 6, 7 5 Voltage Output Pin (all OUT pins must be tied together externally)
8 8 6 No Internal Connection. Recommend tie to OUT pins.
AP2401/AP2411
Document number: DS35113 Rev. 6 - 2
Pin Number
MSOP-8EP,
U-DFN3030-8
U-DFN2020-6
1 Voltage Input Pin. Connect a 0.1µF or larger ceramic capacitor from IN to GND as close
as possible. (all IN pins must be tied together externally)
4 Over-temperature and over-current fault reporting with 7ms deglitch; active low open-drain
output. FLG is disabled for 7ms after turn-on.
Exposed pad. It should be externally connected to GND plane and thermal mass for
enhanced thermal impedance. Exposed pad should not be used as electrical ground
conduction path.
2 of 18
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Function
Package
SO-8
MSOP-8
MSOP-8EP
U-DFN3030-8
U-DFN2020-6
© Diodes Incorporated
March 2013
Page 3
Functional Block Diagram
AP2401/AP2411
IN
UVLO
Current
Sense
Discharge
OUT
Control
EN
Driver
Thermal
Current
Limit
FLG
Deglitch
Sense
GND
Absolute Maximum Ratings (@T
= +25°C, unless otherwise specified.)
A
Symbol Parameter Ratings Unit
ESD HBM Human Body Model ESD Protection 4 kV
ESD MM Machine Model ESD Protection 300 V
VIN Input Voltage (Note 4) -0.3 to 6.5 V
V
Output Voltage (Note 4) -0.3 to VIN +0.3 or 6.5 V
OUT
V
Enable Voltage (Note 4) -0.3 to VIN +0.3 or 6.5 V
EN , VFLG
I
Maximum Continuous Load Current Internal Limited A
LOAD
T
Maximum Junction Temperature 150 °C
J(MAX)
TST Storage Temperature Range (Note 4) -65 to +150 °C
Notes: 4. All voltages referred to GND pin. Maximums are the lower of VIN + 0.3 and 6.5V
5. UL Recognized Rating from -30°C to +70°C (Diodes qualified T
Caution: Stresses greater than the 'Absolute Maximum Ratings' specified above, may cause permanent damage to the device. These are stress ratings
only; functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability may
be affected by exposure to absolute maximum rating conditions for extended periods of time.
Semiconductor devices are ESD sensitive and may be damaged by exposure to ESD events. Suitable ESD precautions should be taken when handling
and transporting these devices
from -65°C to +150°C).
ST
Recommended Operating Conditions (@T
= +25°C, unless otherwise specified.)
A
Symbol Parameter Min Max Unit
V
I
OUT
V
V
T
IN
IL
IH
Input voltage 2.7 5.5 V
Output Current 0 2 A
EN Input Logic Low Voltage 0 0.8 V
EN Input Logic High Voltage 2 VIN V
Operating Ambient Temperature -40 +85 °C
A
AP2401/AP2411
Document number: DS35113 Rev. 6 - 2
3 of 18
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March 2013
© Diodes Incorporated
Page 4
AP2401/AP2411
Electrical Characteristics (@T
Symbol Parameter Test Conditions (Note 5) Min Typ Max Unit
V
Input UVLO VIN rising 1.6 2.0 2.4 V
UVLO
V
Input UVLO Hysteresis VIN decreasing 50 mV
UVLO
I
I
R
I
I
SHORT
T
I
LEAK-EN
I
LEAK-O
T
T
R
T
T
T
Notes: 6. Pulse-testing techniques maintain junction temperature close to ambient temperature; thermal effects must be taken into account separately.
7. The discharge function is active when the device is disabled (when enable is de-asserted or during power-up power-down when V
The discharge function offers a resistive discharge path for the external storage capacitor for limited time.
8. Device mounted on 2” x 2” FR-4 substrate PCB, 2oz copper, with minimum recommended pad layout.
9. Device mounted on 2” x 2” FR-4 substrate PCB, 2oz copper, with minimum recommended pad on top layer and thermal vias to bottom layer ground
plane.
10. Device mounted on 1"x1" FR-4 substrate PCB, 2oz copper, with minimum recommended padon top layer and thermal vias to bottom layer ground.
