1.5A DUAL CHANNEL CURRENT-LIMITED POWER SWITCH
Description
The AP2182 and AP2192 are integrated high-side power switches
optimized for Universal Serial Bus (USB) and other hot-swap
applications. The family of devices complies with USB 2.0 and
available with both polarities of Enable input. They offer current and
thermal limiting and short circuit protection as well as controlled rise
time and under-voltage lockout functionality. A 7ms deglitch capability
on the open-drain Flag output prevents false over-current reporting
and does not require any external components.
All devices are available in SO-8 and MSOP-8EP packages.
Features
Pin Assignments
GND
IN
EN
IN
( Top View )
1
2
3
4
( Top View )
SO-8
AP2182/ AP2192
8
NC
7
OUT
6
OUT
5
FLG
Dual USB port power switches
Over-current and thermal protection
2.1A accurate current limiting
Reverse Current Blocking
115m on-resistance
Input voltage range: 2.7V - 5.5V
0.6ms typical rise time
Very low shutdown current: 1µA (max)
Fault report (FLG) with blanking time (7ms typ)
ESD protection: 4.5KV HBM, 350V MM
Active high (AP2192) or active low (AP2182) enable
Ambient temperature range -40ºC to +85°C
SO-8 and MSOP-8EP (Exposed Pad): Available in “Green”
Molding Compound (No Br, Sb)
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
UL Recognized, File Number E322375
IEC60950-1 CB Scheme Certified
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
Applications
Consumer electronics – LCD TV & Monitor, Game Machines
Communications – Set-Top-Box, GPS, Smartphone
Computing – Laptop, Desktop, Servers, Printers, Docking Station,
GND
HUB
IN
EN
1
2
IN
3
4
MSOP-8EP
NC
8
7
OUT
6
OUT
5
FLG
Typical Applications Circuit
AP2192 Enable Active High
Power Supply
2.7V to 5.5V
10k
10k
AP2182/ AP2192
Document number: DS31569 Rev. 7 - 2
OFF
10uF
ON
IN
0.1uF
FLG1
FLG2
EN1
EN2
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GND
OUT1
OUT2
0.1uF
0.1uF
68uF
68uF
Load
Load
© Diodes Incorporated
April 2013
AP2182/ AP2192
Available Options
Part Number Channel
AP2182 2 Active Low 2.1A 1.5A
AP2192 2 Active High 2.1A 1.5A
Enable Pin
(EN)
Current Limit
(typ)
Recommended Maximum
Continuous Load Current
Pin Descriptions
Pin
Name
Pin Number
SO-8 MSOP-8EP
Function
GND 1 1 Ground
IN
2 2 Voltage input pin
EN1 3 3 Switch 1 enable input, active low (AP2182) or a ctive h igh (AP2192)
EN2 4 4 Switch 2 enable input, active low (AP2182) or a ctive h igh (AP2192)
FLG2 5 5 Switch 2 over-current and over-temperature fault re port; open-dra in flag is act ive low w hen triggered
OUT2
OUT1
6 6 Switch 2 voltage output pin
7 7 Switch 1 voltage output pin
FLG1 8 8 Switch 1 over-current and over-temperature fault re port; open-dra in flag is act ive low w hen triggered
Exposed pad.
Exposed Tab — Exposed Tab
It should be connected to GND and thermal mass for enhanced thermal impedance.
It should not be used as electrical ground conduction path.
