Diodes AP2196 User Manual

AP2186/ AP2196

1.5A DUAL CHANNEL CURRENT-LIMITED POWER SWITCH

Description

The AP2186 and AP2196 are integrated high-side power switches
optimized for Universal Serial Bus (USB) and other hot-swap
applications. The family of devices complies with USB 2.0 and
available with both polarities of Enable input. They offer current and
thermal limiting and short circuit protection as well as controlled rise
time and under-voltage lockout functionality. A 7ms deglitch capability
on the open-drain Flag output prevents false over-current reporting
and does not require any external components.

All devices are available in SO-8 and MSOP-8EP packages

Features

 Dual USB Port Power Switches
 Over-Current and Thermal Protection
 2.1A Accurate Current Limiting
 Reverse Current Blocking
 90m On-Resistance
 Input Voltage Range: 2.7V - 5.5V
 0.6ms Typical Rise Time
 Very Low Shutdown Current: 1µA (max)
 Fault Report (FLG) with Blanking Time (7ms typ)
 ESD Protection: 6KV HBM, 300V MM
 Active Low (AP2186) or Active High (AP2196) Enable
 Ambient Temperature Range -40ºC to +85°C
 SO-8 and MSOP-8EP (Exposed Pad): Available in “Green”

Molding Compound (No Br, Sb)

 Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
 Halogen and Antimony Free. “Green” Device (Note 3)

 UL Recognized, File Number E322375
 IEC60950-1 CB Scheme Certified

Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.

2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.

3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.

Pin Assignments

( Top View )

1

EN1

EN2

2

3

4

FLG1

FLG2

SO-8

8

7

6

5

OUT1

IN

GND

OUT2

( Top View )

EN1
FLG1
FLG2

EN2

1
2
3

4

MSOP-8EP

8

OUT1

7

IN

6

GND

5

OUT2

Applications

 Consumer electronics – LCD TV & Monitor, Game Machines
 Communications – Set-Top-Box, GPS, Smartphone
 Computing – Laptop, Desktop, Servers, Printers, Docking Station,

HUB

Typical Applications Circuit

Power Supply

2.7V to 5.5V

10k

10k

AP2186/ AP2196

Document number: DS31815 Rev. 3 - 2

OFF

10uF

ON

IN

0.1uF

FLG1
FLG2

EN1
EN2

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GND

OUT1

OUT2

0.1uF

0.1uF

68uF

68uF

Load

Load

© Diodes Incorporated

March 2013

Available Options

Part Number Channel

Enable Pin

(EN)

AP2186 2 Active Low 2.1A 1.5A
AP2196 2 Active High 2.1A 1.5A

Current Limit

Pin Descriptions

Pin Name

Pin Number

SO-8 MSOP-8EP

Function

EN1 1 1 Switch 1 enable input, active low (AP2186) or active high (AP21 96)
FLG1 2 2 Switch 1 over-current and over-temperature fault report, open-dra in
FLG2 3 3 Switch 2 over-current and over-temperature fault report, open-dra in

EN2 4 4 Switch 2 enable input, active low (AP2186) or active high (AP21 96)
OUT2

5 5 Switch 2 voltage output pin

GND 6 6 Ground

IN

OUT1

7 7 Voltage input pin
8 8 Switch 1 voltage output pin

Exposed Pad:

Exposed Pad — Exposed Pad

It should be connected externally to GND and therma l mass for enhan ced thermal impedance .
It should not be used as electrical ground conduction path.

Functional Block Diagram

Thermal

Sense

(typ)

AP2186/ AP2196

Recommended Maximum
Continuous Load Current

FLG1

EN1

IN

EN2

AP2186/ AP2196

Document number: DS31815 Rev. 3 - 2

UVLO

UVLO

Driver

Reverse
blocking

Reverse
blocking

Driver

Thermal

Sense

Current

Limit

CS

CS

Current

Limit

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D e g lit c h

D e g lit c h

GND

GND

OUT1

OUT2

FLG2

March 2013

© Diodes Incorporated

AP2186/ AP2196

Absolute Maximum Ratings (@T

= +25°C, unless otherwise specified.)