Input Shutdown Current Disabled, OUT = open 0.1 1 µA
SHDN
I
Input Quiescent Current Enabled, OUT = open 60 100 µA
Q
Input Leakage Current Disabled, OUT grounded 0.1 1 µA
LEAK
I
Reverse Leakage Current Disabled, V
REV
Switch on-resistance
DS(ON)
Over-Load Current Limit
LIMIT
(Note 6)
I
Current limiting trigger threshold Output Current Slew rate (< 100A/s) 2.5 A
Trig
Short-Circuit Current Limit Enabled into short circuit 2.1 2.75 3.3 A
Short-circuit Response Time V
SHORT
V
EN Input Logic Low Voltage VIN = 2.7V to 5.5V 0.8 V
IL
V
EN Input Logic High Voltage VIN = 2.7V to 5.5V 2 V
IH
EN Input leakage VIN = 5V, V
Output leakage current Disabled, V
Output turn-on delay time CL = 1µF, R
D(ON)
TR Output turn-on rise time CL = 1µF, R
Output turn-off delay time CL = 1µF, R
D(OFF)
TF Output turn-off fall time CL = 1µF, R
FLG output FET on-resistance I
FLG
I
FLG Off Current V
FOH
FLG blanking and latch off time
BLANK
T
Discharge time CL= 1µF, VIN = 5V, disabled to V
DIS
R
Discharge resistance (Note 7) VIN = 5V, disabled, I
DIS
Thermal Shutdown Threshold Enabled 140 °C
SHDN
Thermal Shutdown Hysteresis 20 °C
HYS
Thermal Resistance Junction-to-
JA
Ambient
= +25°C, VIN = +5.0V, C
A
= 0V, V
IN
= 5V, I
V
IN
VIN = 3.3V, I
VIN= 5V, V
= 0V to I
OUT
= 10mA 20 40
FLG
= 5V 0.01 1 µA
FLG
= 2.0A
OUT
= 2.0A
OUT
= 4.5V -40°C T
OUT
OUT
= 0V and 5.5V 0.01 1 µA
EN
= 0V 0.5 1 µA
OUT
= 5 0.1 ms
LOAD
= 5 0.6 1.5 ms
LOAD
= 5 0.1 ms
LOAD
= 5 0.05 0.1 ms
LOAD
Assertion or deassertion due to overcurrent and overtemperature condition
= 0.1µF, CL= 1µF, unless otherwise specified.)
IN
OUT
= 5V, I
at VIN 0.01 1 µA
REV
T
= +25°C 70 84
A
-40°C TA +85°C 105
T
= +25°C 90 108
A
-40°C TA +85°C 135
+85°C 2.05 2.5 2.85 A
A
= I
(OUT shorted to ground) 2 µs
LIMIT
4 7 15 ms
< 0.5V 0.6 ms
OUT
= 1mA 100
OUT
SO-8 (Note 8) 96 °C/W
MSOP-8 (Note 8) 130 °C/W
MSOP-8EP (Note 9) 92 °C/W
U-DFN3030-8 (Note 9) 84 °C/W
U-DFN2020-6 (Note 10) 90 °C/W
< V
IN
UVLO
m
.
AP2401/AP2411
Document number: DS35113 Rev. 6 - 2
4 of 18
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March 2013
© Diodes Incorporated
Page 5
Typical Performance Characteristics
AP2401/AP2411
V
EN
V
OUT
50%
T
D(ON)
T
10%
50%
T
R
90%
D(OFF)
90%
10%
T
F
V
EN
V
OUT
50%
T
D(ON)
T
10%
R
90%
50%
T
D(OFF)
90%
10%
T
F
Vout
2V/div
Ven
5V/div
Figure 1 Voltage Waveforms: AP2401 (left), AP2411 (right)
All Enable Plots are for Enable Active Low
Turn-On Delay and Rise Time
T
=25°C
A
V
=5V
IN
CL=1µF
=2.5
R
OUT
Device Enable
Turn-Off Delay and Fall Time
Vout
2V/div
Ven
5V/div
Device Disable
T
=25°C
A
V
=5V
IN
CL=1µF
=2.5
R
OUT
Iin
1A/div
Iin
1A/div
Turn-Off Delay and Fall Time
Vout
2V/div
Ven
5V/div
Device Disable
Iin
1A/div
=25°C
T
A
=5V
V
IN
CL=120µF
R
=2.5
OUT
Vout
2V/div
Ven
5V/div
Iin
1A/div
Turn-On Delay and Rise Time
T
=25°C
A
=5V
V
IN
CL=120µF
R
=2.5
OUT
Device Enable
Inrush Current Limit
AP2401/AP2411
Document number: DS35113 Rev. 6 - 2
5 of 18
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March 2013
© Diodes Incorporated
Page 6
Typical Performance Characteristics (cont.)