Functional Block Diagram
AP2182, AP2192
Thermal
Sense
FLG1
EN1
IN
EN2
AP2182/ AP2192
Document number: DS31569 Rev. 7 - 2
UVLO
UVLO
Driver
Driver
Thermal
Sense
Current
Limit
Current
Sense
Current
Sense
Cu rrent
Limit
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Deg litch
D eg litch
GND
GND
OUT1
OUT2
FLG2
April 2013
© Diodes Incorporated
AP2182/ AP2192
Absolute Maximum Ratings (@T
Symbol Parameter Rating Unit
ESD HBM Human Body Model ESD Protection 3 kV
ESD MM Machine Model ESD Protection 300 V
VIN
V
OUT
V
EN , VFLG
T
I
LOAD
J(MAX)
TST
Caution: Stresses greater than the 'Absolute Maximum Ratings' specified above, may cause permanent damage to the device. These are stress ratings only;
Note: 4. UL Recognized Rating from -30°C to +70°C (Diodes qualified
functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability may be
affected by exposure to absolute maximum rating conditions for extended periods of time.
Semiconductor devices are ESD sensitive and may be damaged by exposure to ESD events. Suitable ESD precautions should be taken when handling
and transporting these devices
Input Voltage 6.5 V
Output Voltage
Enable Voltage 6.5 V
Maximum Continuous Load Current Internal Limited A
Maximum Junction Temperature 150 °C
Storage Temperature Range (Note 4) -65 to +150 °C
Recommended Operating Conditions (@T
Symbol Parameter Min Max Units
V
IN
I
OUT
V
IL
V
IH
T
A
Input voltage 2.7 5.5 V
Output Current 0 1.5 A
EN Input Logic Low Voltage 0 0.8 V
EN Input Logic High Voltage 2
Operating Ambient Temperature -40 +85
= +25°C, unless otherwise specified.)
A
VIN +0.3
T
from -65°C to +150°C)
ST
= +25°C, unless otherwise specified.)
A
V
V
IN
V
C
AP2182/ AP2192
Document number: DS31569 Rev. 7 - 2
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© Diodes Incorporated
AP2182/ AP2192
Electrical Characteristics (@T
= +25°C, VIN = +5V, unless otherwise specified.)
A
Symbol Parameter Test Conditions Min Typ Max Unit
V
UVLO
I
SHDN
I
LEAK
I
REV
R
DS(ON)
I
SHORT
I
LIMIT
I
V
V
I
SINK
T
D(ON)
T
D(OFF)
R
T
Blank
T
SHDN
T
Notes: 5. Test condition for SO-8: Device mounted on FR-4 2-layer board, 2oz copper, with minimum recommended pad layout.
6. Test condition for MSOP-8EP: Device mounted on FR-4 2-layer board, 2oz copper, with minimum recommended pad on top layer and 3 vias to bottom
layer ground plane.
Input UVLO
Input Shutdown Current
Input Quiescent Current, Dual
I
Q
R
= 1k
LOAD
Disabled, I
Enabled, I
OUT
OUT
= 0
= 0
Input Leakage Current Disabled, OUT grounded 1 µA
Reverse Leakage Current
Switch on-resistance
Short-circuit current limit
Over-Load Current Limit
Current limiting trigger threshold
Trig
EN Input Logic Low Voltage
IL
EN Input Logic High Voltage
IH
EN Input leakage
Output turn-on delay time
Output turn-on rise time
TR
Output turn-off delay time
