The AP2146 and AP2156 are integrated high-side power switches
optimized for Universal Serial Bus (USB) and other hot-swap
applications. The family of devices complies with USB 2.0 and
available with both polarities of Enable input. They offer current and
thermal limiting and short circuit protection as well as controlled rise
time and under-voltage lockout functionality. A 7ms deglitch capability
on the open-drain Flag output prevents false over-current reporting
and does not require any external components.
All devices are available in SO-8 and MSOP-8EP packages.
Features
Dual USB port power switches
Over-current and thermal protection
0.8A accurate current limiting
Reverse Current Blocking
90m on-resistance
Input voltage range: 2.7V - 5.5V
0.6ms typical rise time
Very low shutdown current: 1µA (max)
Fault report (FLG) with blanking time (7ms typ)
ESD protection: 6KV HBM, 300V MM
Active low (AP2146) or active high (AP2156) enable
Ambient temperature range -40ºC to +85°C
SO-8 and MSOP-8EP (Exposed Pad): Available in “Green”
UL Recognized, File Number E322375
IEC60950-1 CB Scheme Certified
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
AP2146 2 Active Low 0.8A 0.5A
AP2156 2 Active High 0.8A 0.5A
Current Limit
Pin Descriptions
Pin Name
Pin Number
SO-8 MSOP-8EP
Function
EN1 1 1 Switch 1 enable input, active low (AP2146) or active high (AP21 56)
FLG1 2 2 Switch 1 over-current and over-temperature fault report, open-dra in
FLG2 3 3 Switch 2 over-current and over-temperature fault report, open-dra in
EN2 4 4 Switch 2 enable input, active low (AP2146) or active high (AP21 56)
OUT2
5 5 Switch 2 voltage output pin
GND 6 6 Ground
IN
OUT1
7 7 Voltage input pin
8 8 Switch 1 voltage output pin
Exposed Pad:
Exposed Pad - Exposed Pad
It should be connected externally to GND and thermal mass for enhanced ther mal impedance.
It should not be used as electrical ground conduction path.
Note: 4. UL Recognized Rating from -30°C to +70°C (Diodes qualified TST from -65°C to +150°C)
Input Voltage 6.5 V
Output Voltage
VIN +0.3
V
Enable Voltage 6.5 V
Maximum Continuous Load Current Internal Limited A
Maximum Junction Temperature 150 °C
Storage Temperature Range (Note 4) -65 to +150 °C
Recommended Operating Conditions(@T
= +25°C, unless otherwise specified.)
A
Symbol Parameter Min Max Units
V
I
OUT
V
V
T
IN
IL
IH
A
Input voltage 2.7 5.5 V
Output Current 0 500 mA
Low-Level Input Voltage on EN or EN
High-Level Input Voltage on EN or EN
Notes: 5. Test condition for SO-8: Device mounted on FR-4 2-layer board, 2oz copper, with minimum recommended pad layout.
6. Test condition for MSOP-8EP: Device mounted on FR-4 2-layer board, 2oz copper, with minimum recommended pad on top layer and 3 vias to bottom
layer ground plane.
Input UVLO
UVLO
Input Shutdown Current
Input Quiescent Current, Dual
I
Q
Input Leakage Current Disabled, OUT grounded 1 µA
Reverse Leakage Current
REV
Switch on-resistance
Short-circuit current limit
Over-Load Current Limit
Current limiting trigger threshold
Trig
Short-circuit response time
EN Input Logic Low Voltage
V
IL
EN Input Logic High Voltage
IH
EN Input leakage
Output turn-on delay time
Output turn-on rise time
TR
Output turn-off delay time
Output turn-off fall time
TF
FLG output FET on-resistance
FLG
FLG blanking time
Thermal shutdown threshold
Thermal shutdown hysteresis 25
A 0.01-F to 0.1-F X7R or X5R ceramic bypass capacitor between IN and GND, close to the device, is recommended. Placing a high-value
electrolytic capacitor on the input (10-F minimum) and output pin(s) is recommended when the output load is heavy. This precaution reduces
power-supply transients that may cause ringing on the input. Additionally, bypassing the output with a 0.01-F to 0.1-F ceramic capacitor improves
the immunity of the device to short-circuit transients.
Over-Current and Short Circuit Protection
An internal sensing FET is employed to check for over-current conditions. Unlike current-sense resistors, sense FETs do not increase the series
resistance of the current path. When an overcurrent condition is detected, the device maintains a constant output current and reduces the output
voltage accordingly. Complete shutdown occurs only if the fault stays long enough to activate thermal limiting.
Three possible overload conditions can occur. In the first condition, the output has been shorted to GND before the device is enabled or before V
has been applied. The AP2146/AP2156 senses the short circuit and immediately clamps output current to a certain safe level namely I
LIMIT
IN
.