A

Symbol Parameter Rating Unit

ESD HBM Human Body Model ESD Protection 6 kV

ESD MM Machine Model ESD Protection 300 V

VIN

V

OUT

V

EN , VFLG

T

I

LOAD

J(MAX)

TST

Note: 4. UL Recognized Rating from -30°C to +70°C (Diodes qualified TST from -65°C to +150°C)

Input Voltage 6.5 V
Output Voltage

VIN +0.3

V
Enable Voltage 6.5 V
Maximum Continuous Load Current Internal Limited A
Maximum Junction Temperature 150 °C
Storage Temperature Range (Note 4) -65 to +150 °C

Recommended Operating Conditions (@T

Symbol Parameter Min Max Units

V

IN

I

OUT

V

IL

V

IH

T

A

AP2186/ AP2196

Document number: DS31815 Rev. 3 - 2

Input voltage 2.7 5.5 V
Output Current 0 1.5 A
EN Input Logic Low Voltage 0 0.8 V
EN Input Logic High Voltage 2.0
Operating Ambient Temperature -40 +85

= +25°C, unless otherwise specified.)

A

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V

IN

V

C

March 2013

© Diodes Incorporated

AP2186/ AP2196

Electrical Characteristics (@T

= +25°C, CIN = 10µF, VIN = +5V, unless otherwise specified.)

A

Symbol Parameter Test Conditions Min Typ Max Unit

V

I

SHDN

I

LEAK

I

R

DS(ON)

I

SHORT

I

LIMIT

I

T

SHORT

V

I

SINK

T

D(ON)

T

D(OFF)

R

I

FOH

T

Blank

T

SHDN

T



Notes: 5. Test condition for SO-8: Device mounted on FR-4 2-layer board, 2oz copper, with minimum recommended pad layout.

6. Test condition for MSOP-8EP: Device mounted on FR-4 2-layer board, 2oz copper, with minimum recommended pad on top layer and 3 vias to bottom
layer ground plane.

Input UVLO

UVLO

Input Shutdown Current
Input Quiescent Current, Dual

I

Q

R

= 1k

LOAD

Disabled, I
Enabled, I

OUT

OUT

= 0

= 0
Input Leakage Current Disabled, OUT grounded 1 µA
Reverse Leakage Current

REV

Switch On-Resistance

Short-Circuit Current Limit
Over-Load Current Limit
Current Limiting Trigger Threshold

Trig

Short-Circuit Response Time
EN Input Logic Low Voltage

V

IL

EN Input Logic High Voltage

IH

EN Input Leakage
Output Turn-On Delay Time
Output Turn-On Rise Time

TR

Output Turn-Off Delay Time
Output Turn-Off Fall Time

TF

FLG Output FET On-Resistance

FLG

Error Flag Off Current
FLG Blanking Time
Thermal Shutdown Threshold
Thermal Shutdown Hysteresis 25