Output turn-off fall time
TF
FLG output FET on-resistance
FLG
FLG blanking time
Thermal shutdown threshold
Thermal shutdown hysteresis 25
HYS
Thermal Resistance Junction-to-Ambient
JA
Disabled, VIN = 0V, V
= 5V,
V
IN
= 0.5A,
I
OUT
VIN = 3.3V, I
= 0.5A, -40°C TA 85°C
OUT
= 5V, I
OUT
MSOP-8EP, -40°C T
REV
at VIN
+85°C
A
SO-8, -40°C TA +85°C
Enabled into short circuit, CL = 68µF
VIN = 5V, V
= 4.5V, CL = 68µF, -40°C TA +85°C
OUT
VIN = VEN, Output Current Slew rate (<100A/WS), CL = 68µF
V
= 2.7V to 5.5V
IN
= 2.7V to 5.5V
V
IN
= 5V
V
EN
CL=1µF, R
CL=1µF, R
CL=1µF, R
CL=1µF, R
I
=10mA
FLG
C
=10µF, CL = 68µF
IN
Enabled, R
LOAD
LOAD
LOAD
LOAD
LOAD
= 10
= 10
= 10
= 10
= 1k
SO-8 (Note 5) 110
MSOP-8EP (Note 6) 60 oC/W
1.6 1.9 2.5 V
0.5 1 µA
100 160 µA
1 µA
115 150 m
120 160 m
140 180 m
2.0 A
1.6 2.1 2.6 A
3.0 A
0.8 V
2 V
1 µA
0.05 ms
0.6 1.5 ms
0.01 ms
0.05 0.1 ms
30 50
4 7 15 ms
140
AP2182/ AP2192
Document number: DS31569 Rev. 7 - 2
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© Diodes Incorporated
C
C
o
C/W
Typical Performance Characteristics
AP2182/ AP2192
V
EN
V
OUT
50%
T
D(ON)
T
10%
50%
T
R
90%
D(OFF)
90%
10%
T
F
V
EN
50%
T
T
D(ON)
V
OUT
10%
50%
T
R
90%
D(OFF)
90%
10%
CL=1uF
T
F
TA=25°C
=
Figure 1 Voltage Waveforms: AP2182 (left), AP2192 (right)
All Enable Plots are for AP2192 Active High
Ven 1
5V/div
Vout 1
2V/div
Channel 1 Turn-On Delay and Rise Time
CL = 1µF
TA = +25°C
RL = 5
400µs/div
Ven 1
5V/div
Vout 1
2V/div
Channel 1 Turn-Off Delay and Fall Time
400µs/div
CL= 1µF
TA = +25°C
R
= 5
L
Channel 2 Turn-On Delay and Rise Time
Channel 2 Turn-Off Delay and Fall Time
Ven 2
5V/div
Vout 2
2V/div
AP2182/ AP2192
Document number: DS31569 Rev. 7 - 2
400µs/div
CL=1µF
TA = +25°C
RL = 5
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Ven 2
5V/div
Vout 2
2V/div
400µs/div
CL=1µF
TA=25°C
RL=5
April 2013
© Diodes Incorporated
Typical Performance Characteristics (cont.)
Channel 1 Turn-On Delay and Rise Time
AP2182/ AP2192
Channel 1 Turn-Off Delay and Fall Time
Ven 2
5V/div
Vout 2
2V/div
Ven 2
5V/div
Vout 2
2V/div
400µs/div
Channel 2 Turn-On Delay and Rise Time
400µs/div
Channel 1 Short Circuit Current,
Device Enabled Into Short
CL = 100µF
TA = +25°C
RL = 5
CL = 100µF
TA = +25°C
RL = 5
Ven 2
5V/div
Vout 2
2V/div
Ven 2
5V/div
Vout 2
2V/div
400µs/div
Channel 2 Turn-Off Delay and Fall Time
400µs/div
Channel 2 Short Circuit Current,
Device Enabled Into Short
CL = 100µF
TA = +25°C
RL = 5
CL = 100µF
TA = +25°C
R
= 5
L
Ven 1
5V/div
Iout 1
500mA/div
AP2182/ AP2192
Document number: DS31569 Rev. 7 - 2
500µs/div
V
= 5V
IN
TA = 25°C
CL = 68µF
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Ven 2
5V/div
Iout 2
500mA/div
500µs/div
V
= 5V
IN
TA = +25°C
C
= 68µF
L
April 2013
© Diodes Incorporated
Typical Performance Characteristics (cont.)