Device Enabled Into Short-Circuit
=25°C
T
A
V
=5V
Ven
5V/div
IN
CL=120µF
R
=1
OUT
Ven
5V/div
Inrush Current
=25°C
T
A
V
IN
CL=120µF,220uF, 470µF
R
OUT
CL=470µF
CL=220µF
AP2401/AP2411
=5V
=5
Iout
1A/div
Full-Load to Short-Circuit
Transient Response
Vout
Output Short Circuit
2V/div
Iin
2A/div
Device Turns off and Re-enables
FLG
Into Current-Limit
5V/div
AP2401/AP2411
Document number: DS35113 Rev. 6 - 2
T
=25°C
A
V
=5V
IN
R
=2.5
OUT
Device is latched-off
Iout
0.5A/div
Vout
2V/div
Iin
2A/div
FLG
5V/div
6 of 18
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CL=120µF
No-Load to Short-Circuit
Transient Response
Output Short Circuit
T
A
V
IN
Device Turns off and Re-enables
Into Current-Limit
Device is latched-off
=25°C
=5V
© Diodes Incorporated
March 2013
Page 7
Typical Performance Characteristics (cont.)
Power ON
AP2401/AP2411
UVLO Increasing
FLG
5V/div
IIout
1A/div
Vout
5V/div
Vin
5V/div
Vin
2V/div
Iout
2A/div
UVLO Decreasing
TA=25°C
=5V
V
IN
R
=2.5
OUT
CL=120µF
=25°C
T
A
=5V
V
IN
R
=2.5
OUT
CL=120µF
Vin
2V/div
T
A
V
IN
R
OUT
=25°C
=5V
=2.5
CL=120µF
Iout
2A/div
AP2401/AP2411
Document number: DS35113 Rev. 6 - 2
7 of 18
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March 2013
© Diodes Incorporated
Page 8
O
m
m
m
Typical Performance Characteristics (cont.)
200
190
180
170
160
150
140
130
120
110
100
90
80
70
60
Turn-On Time (µs)
50
40
30
20
10
0
2 2.5 3 3.5 4 4.5 5 5.5 6
Input Voltage (V)
Turn-On vs. Input Voltage
C = 1µF
L
R = 5
L
T = 25°C
A
AP2401/AP2411
260
240
220
200
180
160
e (µs)
140
120
ff Ti
100
80
Tur n-
60
40
20
0
2 2.5 3 3.5 4 4.5 5 5.5 6
Input Voltage (V)
Turn-Off vs. Input Voltage
1000
900
800
700
600
e (µs)
500
400
Rise Ti
300
200
100
0
2 2.5 3 3.5 4 4.5 5 5.5 6
Input Voltage (V)
Rise Time vs. Input Voltage
C = 1µF
L
R = 5
L
T = 25°C
A
100
90
80
70
60
e (µs)
50
40
Fall Ti
30
20
10
0
2 2.5 3 3.5 4 4.5 5 5.5 6
Input Voltage (V)
Fall Time vs. Input Voltage
AP2401/AP2411
Document number: DS35113 Rev. 6 - 2
8 of 18
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March 2013
© Diodes Incorporated
Page 9
O
A
O
A
m
O
A
A
AP2401/AP2411
Typical Performance Characteristics (cont.)