HYS

Thermal Resistance Junction-to-Ambient

JA

Disabled, VIN = 0V, V

= 5V, I

V

IN

VIN = 3.3V, I

= 1.5A, -40°C  TA  +85°C

OUT

= 1.5A, -40°C  TA  +85°C

OUT

OUT

= 5V, I

REV

at VIN

MSOP-8EP 90 135 m
SO-8 100 135 m
MSOP-8EP

SO-8
Enabled into short circuit, CL = 68µF
VIN = 5V, V

= 4.5V, CL = 120µF, -40°C  TA  +85°C

OUT

VIN = VEN, Output Current Slew rate (<100A/WS), CL = 68µF
V

= 0V to I

OUT

V

= 2.7V to 5.5V

IN

= 2.7V to 5.5V

V

IN

= 5V

V

EN

CL=1µF, R
CL=1µF, R
CL=1µF, R
CL=1µF, R
I

=10mA

FLG

V

= 5V

FLG

LOAD
LOAD
LOAD
LOAD

OUT

= 10
= 10
= 10
= 10

= I

(short applied to output), CL = 68µF

LIMIT

CL = 68µF
Enabled, R

LOAD

= 1k

SO-8 (Note 5) 110
MSOP-8EP (Note 6) 60 oC/W

1.6 1.9 2.5 V

0.5 1 µA
95 140 µA

1 µA

120 160 m

2.1 A

1.6 2.1 2.6 A

2.5 A
20 µs

0.8 V

2 V

1 µA

0.05 ms

0.6 1.5 ms

0.01 ms

0.05 0.1 ms
20 40 

0.01 1 µA

4 7 15 ms

140

AP2186/ AP2196

Document number: DS31815 Rev. 3 - 2

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March 2013

© Diodes Incorporated

C
C

o

C/W

Typical Performance Characteristics

AP2186/ AP2196

Ven 1
5V/div

Vout 1
2V/div

V

EN

V

OUT

50%

T

D(ON)

T

10%

50%

R

90%

T

Figure 1 Voltage Waveforms: AP2186 (left), AP2196 (right)

All Enable Plots are for AP2196 Active High

Channel 1 Turn-On Delay and Rise Time

400µs/div

Channel 2 Turn-On Delay and Rise Time

D(OFF)

90%

10%

T

F

CL=1µF
TA= +25°C
RL=5

Ven 1
5V/div

Vout 1
2V/div

V

EN

50%

T

T

D(ON)

V

OUT

10%

50%

R

90%

Channel 1 Turn-Off Delay and Fall Time

400µs/div

Channel 2 Turn-Off Delay and Fall Time

T

D(OFF)

90%

10%

T

F

CL=1µF
TA= +25°C

=

CL=1µF
TA= +25°C
R

=5

L

Ven 2
5V/div

Vout 2
2V/div

AP2186/ AP2196

Document number: DS31815 Rev. 3 - 2

400µs/div

CL=1µF
TA= +25°C
RL=5

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Ven 2
5V/div

Vout 2
2V/div

400µs/div

CL=1µF
TA= +25°C
RL=5

March 2013

© Diodes Incorporated

Typical Performance Characteristics (cont.)

Channel 1 Turn-On Delay and Rise Time

AP2186/ AP2196

Channel 1 Turn-Off Delay and Fall Time

Ven 2
5V/div

Vout 2
2V/div

Ven 2
5V/div

Vout 2
2V/div

400µs/div

Channel 2 Turn-On Delay and Rise Time

400µs/div

Channel 1 Short Circuit Current,

Device Enabled Into Short

CL=100µF
TA= +25°C
RL=5

CL=100µF
TA= +25°C
R

=5

L

Ven 2
5V/div

Vout 2
2V/div

Ven 2
5V/div

Vout 2
2V/div

400µs/div

Channel 2 Turn-Off Delay and Fall Time

400µs/div

Channel 2 Short Circuit Current,

Device Enabled Into Short

CL=100µF
TA= +25°C
RL=5

CL=100µF
TA= +25°C
R

=5

L

Ven 1
5V/div

Iout 1
500mA/div

AP2186/ AP2196

Document number: DS31815 Rev. 3 - 2

500µs/div

VIN=5V
TA= +25°C
CL=68µF

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Ven 2
5V/div

Iout 2
500mA/div

500µs/div

VIN=5V
TA= +25°C
C

=68µF

L

March 2013

© Diodes Incorporated

Typical Performance Characteristics (cont.)