Channel 1 Inrush Current
AP2182/ AP2192
Channel 2 Inrush Current
Ven 1
5V/div
Iout 1
500mA/div
Vflag 1
2V/div
Iout 1
1A/div
CL=100µF
CL=220µF
CL=470µF
1ms/div
Channel 1
0.6 Ω Load Connected to Enabled Device
V
= 5V
IN
TA = +25°C
R
= 3.3
L
V
= 5V
IN
TA = +25°C
C
= 68µF
L
Ven 2
5V/div
Iout 2
500mA/div
Vflag 2
2V/div
Iout 2
1A/div
CL=100µF
CL=220µF
CL=470µF
1ms/div
Channel 2
0.6 Ω Load Connected to Enabled Device
V
= 5V
IN
TA = +25°C
R
= 3.3
L
V
= 5V
IN
TA = +25°C
C
= 68µF
L
Short Circuit with Blanking Time and Recovery
Vout 1
5V/div
Vflag 1
5V/div
Iout 1
2A/div
AP2182/ AP2192
Document number: DS31569 Rev. 7 - 2
2ms/div
2ms/div
Channel 1
Channel 2
Short Circuit with Blanking Time and Recovery
Vout 2
20ms/div
V
= 5V
IN
TA = +25°C
CL = 68µF
5V/div
Vflag 2
5V/div
Iout 2
2A/div
20ms/div
V
= 5V
IN
TA = +25°C
CL = 68µF
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© Diodes Incorporated
Typical Performance Characteristics (cont.)
Channel 1 Power On
AP2182/ AP2192
Channel 2 Power On
Vflag 1
5V/div
Iout 1
500mA/div
Ven 1
5V/div
Vin
5V/div
Vin
2V/div
Iout 1
500mA/div
1ms/div
Channel 1 UVLO Increasing
TA = +25°C
CL = 68µF
R
= 3
L
TA = +25°C
CL = 68µF
R
= 3
L
Vflag 2
5V/div
Iout 2
500mA/div
Ven 2
5V/div
Vin
5V/div
Vin
2V/div
Iout 1
500mA/div
1ms/div
Channel 1 UVLO Decreasing
TA = +25°C
CL = 68µF
R
= 3
L
TA = +25°C
CL = 68µF
R
= 3
L
Channel 2 UVLO Increasing
Vin
2V/div
Iout
500mA/div
AP2182/ AP2192
Document number: DS31569 Rev. 7 - 2
1ms/div
10ms/div
Channel 2 UVLO Decreasing
TA = +25°C
CL = 68µF
RL = 3
1ms/div
TA = +25°C
CL = 68µF
RL = 3
Vin
2V/div
Iout
500mA/div
10ms/div
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© Diodes Incorporated
Typical Performance Characteristics (cont.)
Channel 1 Enabled and Shorted with Channel 2 Disabled
Vout 1
5V/div
Ven1
5V/div
AP2182/ AP2192
Channel 1 Disabled and Channel 2 Enabled
Vout 2
5V/div
Vflag 1
5V/div
Iout 2
500mA/div
TA = +25°C
C
= 68µF
L
100ms/div
Turn-On Time vs Input Voltage
850
750
650
550
450
Turn-On Time (us)
350
250
1.522.533.544.555.56
Input V o ltage (V)
CL = 1µF
RL = 10
=+
°
Vout 1
5V/div
Ven2
5V/div
Vout 2
5V/div
TA = +25°C
C
= 68µF
L
50ms/div
Turn-O f f Ti m e vs I nput Voltage
55
50
45
40
35
Turn-Off Time (us)
30
25
1.5 2 2.5 3 3.5 4 4.5 5 5.5 6
Input Vo l tage (V)
CL = 1µF
RL = 10
=+
°
Rise Time vs I nput Vol t age
650
600
550
500
450
Rise Time (us)
400
350
300
22.533.544.555.56
AP2182/ AP2192
Document number: DS31569 Rev. 7 - 2
Input V o ltage (V)
CL = 1µF
RL = 10
=+
°
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Fall Time vs I nput Voltage
25
24
23
22
Fall Time (us)
21
20
19
22.533.544.555.56
Input Vo l tage (V)
CL = 1µF
RL = 10
=+
°
April 2013
© Diodes Incorporated
Typical Performance Characteristics (cont.)