100
)
90
80
V = 5V
V = 5.5V
IN
IN
70
60
utput Enabled (µ
50
V = 2.7V
40
IN
V = 3.3V
IN
30
20
Supply Current
10
0
-50 - 25 0 25 50 75 100 125
Temperature (C)
Supply Current, Output Enabled vs. Temperature
180
170
160
150
140
)
130
V = 3.3V
IN
V = 2.7V
IN
120
110
100
DS(ON)
R (
90
80
70
60
50
40
-50 -25 0 25 50 75 100 125
V = 5V
IN
V = 5.5V
IN
Tem perat u re ( °C)
R vs. Temperature
DS(ON)
2.15
2.10
2.05
2.00
UVLO Rising
1.95
1.90
UVLO Falling
1.85
1.80
Undervoltage Lockout (V)
1.75
1.70
1.65
-50 -25 0 25 50 75 100 125
Temperature (°C)
Undervoltage Lockout vs. Temperature
AP2401/AP2411
Document number: DS35113 Rev. 6 - 2
9 of 18
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0.30
)
0.25
0.20
V = 5V
IN
V = 5.5V
IN
0.15
0.10
0.05
V = 2.7V
IN
V = 3.3V
IN
utput Disabled (µ
0
-0.05
-0.10
-0.15
-0.20
Supply Current
-0.25
-0.30
-50 -25 0 25 50 75 100 125
Temperature (C)
Supply Current, Output Disabled vs. Temperature
3.0
2.9
)
2.8
V = 2.7V
IN
V = 3.3V
IN
2.7
2.6
2.5
utput Current (
2.4
V = 5V
IN
V = 5.5V
IN
2.3
2.2
Short-Circuit
2.1
2.0
-50 -25 0 25 50 75 100 125
Temperature (°C)
Short-Circuit, Output Current vs. Temperature
3.5
3.4
3.3
)
C = 120µF
T = 25°C
3.2
3.1
3.0
2.9
2.8
2.7
Threshold Trip Current (
2.6
2.5
2 2.5 3 3.5 4 4.5 5 5.5 6
Input Voltage (V)
Turn-Off vs. Input Voltage
L
A
© Diodes Incorporated
March 2013
Page 10
AP2401/AP2411
Application Information
Power Supply Considerations
A 0.1F to 2.2F X7R or X5R ceramic bypass capacitor placed between IN and GND, close to the device, is recommended. When an external
power supply is used, or an additional ferrite bead is added to the input, high inrush current may cause voltage spikes higher than the device
maximum input rating during short circuit condition. In this case a 2.2F or bigger capacitor is recommended. Placing a high-value electrolytic
capacitor on the input and output pin(s) is recommended when the output load is heavy. This precaution reduces power-supply transients that
may cause ringing on the input. Additionally, bypassing the output with a 0.1F to 1.0F ceramic capacitor improves the immunity of the device
to short circuit transients.
Over-Current and Short Circuit Protection
An internal sensing FET is employed to check for over-current conditions. Unlike current-sense resistors, sense FETs do not increase the series
resistance of the current path. When an overcurrent condition is detected, the devices will limit the current until the overload condition is removed
or the internal deglitch time (7-ms typical) is reached and the device is turned off. The device will remain latched off even overload condition is
removed until power is cycled or the device enable is toggled.
Three possible overload conditions can occur. In the first condition, the output has been shorted to GND before the device is enabled or before
VIN has been applied. The AP2401/AP2411 senses the short circuit and immediately clamps output current to a certain safe level namely I
LIMIT
,
and turns off after deglitch time(7-ms typical).
In the second condition, an output short or an overload occurs while the device is enabled. At the instance the overload occurs, higher current
may flow for a very short period of time before the current limit function can react. After the current limit function has tripped (reached the
over-current trip threshold), the device switches into current limiting mode and the current is clamped at I
current for deglitch time period
LIMIT
(7-ms typical), and then turned off.
In the third condition, the load has been gradually increased beyond the recommended operating current. The current is permitted to rise until the
current-limit threshold (I
) is reached or until the thermal limit of the device is exceeded. The AP2401/AP2411 is capable of delivering current
TRIG
up to the current-limit threshold without damaging the device. Once the threshold has been reached, the device switches into its current limiting
mode and output current is clamped at I
for deglitch time period (7-ms typical), and then turned off.
LIMIT
FLG Response
When an over-current or over-temperature shutdown condition is encountered, the FLG open-drain output goes active low after a nominal 7-ms
deglitch timeout.
When that happens, the FLG will remain low and the switch will be latched off until the fault condition is removed. Connecting a heavy capacitive
load to the output of the device can cause a momentary over-current condition, which does not trigger the FLG due to the 7-ms deglitch timeout.
The AP2401/AP2411 is designed to eliminate false over-current reporting without the need of external components to remove unwanted pulses.
Power Dissipation and Junction Temperature
The low on-resistance of the internal MOSFET allows the small surface-mount packages to pass large current. Using the maximum operating
ambient temperature (TA) and R
P
= R
D
DS(ON)×
2
I
the power dissipation can be calculated by:
DS(ON),
Finally, calculate the junction temperature:
Where:
= PD x R
T
J
= Ambient temperature°C
T
A
= Thermal resistance
R
JA
P
= Total power dissipation
D
JA
+ TA
Thermal Protection
Thermal protection prevents the IC from damage when heavy-overload or short-circuit faults are present for extended periods of time. The
AP2401/AP2411 implements a thermal sensing to monitor the operating junction temperature of the power distribution switch. Once the die
temperature rises to approximately +140°C due to excessive power dissipation in an over-current condition, the internal thermal sense circuitry
turns the power switch off, thus preventing the power switch from damage. Hysteresis is built into the thermal sense circuit allowing the device to
cool down approximately +25°C before the switch turns back on. The switch continues to cycle in this manner until the load fault or input power is
removed. The FLG open-drain output is asserted when an over-temperature shutdown occurs with 7-ms deglitch.