Channel 1 Inrush Current

AP2186/ AP2196

Channel 2 Inrush Current

Ven 1
5V/div

Iout 1
500mA/div

Vflag 1
2V/div

Iout 1
1A/div

CL=100µF

CL=220µF

CL=470µF

1ms/div

Channel 1

0.6 Ω Load Connected to Enabled Device

VIN=5V

= +25°C

T

A

R

=3.3

L

VIN=5V
TA= +25°C
C

=68µF

L

Ven 2
5V/div

Iout 2
500mA/div

Vflag 2
2V/div

Iout 2
1A/div

CL=100µF

CL=220µF

CL=470µF

1ms/div

Channel 2

0.6 Ω Load Connected to Enabled Device

VIN=5V
TA= +25°C
R

=3.3

L

VIN=5V
TA= +25°C
C

=68µF

L

Short Circuit with Blanking Time and Recovery

Vout 1
5V/div

Vflag 1
5V/div

Iout 1
2A/div

AP2186/ AP2196

Document number: DS31815 Rev. 3 - 2

2ms/div

2ms/div

Channel 1

Channel 2

Short Circuit with Blanking Time and Recovery

Vout 2

20ms/div

VIN=5V
TA= +25°C
CL=68µF

www.diodes.com

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5V/div

Vflag 2
5V/div

Iout 2
2A/div

20ms/div

VIN=5V
TA= +25°C
CL=68µF

March 2013

© Diodes Incorporated

Typical Performance Characteristics (cont.)

Channel 1 Power On

AP2186/ AP2196

Channel 2 Power On

Vflag 1
5V/div

Iout 1
500mA/div

Ven 1
5V/div

Vin
5V/div

Vin
2V/div

Iout 1
500mA/div

1ms/div

Channel 1 UVLO Increasing

TA= +25°C
CL=68µF
R

=3

L

TA= +25°C
CL=68µF
R

=3

L

Vflag 2
5V/div

Iout 2
500mA/div

Ven 2
5V/div

Vin
5V/div

Vin
2V/div

Iout 1
500mA/div

1ms/div

Channel 1 UVLO Decreasing

TA= +25°C
CL=68µF
R

=3

L

TA= +25°C
CL=68µF
R

=3

L

Channel 2 UVLO Increasing

Vin
2V/div

Iout
500mA/div

AP2186/ AP2196

Document number: DS31815 Rev. 3 - 2

1ms/div

10ms/div

Channel 2 UVLO Decreasing

TA= +25°C
CL=68µF
R

=3

L

March 2013

© Diodes Incorporated

1ms/div

TA= +25°C
CL=68µF
RL=3

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Vin
2V/div

Iout
500mA/div

10ms/div

Typical Performance Characteristics (cont.)

Channel 1 Enabled and Shorted with Channel 2 Disabled

Vout 1
5V/div

Vout 2
5V/div

Vflag 1
5V/div

Iout 2
500mA/div

TA= +25°C
C

=68µF

L

Ven1
5V/div

Vout 1
5V/div

Ven2
5V/div

Vout 2
5V/div

AP2186/ AP2196

Channel 1 Disabled and Channel 2 Enabled

TA= +25°C
CL=68µF

100ms/div

Turn-On Time vs Input Voltage

850

750

650

550

450

Turn-On Time (us)

350

250

1.522.533.544.555.56

Input V o ltage (V)

CL=1µF
RL=10

=+

°

Rise Time vs I nput Vol t age

650

600

550

500

450

Rise Time (us)

400

350

300

22.533.544.555.56

Input V o ltage (V)

CL=1µF
RL=10

=+

°

50ms/div

Turn-O f f Ti m e vs I nput Voltage

55

50

45

40

35

Turn-Off Time (us)

30

25

1.5 2 2.5 3 3.5 4 4.5 5 5.5 6

Input Vo l tage (V)

Fall Time vs Input Volt age

25

24

23

22

Fall Time (us )

21

20

19

22.533.544.555.56

Input Vo l tage (V)

CL=1µF
RL=10

=+

CL=1µF
RL=10

=+

°

°

AP2186/ AP2196

Document number: DS31815 Rev. 3 - 2

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Typical Performance Characteristics (cont.)