Supply Current, Output Enabled vs Ambient Temperat ure
52
47
42
37
32
Supply Current, Output Enabled (uA)
27
Vin=5.5V
-60 -40 -20 0 20 40 60 80 100
Vin=5.0V
Vin=2.7V
Vin=3.3V
Amb ient Tem perature (°C )
AP2182/ AP2192
Supply Current, Output Disabl ed vs A m bient Temper at ure
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
Supply Current, Output Disabled (uA)
0.0
-60 -40 -20 0 20 4 0 60 80 100
Vin=3.3V
Vin=5.0V
Amb ient Temperature (°C)
Vin=5.5V
Vin=2.7V
Static Drai n- Source On-State Resist ance vs Ambient
180
170
160
150
140
130
120
110
Resistance (mΩ)
100
Static Drain-Source On-State
90
80
-60 -40 -20 0 20 40 60 80 100
Undervoltage Lockout vs Ambient Temperat ure
2.15
2.10
2.05
2.00
1.95
Undervoltage Lockout (V)
1.90
-60 -40 -20 0 20 40 60 80 100
Temperature
Vin=2.7V
Vin=3.3V
Vin=5V
Ambient Temperature (°C)
UVLO Rising
UVLO Falling
Ambien t Temperature (°C)
Short-Cir cui t O ut put Curr ent vs A m bi ent Tem per at ure
2.60
CL=100µF
2.50
2.40
2.30
2.20
2.10
Short-Circuit Output Current (A)
2.00
3.24
3.22
3.20
3.18
3.16
3.14
3.12
Threshold Trip Current (A)
3.10
3.08
Vin=2.7V
-60 -40 -20 0 20 40 60 80 100
Threshold Tri p Curr ent v s I nput Vol t age
2.8 3.3 3.8 4.3 4.8 5.3
Vin=3.3V
Amb ient Temperature (°C )
Input Voltage (V)
Vin=5.0V
Vin=5.5V
TA = +25°C
CL = 68µF
AP2182/ AP2192
Document number: DS31569 Rev. 7 - 2
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© Diodes Incorporated
Typical Performance Characteristics (cont.)
Current Limit Response vs Peak Current
45
40
35
30
25
20
15
10
Current Limit Response (us)
5
0
024681012
Peak Current (A)
V
= 5V
IN
TA = +25°C
CL = 68µF,
= 68µF
L
AP2182/ AP2192
AP2182/ AP2192
Document number: DS31569 Rev. 7 - 2
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© Diodes Incorporated
AP2182/ AP2192
Application Information
Power Supply Considerations
A 0.01-F to 0.1-F X7R or X5R ceramic bypass capacitor between IN and GND, close to the device, is recommended. Placing a high-value
electrolytic capacitor on the input and output pin(s) is recommended when the output load is heavy. This precaution reduces power-supply
transients that may cause ringing on the input. Additionally, bypassing the output with a 0.01-F to 0.1-F ceramic capacitor improves the immunity
of the device to short-circuit transients.
Over-Current and Short Circuit Protection
An internal sensing FET is employed to check for over-current conditions. Unlike current-sense resistors, sense FETs do not increase the series
resistance of the current path. When an overcurrent condition is detected, the device maintains a constant output current and reduces the output
voltage accordingly. Complete shutdown occurs only if the fault stays long enough to activate thermal limiting.
Three possible overload conditions can occur. In the first condition, the output has been shorted to GND before the device is enabled or before VIN
has been applied. The AP2182/AP2192 senses the short circuit and immediately clamps output current to a certain safe level namely I
LIMIT
.
In the second condition, an output short or an overload occurs while the device is enabled. At the instance the overload occurs, highe r curr ent m ay
flow for a very short period of time before the current limit function can react. After the current limit function has tripped (reached the over-current
trip threshold), the device switches into current limiting mode and the current is clamped at I
LIMIT
.