When the FLG is asserted, the switch will be latched off until the temperature drops to 20°C below the thermal shutdown threshold and the power
or EN pin is cycled.
AP2401/AP2411
Document number: DS35113 Rev. 6 - 2
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Page 11
AP2401/AP2411
Application Information (cont.)
Under-Voltage Lockout (UVLO)
Under-voltage lockout function (UVLO) keeps the internal power switch from being turned on until the power supply has reached at least 2V,
even if the switch is enabled. Whenever the input voltage falls below approximately 2V, the power switch is quickly turned off. This facilitates the
design of hot-insertion systems where it is not possible to turn off the power switch before input power is removed.
Discharge Function
The discharge function of the device is active when enable is disabled or de-asserted. The discharge function with the N-MOS power switch
implementation is activated and offers a resistive discharge path for the external storage capacitor. This is designed for discharging any
residue of the output voltage when either no external output resistance or load resistance is present at the output.
Ordering Information
Part
Number
AP24X1S-13 New Product S SO-8 2500/Tape & Reel -13
AP24X1M8-13 New Product M8 MSOP-8 2500/Tape & Reel -13
AP24X1MP-13 New Product MP MSOP-8EP 2500/Tape & Reel -13
AP24X1FGE-7 New Product FGE U-DFN3030-8 3000/Tape & Reel -7
AP24X1SN-7 Preview SN U-DFN2020-6 3000/Tape & Reel -7
Status
Package
Code
Packaging
Quantity Part Number Suffix
7”/13” Tape and Reel
Marking Information
(1) SO-8
AP2401/AP2411
Document number: DS35113 Rev. 6 - 2
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Page 12
Marking Information (cont.)
(2) MSOP-8
AP2401/AP2411
(3) MSOP-8EP
(4) U-DFN3030-8
(5) U-DFN2020-6
AP2401/AP2411
Document number: DS35113 Rev. 6 - 2
( Top View )
XX : Identification Code
: Year : 0~9
X X
W
Y
: Week : A~Z : 1~26 week;
W
XY
a~z : 27~52 week; z represents
52 and 53 week
: A~Z : Internal Code
X
Part Number Package Identification Code
AP2401FGE-7 U-DFN3030-8 BD
AP2411FGE-7 U-DFN3030-8 BF
( Top View )
XX : Identification Code
: Year : 0~9
XX
W
Y
W
XY
: Week : A~Z : 1~26 week;
a~z : 27~52 week; z represents
52 and 53 week
X
: A~Z : Internal Code
Part Number Package Identification Code
AP2401SN-7 U-DFN2020-6 DD
AP2411SN-7 U-DFN2020-6 DF
12 of 18
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March 2013
© Diodes Incorporated
Page 13
Package Outline Dimensions (All dimensions in mm.)
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
1. Package type: SO-8
2. Package type: MSOP-8
E1
A2
e
y
A2
A1
AP2401/AP2411
Document number: DS35113 Rev. 6 - 2
b
D
D
x
1
b
e
E
A3
A
E
Gauge Plane
Seating Plane
A3
A
A1
0.25
h
Detail ‘A’
°
45
4
x
1
Detail C
E3
E1
0.254
L
7°~9
4
x
1
0
°
L
0
°
See Detail C
www.diodes.com
Gauge Plane
Seating Plane
°
Detail ‘A’
a
c
13 of 18
AP2401/AP2411
SO-8
Dim Min Max
A - 1.75
A1 0.10 0.20
A2 1.30 1.50
A3 0.15 0.25
b 0.3 0.5
D 4.85 4.95
E 5.90 6.10
E1 3.85 3.95
e 1.27 Typ
h - 0.35
L 0.62 0.82
0 8
All Dimensions in mm
MSOP-8
Dim Min Max Typ
A - 1.10 A1 0.05 0.15 0.10
A2 0.75 0.95 0.86
A3 0.29 0.49 0.39
b 0.22 0.38 0.30
c 0.08 0.23 0.15
D 2.90 3.10 3.00
E 4.70 5.10 4.90
E1 2.90 3.10 3.00
E3 2.85 3.05 2.95
e - - 0.65
L 0.40 0.80 0.60
a 0° 8° 4°
x - - 0.750
y - - 0.750
All Dimensions in mm
March 2013
© Diodes Incorporated
Page 14
Package Outline Dimensions (cont.) (All dimensions in mm.)