Supply Current, Output Enabled vs Ambient Temperature

52

47

42

37

32

Supply Current, Output Enabled (uA)

27

Vin=5.5V

-60 -40 -20 0 20 40 60 80 100

Vin=5.0V

Vin=2.7V

Vin=3.3V

Ambient Temperature (°C )

AP2186/ AP2196

Supply Current, Output Disabl ed vs A m bient Temper at ure

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

Supply Current, Output Disabled (uA)

0.0

-60 -40 -20 0 20 40 60 80 100

Vin=3.3V

Vin=5.0V

Ambient Temperature (°C)

Vin=5.5V

Vin=2.7V

Static Drai n- Source On-State Resist ance vs Ambient

180
170
160
150
140
130
120
110

Resistance (mΩ)

100

Static Drain-Source On-State

90
80

-60 -40 -20 0 20 40 60 80 100

Temperature

Vin=2.7V

Vin=3.3V

Vin=5V

Ambient Temperature (°C)

Undervoltage Lockout vs Ambient Temperature

2.15

2.10

2.05

2.00

1.95

Undervoltage Lockout (V)

1.90

-60 -40 -20 0 20 40 60 80 100

UVLO Rising

UVLO Falling

Amb ient Temperature (°C)

Short-Cir cui t O ut put Curr ent vs A m bi ent Tem per at ure

2.60

CL=100µF

2.50

2.40

2.30

2.20

2.10

Short-Circuit Output Current (A)

2.00

-60 -40 -20 0 20 40 60 80 100

3.24

3.22

3.20

3.18

3.16

3.14

3.12

Threshold Trip Current (A)

3.10

3.08

2.8 3.3 3.8 4.3 4.8 5.3

Vin=2.7V

Threshold Tri p Curr ent v s I nput Vol t age

Vin=3.3V

Ambient Temperature (°C)

Input Voltage (V)

Vin=5.0V

TA= +25°C
CL=68µF

Vin=5.5V

AP2186/ AP2196

Document number: DS31815 Rev. 3 - 2

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Typical Performance Characteristics (cont.)

Current Limit Response vs Peak Current

45
40
35
30
25
20
15
10

Current Limit Response (us)

5
0

024681012

Peak Current (A)

V

= 5V

IN
TA= +25°C
CL=68µF,

=68µF

L

AP2186/ AP2196

AP2186/ AP2196

Document number: DS31815 Rev. 3 - 2

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AP2186/ AP2196

Application Information

Power Supply Considerations

A 0.01-F to 0.1-F X7R or X5R ceramic bypass capacitor between IN and GND, close to the device, is recommended. Placing a high-value
electrolytic capacitor on the input (10-F minimum) and output pin(s) is recommended when the output load is heavy. This precaution reduces
power-supply transients that may cause ringing on the input. Additionally, bypassing the output with a 0.01-F to 0.1-F ceramic capacitor improves
the immunity of the device to short-circuit transients.

Over-Current and Short Circuit Protection

An internal sensing FET is employed to check for over-current conditions. Unlike current-sense resistors, sense FETs do not increase the series
resistance of the current path. When an overcurrent condition is detected, the device maintains a constant output current and reduces the output
voltage accordingly. Complete shutdown occurs only if the fault stays long enough to activate thermal limiting.

Three possible overload conditions can occur. In the first condition, the output has been shorted to GND before the device is enabled or before VIN
has been applied. The AP2186/AP2196 senses the short circuit and immediately clamps output current to a certain safe level namely I

LIMIT

.

In the second condition, an output short or an overload occurs while the device is enabled. At the instance the overload occurs, highe r curr ent m ay
flow for a very short period of time before the current limit function can react. After the current limit function has tripped (reached the over-current
trip threshold), the device switches into current limiting mode and the current is clamped at I

LIMIT

.

In the third condition, the load has been gradually increased beyond the recommended operating current. The current is permitted to rise until the
current-limit threshold (I
to the current-limit threshold without damaging the device. Once the threshold has been reached, the device switches into its current limiting mode
and is set at I

LIMIT

.

) is reached or until the thermal limit of the device is exceeded. The AP2186/AP2196 is capable of delivering current up

TRIG

Note that when the output has been shorted to GND at extremely low temperature (< -30°C), a minimum 120-F electrolytic capacitor on the output
pin is recommended. A correct capacitor type with capacitor voltage rating and temperature characteristics must be properly chosen so that
capacitance value does not drop too low at the extremely low temperature operation. A recommended capacitor should have temperature
characteristics of less than 10% variation of capacitance change when operated at extremely low temp. Our recommended aluminum electrolytic
capacitor type is Panasonic FC series.