In the third condition, the load has been gradually increased beyond the recommended operating current. The current is permitted to rise until the
current-limit threshold (I
to the current-limit threshold without damaging the device. Once the threshold has been reached, the device switches into its current limiting mode
and is set at I
LIMIT
.
FLG Response
When an over-current or over-temperature shutdown condition is encountered, the FLG open-drain output goes a ctive low after a nominal 7-ms
deglitch timeout. The FLG output remains low until both over-current and over-temperature conditions are removed. Connecting a heavy capacitive
load to the output of the device can cause a momentary over-current condition, which does not trigger the FLG due to the 7-ms deglitch timeout.
The AP2182/AP2192 is designed to eliminate false over-current reporting without the need of external components to remove unwanted pulses.
Power Dissipation and Junction Temperature
The low on-resistance of the internal MOSFET allows the small surface-mount packages to pass large current. Using the maximum operating
ambient temperature (T
= R
P
D
DS(ON)
× I2
Finally, calculate the junction temperature:
= PD x R
T
J
JA
Where:
= Ambient temperature C
T
A
= Thermal resistance
R
JA
= Total power dissipation
P
D
Thermal Protection
Thermal protection prevents the IC from damage when heavy-overload or short-circuit faults are present for extended periods of time. The
AP2182/AP2192 implements a thermal sensing to monitor the operating junction temperature of the power distribution switch. Once the die
temperature rises to approximately 140°C due to excessive power dissipation in an over-current or short-circuit condition the internal thermal sense
circuitry turns the power switch off, thus preventing the power switch from damage. Hysteresis is built into the thermal sense circuit allowing the
device to cool down approximately 25°C before the switch turns back on. The switch continues to cycle in this manner until the load fault or input
power is removed. The FLG open-drain output is asserted when an over-temperature shutdown or over-current occurs with 7-ms deglitch.
AP2182/ AP2192
Document number: DS31569 Rev. 7 - 2
) is reached or until the thermal limit of the device is exceeded. The AP2182/AP2192 is capable of delivering current up
TRIG
) and R
A
, the power dissipation can be calculated by:
DS(ON)
+ TA
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© Diodes Incorporated
April 2013
AP2182/ AP2192
Application Information (cont.)
Under-Voltage Lockout (UVLO)
Under-voltage lockout function (UVLO) keeps the internal power switch from being turned on until the power supply has reached at least 1.9V, even
if the switch is enabled. Whenever the input voltage falls below approximately 1.9V, the power switch is quickly turned off. This facilitates the design
of hot-insertion systems where it is not possible to turn off the power switch before input power is removed.
Host/Self-Powered HUBs
Hosts and self-powered hubs (SPH) have a local power supply that powers the embedded functions and the downstream ports (see F igure 2). This
power supply must provide from 5.25V to 4.75V to the board side of the downstream connection under both full-load and no-load c onditions. Hosts
and SPHs are required to have current-limit protection and must report over-current conditions to the USB controller. Typical SPHs are desktop
PCs, monitors, printers, and stand-alone hubs.
Figure 2 Typical Two-Port USB Host / Self-Powered Hub
Generic Hot-Plug Applications
In many applications it may be necessary to remove modules or pc boards while the main unit is still operating. These are considered hot-plug
applications. Such implementations require the control of current surges seen by the main power supply and the card being inserted. The most
effective way to control these surges is to limit and slowly ramp the current and voltage being applied to the card, similar to the way in which a
power supply normally turns on. Due to the controlled rise times and fall times of the AP2182/AP2192, these devices can be used to provide a
softer start-up to devices being hot-plugged into a powered system. The UVLO feature of the AP2182/AP2192 also ensures that the switch is off
after the card has been removed, and that the switch is off during the next insertion.
By placing the AP2182/AP2192 between the VCC input and the rest of the circuitry, the input power reaches these devices first after insertion. The
typical rise time of the switch is approximately 1ms, providing a slow voltage ramp at the output of the device. This implementation controls system
surge current and provides a hot-plugging mechanism for any device.