In the second condition, an output short or an overload occurs while the device is enabled. At the instance the overload occurs, highe r curr ent m ay
flow for a very short period of time before the current limit function can react. After the current limit function has tripped (reached the over-current
trip threshold), the device switches into current limiting mode and the current is clamped at I
In the third condition, the load has been gradually increased beyond the recommended operating current. The current is permitted to rise until the
current-limit threshold (I
) is reached or until the thermal limit of the device is exceeded. The AP2146/AP2156 is capable of delivering current up
TRIG
to the current-limit threshold without damaging the device. Once the threshold has been reached, the device switches into its current limiting mode
and is set at I
LIMIT
.
Note that when the output has been shorted to GND at extremely low temperature (< -30
pin is recommended. A correct capacitor type with capacitor voltage rating and temperature characteristics must be properly chosen so that
capacitance value does not drop too low at the extremely low temperature operation. A recommended capacitor should have temperature
characteristics of less than 10% variation of capacitance change when operated at extremely low temp. Our recommended aluminum electrolytic
capacitor type is Panasonic FC series.
FLG Response
When an over-current or over-temperature shutdown condition is encountered, the FLG open-drain output goes a ctive low after a nominal 7-ms
deglitch timeout. The FLG output remains low until both over-current and over-temperature conditions are removed. Connecting a heavy capacitive
load to the output of the device can cause a momentary over-current condition, which does not trigger the FLG due to the 7-ms deglitch timeout.
The AP2146/AP2156 is designed to eliminate false over-current reporting without the need of external components to remove unwanted pulses.
Power Dissipation and Junction Temperature
The low on-resistance of the internal MOSFET allows the small surface-mount packages to pass large current. Using the maximum operating
ambient temperature (T
= R
P
D
DS(ON)
× I2
) and R
A
, the power dissipation can be calculated by:
DS(ON)
Finally, calculate the junction temperature:
= PD x R
T
J
JA
+ TA
Where:
= Ambient temperature C
T
A
R
= Thermal resistance
JA
= Total power dissipation
P
D
Thermal Protection
Thermal protection prevents the IC from damage when heavy-overload or short-circuit faults are present for extended periods of time. The
AP2146/AP2156 implements a thermal sensing to monitor the operating junction temperature of the power distribution switch. Once the die
temperature rises to approximately 140°C due to excessive power dissipation in an over-current or short-circuit condition the internal thermal sense
circuitry turns the power switch off, thus preventing the power switch from damage. Hysteresis is built into the thermal sense circuit allowing the
device to cool down approximately 25°C before the switch turns back on. The switch continues to cycle in this manner until the load fault or input
power is removed. The FLG open-drain output is asserted when an over-temperature shutdown or over-current occurs with 7-ms deglitch.
AP2146/AP2156
Document number: DS31813 Rev. 3 - 2
12 of 17
www.diodes.com
.
LIMIT
o
C), a minimum 120-F electrolytic capacitor on the output
Under-voltage lockout function (UVLO) keeps the internal power switch from being turned on until the power supply has reached at least 1.9V, even
if the switch is enabled. Whenever the input voltage falls below approximately 1.9V, the power switch is quickly turned off. This facilitates the design
of hot-insertion systems where it is not possible to turn off the power switch before input power is removed.
Host/Self-Powered HUBs
Hosts and self-powered hubs (SPH) have a local power supply that powers the embedded functions and the downstream ports (see F igure 2). This
power supply must provide from 5.25V to 4.75V to the board side of the downstream connection unde r both full-load and no-load conditions. Hosts
and SPHs are required to have current-limit protection and must report over-current conditions to the USB controller. Typical SPHs are desktop
PCs, monitors, printers, and stand-alone hubs.
68uF
68uF
Downstream
USB Ports
D+
DV
BUS
GND
D+
DV
BUS
GND
Power Supply
3.3V
USB
Controller
5V
0.1uF
7
2
1
3
4
IN
FLG1
EN1
FLG2
EN2
AP2146
GND
6
OUT1
OUT2
8
0.1uF
5
0.1uF
Figure 2 Typical Two-Port USB Host / Self-Powered Hub
Generic Hot-Plug Applications
In many applications it may be necessary to remove modules or pc boards while the main unit is still operating. These are considered hot-plug
applications. Such implementations require the control of current surges seen by the main power supply and the card being inserted. The most
effective way to control these surges is to limit and slowly ramp the current and voltage being applied to the card, similar to the way in which a
power supply normally turns on. Due to the controlled rise times and fall times of the AP2146/AP2156, these devices can be used to provide a
softer start-up to devices being hot-plugged into a powered system. The UVLO feature of the AP2146/AP2156 also ensures that the switch is off
after the card has been removed, and that the switch is off during the next insertion.
By placing the AP2146/AP2156 between the V
typical rise time of the switch is approximately 1ms, providing a slow voltage ramp at the output of the device. This implementation controls system
surge current and provides a hot-plugging mechanism for any device.
AP2146/AP2156
Document number: DS31813 Rev. 3 - 2
input and the rest of the circuitry, the input power reaches these devices first after insertion. The
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