FLG Response

When an over-current or over-temperature shutdown condition is encountered, the FLG open-drain output goes a ctive low after a nominal 7-ms
deglitch timeout. The FLG output remains low until both over-current and over-temperature conditions are removed. Connecting a heavy capacitive
load to the output of the device can cause a momentary over-current condition, which does not trigger the FLG due to the 7-ms deglitch timeout.
The AP2186/AP2196 is designed to eliminate false over-current reporting without the need of external components to remove unwanted pulses.

Power Dissipation and Junction Temperature

The low on-resistance of the internal MOSFET allows the small surface-mount packages to pass large current. Using the maximum operating
ambient temperature (T

= R

P

D

DS(ON)

Finally, calculate the junction temperature:

T

= PD x R

J

Where:

= Ambient temperature C

T

A

R

= Thermal resistance

JA



= Total power dissipation

P

D

Thermal Protection

Thermal protection prevents the IC from damage when heavy-overload or short-circuit faults are present for extended periods of time. The
AP2186/AP2196 implements a thermal sensing to monitor the operating junction temperature of the power distribution switch. Once the die
temperature rises to approximately 140°C due to excessive power dissipation in an over-current or short-circuit condition the internal thermal sense
circuitry turns the power switch off, thus preventing the power switch from damage. Hysteresis is built into the thermal sense circuit allowing the
device to cool down approximately 25°C before the switch turns back on. The switch continues to cycle in this manner until the load fault or input
power is removed. The FLG open-drain output is asserted when an over-temperature shutdown or over-current occurs with 7-ms deglitch.

AP2186/ AP2196

Document number: DS31815 Rev. 3 - 2



× I2

JA

A

+ TA

) and R

, the power dissipation can be calculated by:

DS(ON)

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AP2186/ AP2196

Application Information (cont.)

Under-Voltage Lockout (UVLO)

Under-voltage lockout function (UVLO) keeps the internal power switch from being turned on until the power supply has reached at least 1.9V, even
if the switch is enabled. Whenever the input voltage falls below approximately 1.9V, the power switch is quickly turned off. This facilitates the design
of hot-insertion systems where it is not possible to turn off the power switch before input power is removed.

Host/Self-Powered HUBs

Hosts and self-powered hubs (SPH) have a local power supply that powers the embedded functions and the downstream ports (see F igure 2). This
power supply must provide from 5.25V to 4.75V to the board side of the downstream connection unde r both full-load and no-load conditions. Hosts
and SPHs are required to have current-limit protection and must report over-current conditions to the USB controller. Typical SPHs are desktop
PCs, monitors, printers, and stand-alone hubs.

68uF

68uF

Downstream

USB Ports

D+
D-

V

BUS

GND

D+
D-

V

BUS

GND

USB

Controller

Power Supply

3.3V

5V

0.1uF

2

8
3
5
4

IN

FLG1

EN1

FLG2

EN2

AP2186

GND

1

OUT1

OUT2

7

0.1uF

6

0.1uF

Figure 2 Typical Two-Port USB Host / Self-Powered Hub

Generic Hot-Plug Applications

In many applications it may be necessary to remove modules or pc boards while the main unit is still operating. These are considered hot-plug
applications. Such implementations require the control of current surges seen by the main power supply and the card being inserted. The most
effective way to control these surges is to limit and slowly ramp the current and voltage being applied to the card, similar to the way in which a
power supply normally turns on. Due to the controlled rise times and fall times of the AP2186/AP2196, these devices can be used to provide a
softer start-up to devices being hot-plugged into a powered system. The UVLO feature of the AP2186/AP2196 also ensures that the switch is off
after the card has been removed, and that the switch is off during the next insertion.