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
3. Package type: MSOP-8EP
D
x
y
E
E2
D1
4. Package type: U-DFN3030-8 Type E
5. Package type: U-DFN2020-6
1
e
A1
A
D
8Xb
A3
A2
A
A1
E
E2
Z (x4)
E3
E1
D
D2
e
Gauge Plane
Seating Plane
See Detail C
b (x8)
A3
L (x8)
0.25
4
X
1
c
0
°
4
X
Detail C
1
0
°
a
L
Pin#1 ID
A
A1
E
E2
AP2401/AP2411
Document number: DS35113 Rev. 6 - 2
D
D2
D2/2
e
b
A3
SEATING PLANE
L
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www.diodes.com
AP2401/AP2411
MSOP-8EP
Dim Min Max Typ
A - 1.10 A1 0.05 0.15 0.10
A2 0.75 0.95 0.86
A3 0.29 0.49 0.39
b 0.22 0.38 0.30
c 0.08 0.23 0.15
D 2.90 3.10 3.00
D1 1.60 2.00 1.80
E 4.70 5.10 4.90
E1 2.90 3.10 3.00
E2 1.30 1.70 1.50
E3 2.85 3.05 2.95
e - - 0.65
L 0.40 0.80 0.60
a 0° 8° 4°
x - - 0.750
y - - 0.750
All Dimensions in mm
U-DFN3030-8
Dim Min Max Typ
A1 0 0.05 0.02
A3
D2 2.15 2.35 2.25
E2 1.40 1.60 1.50
Dim Min Max Typ
A1 0 0.05 0.03
A3
D2 1.45 1.65 1.55
E2 0.76 0.96 0.86
All Dimensions in mm
Type E
A 0.57 0.63 0.60
b 0.20 0.30 0.25
D 2.95 3.05 3.00
E 2.95 3.05 3.00
e
L 0.30 0.60 0.45
Z
All Dimensions in mm
U-DFN2020-6
A 0.57 0.63 0.60
b 0.20 0.30 0.25
D 1.95 2.075 2.00
e
E 1.95 2.075 2.00
L 0.30 0.40 0.35
0.15
0.65
0.40
0.15
0.65
March 2013
© Diodes Incorporated
Page 15
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
(1) Package type: SO-8
(2) Package type: MSOP-8
Y
X
C2
X C
C1
Dimensions Value (in mm)
X 0.60
Y 1.55
C1 5.4
C2 1.27
Y
(3) Package type: MSOP-8EP
Y1
X C
G
Y2
AP2401/AP2411
Document number: DS35113 Rev. 6 - 2
Y
Y1
X1
15 of 18
www.diodes.com
Dimensions Value (in mm)
C 0.650
X 0.450
Y 1.350
Y1 5.300
Dimensions
C 0.650
G 0.450
X 0.450
X1 2.000
Y 1.350
Y1 1.700
Y2 5.300
Value
(in mm)
AP2401/AP2411
March 2013
© Diodes Incorporated
Page 16
Suggested Pad Layout (cont.)
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
(4) Package type: U-DFN3030-8 Type E
(5) Package type: U-DFN2020-6
Y
(x8)
X (x8) C
YC
AP2401/AP2411
Document number: DS35113 Rev. 6 - 2
X2
Y1
Y2
C1
G
X1
G
Y
Z
www.diodes.com
Dimensions Value (in mm)
Dimensions Value (in mm)
16 of 18
C 0.65
C1 2.35
X 0.30
Y 0.65
Y1 1.60
Y2 2.75
Z 1.67
G 0.15
X1 0.90
X2 0.45
Y 0.37
C 0.65
AP2401/AP2411
March 2013
© Diodes Incorporated
Page 17
Taping Orientation (Note 11)
For U-DFN2020-6 and U-DFN3030-8 Type E
AP2401/AP2411
Note: 11. The taping orientation of the other package type can be found on our website at http://www.diodes.com/datasheets/ap02007.pdf
AP2401/AP2411
Document number: DS35113 Rev. 6 - 2
17 of 18
www.diodes.com
March 2013
© Diodes Incorporated
Page 18
AP2401/AP2411
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2013, Diodes Incorporated
www.diodes.com
IMPORTANT NOTICE
LIFE SUPPORT
AP2401/AP2411
Document number: DS35113 Rev. 6 - 2
18 of 18
www.diodes.com
March 2013
© Diodes Incorporated
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