AP2182/ AP2192
Document number: DS31569 Rev. 7 - 2
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© Diodes Incorporated
Ordering Information
AP2182/ AP2192
Part Number Package Code Packaging
AP21X2SG-13 S SO-8 2500/Tape & Reel -13
AP21X2MPG-13 MP MSOP-8EP 2500/Tape & Reel -13
Quantity Part Number Suffix
13” Tape and Reel
Marking Information
(1) SO-8
( Top view )
8765
(2) MSOP-8EP
Logo
Part Number
8 : Active Low
9 : Active High
AP21X X
YY WW X X
2
1
( Top view )
34
2 : 2 Channel
G : Green
YY
: Year : 08, 09,10~
WW
: Week : 01~52; 52
represents 52 and 53 week
: Internal Code
X
Part Number
8 : Active Low
9 : Active High
AP2182/ AP2192
Document number: DS31569 Rev. 7 - 2
Logo
8765
Y W X E
AP21X X
234
1
14 of 17
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A~Z : Green
MSOP-8EP
Y : Year : 0~9
W : Week : A~Z : 1~26 week;
a~z : 27~52 week; z represents
52 and 53 week
2 : 2 Channel
April 2013
© Diodes Incorporated
Package Outline Dimensions (All dimensions in mm.)
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
(1) Package type: SO-8
e
b
D
E1
A2
E
A1
Detail ‘A’
h
°
45
A3
A
L
0.254
Gaug e Plane
Seating Plane
7°~9
°
Detail ‘A’
(2) Package type: MSOP-8EP
D
4
x
y
E
E2
1
e
A1
A
D
8Xb
A3
A2
AP2182/ AP2192
Document number: DS31569 Rev. 7 - 2
D1
E3
E1
Gauge Plane
Seating Plane
See Detail C
0.25
4
X
1
0
c
X
1
0
°
a
°
L
Detail C
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AP2182/ AP2192
Dim Min Max
Dim Min Max Typ
A1 0.05 0.15 0.10
A2 0.75 0.95 0.86
A3 0.29 0.49 0.39
D1 1.60 2.00 1.80
E1 2.90 3.10 3.00
E2 1.30 1.70 1.50
E3 2.85 3.05 2.95
SO-8
A - 1.75
A1 0.10 0.20
A2 1.30 1.50
A3 0.15 0.25
b 0.3 0.5
D 4.85 4.95
E 5.90 6.10
E1 3.85 3.95
e 1.27 Typ
h - 0.35
L 0.62 0.82
0 8
All Dimensions in mm
MSOP-8EP
A - 1.10 -
b 0.22 0.38 0.30
c 0.08 0.23 0.15
D 2.90 3.10 3.00
E 4.70 5.10 4.90
e - - 0.65
L 0.40 0.80 0.60
a 0° 8° 4°
x - - 0.750
y - - 0.750
All Dimensions in mm
April 2013
© Diodes Incorporated
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
(1) Package type: SO-8
X
C1
C2
Dimensions Value (in mm)
X 0.60
Y 1.55
C1 5.4
C2 1.27
Y
(2) Package type: MSOP-8EP
X C
G
Y2
AP2182/ AP2192
Document number: DS31569 Rev. 7 - 2
X1
Y
Y1
Dimensions
C 0.650
G 0.450
X 0.450
X1 2.000
Y 1.350
Y1 1.700
Y2 5.300
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www.diodes.com
Value
(in mm)
AP2182/ AP2192
April 2013
© Diodes Incorporated
AP2182/ AP2192
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document o r products described herein in such applica tions shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorize d application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Onl y the English version of this document is the
final and determinative format released by Diodes Incorporated.
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2013, Diodes Incorporated
www.diodes.com
IMPORTANT NOTICE
LIFE SUPPORT
AP2182/ AP2192
Document number: DS31569 Rev. 7 - 2
17 of 17
www.diodes.com
April 2013
© Diodes Incorporated
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