By placing the AP2186/AP2196 between the V
typical rise time of the switch is approximately 1ms, providing a slow voltage ramp at the output of the device. This implementation controls system
surge current and provides a hot-plugging mechanism for any device.

AP2186/ AP2196

Document number: DS31815 Rev. 3 - 2

input and the rest of the circuitry, the input power reaches these devices first after insertion. The

CC

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© Diodes Incorporated

Ordering Information

AP2186/ AP2196

Part Number Package Code Packaging

AP21X6SG-13 S SO-8 2500/Tape & Reel -13

AP21X6MPG-13 MP MSOP-8EP 2500/Tape & Reel -13

Quantity Part Number Suffix

13” Tape and Reel

Marking Information

(1) SO-8

( Top view )

8765

(2) MSOP-8EP

Logo

Part Number

8 : Active Low
9 : Active High

AP21X X

YY WW X X

2

1

34

6 : 2 Channel
G : Green

YY

: Year : 08, 09,10~

WW

: Week : 01~52; 52

represents 52 and 53 week

: Internal Code

X

AP2186/ AP2196

Document number: DS31815 Rev. 3 - 2

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March 2013

Package Outline Dimensions (All dimensions in mm.)

Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.

Package Type: SO-8

(1)

e

b

D

E1

A2

E

A1

Detail ‘A’

h

°

45

A3

A

L

0.254

Gaug e Plane
Seating Plane

7°~9

°

Detail ‘A’

Dim Min Max

SO-8

A - 1.75
A1 0.10 0.20
A2 1.30 1.50
A3 0.15 0.25

b 0.3 0.5
D 4.85 4.95
E 5.90 6.10

E1 3.85 3.95

e 1.27 Typ

h - 0.35

L 0.62 0.82

0 8



All Dimensions in mm

(2) Package Type: MSOP-8EP

D

x

y

E

E2

1

e

A1

A

D

8Xb

A3

A2

AP2186/ AP2196

Document number: DS31815 Rev. 3 - 2

D1

E3

E1

Gauge Plane
Seating Plane

c

See Detail C

4

X

1

0.25

4

X

1

0

°

Detail C

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0

°

a

L

MSOP-8EP

Dim Min Max Typ

A - 1.10 ­A1 0.05 0.15 0.10
A2 0.75 0.95 0.86
A3 0.29 0.49 0.39

b 0.22 0.38 0.30

c 0.08 0.23 0.15

D 2.90 3.10 3.00
D1 1.60 2.00 1.80

E 4.70 5.10 4.90
E1 2.90 3.10 3.00
E2 1.30 1.70 1.50
E3 2.85 3.05 2.95

e - - 0.65

L 0.40 0.80 0.60

a 0° 8° 4°

x - - 0.750

y - - 0.750

All Dimensions in mm

AP2186/ AP2196

March 2013

© Diodes Incorporated

Suggested Pad Layout

Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.

(1) Package Type: SO-8

X

C1

C2

Dimensions Value (in mm)

X 0.60

Y 1.55
C1 5.4
C2 1.27

Y

(2) Package Type: MSOP-8EP

X C

G

Y2

AP2186/ AP2196

Document number: DS31815 Rev. 3 - 2

X1

Y

Y1

Dimensions

C 0.650
G 0.450
X 0.450

X1 2.000

Y 1.350
Y1 1.700
Y2 5.300

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Value

(in mm)

AP2186/ AP2196

March 2013

© Diodes Incorporated

AP2186/ AP2196

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INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).

Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
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website, harmless against all damages.

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indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.

Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
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This document is written in English but may be translated into multiple languages for reference. Onl y the English version of this document is the
final and determinative format released by Diodes Incorporated.

Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:

A. Life support devices or systems are devices or systems which:

1. are intended to implant into the body, or

2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the

labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the

failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and

acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.

Copyright © 2013, Diodes Incorporated

www.diodes.com

IMPORTANT NOTICE

LIFE SUPPORT

AP2186/ AP2196

Document number: DS31815 Rev. 3 - 2

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March 2013

© Diodes Incorporated