Diodes AP2156 User Manual

Page 1
AP2146/AP2156
0.5A DUAL CHANNEL CURRENT-LIMITED POWER SWITCH
IN
Pin Assignments
( Top View )
1
EN1
EN2
2
3
4
FLG1
FLG2
SO-8
8
7
6
5
OUT1
IN
GND
OUT2
( Top View )
EN1 FLG1 FLG2
EN2
1 2 3
4
MSOP-8EP
8
OUT1
7
IN
6
GND
5
OUT2
Applications
Consumer electronics – LCD TV & Monitor, Game Machines  Communications – Set-Top-Box, GPS, Smartphone  Computing – Laptop, Desktop, Servers, Printers, Docking Station,
HUB
OUT1
0.1uF
68uF
Load
Description
The AP2146 and AP2156 are integrated high-side power switches optimized for Universal Serial Bus (USB) and other hot-swap applications. The family of devices complies with USB 2.0 and available with both polarities of Enable input. They offer current and thermal limiting and short circuit protection as well as controlled rise time and under-voltage lockout functionality. A 7ms deglitch capability on the open-drain Flag output prevents false over-current reporting and does not require any external components.
All devices are available in SO-8 and MSOP-8EP packages.
Features
Dual USB port power switches  Over-current and thermal protection  0.8A accurate current limiting  Reverse Current Blocking  90m on-resistance Input voltage range: 2.7V - 5.5V  0.6ms typical rise time  Very low shutdown current: 1µA (max)  Fault report (FLG) with blanking time (7ms typ)  ESD protection: 6KV HBM, 300V MM  Active low (AP2146) or active high (AP2156) enable  Ambient temperature range -40ºC to +85°C  SO-8 and MSOP-8EP (Exposed Pad): Available in “Green”
Molding Compound (No Br, Sb)
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)Halogen and Antimony Free. “Green” Device (Note 3)
UL Recognized, File Number E322375  IEC60950-1 CB Scheme Certified
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.
Typical Applications Circuit
Power Supply
2.7V to 5.5V
10k
10k
10uF
0.1uF
AP2146/AP2156
Document number: DS31813 Rev. 3 - 2
OFF
ON
FLG1
OUT2
FLG2
EN1 EN2
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GND
1 of 17
0.1uF
68uF
Load
March 2013
© Diodes Incorporated
Page 2
Available Options
Part Number Channel
Enable Pin
(EN)
AP2146 2 Active Low 0.8A 0.5A AP2156 2 Active High 0.8A 0.5A
Current Limit
Pin Descriptions
Pin Name
Pin Number
SO-8 MSOP-8EP
Function
EN1 1 1 Switch 1 enable input, active low (AP2146) or active high (AP21 56) FLG1 2 2 Switch 1 over-current and over-temperature fault report, open-dra in FLG2 3 3 Switch 2 over-current and over-temperature fault report, open-dra in
EN2 4 4 Switch 2 enable input, active low (AP2146) or active high (AP21 56) OUT2
5 5 Switch 2 voltage output pin
GND 6 6 Ground
IN
OUT1
7 7 Voltage input pin 8 8 Switch 1 voltage output pin
Exposed Pad:
Exposed Pad - Exposed Pad
It should be connected externally to GND and thermal mass for enhanced ther mal impedance. It should not be used as electrical ground conduction path.
Functional Block Diagram
Thermal
Sense
(typ)
AP2146/AP2156
Recommended Maximum Continuous Load Current
FLG1
D e g lit c h
EN1
UVLO
IN
UVLO
EN2
Driver
Reverse blocking
Reverse blocking
Driver
Thermal
Sense
Current
Limit
CS
CS
Current
Limit
D e g lit c h
GND
GND
OUT1
OUT2
FLG2
AP2146/AP2156
Document number: DS31813 Rev. 3 - 2
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Page 3
AP2146/AP2156
Absolute Maximum Ratings (@T
= +25°C, unless otherwise specified.)
A
Symbol Parameter Rating Unit
ESD HBM Human Body Model ESD Protection 6 kV
ESD MM Machine Model ESD Protection 300 V
VIN
V
OUT
V
EN , VFLG
T
I
LOAD J(MAX)
TST
Note: 4. UL Recognized Rating from -30°C to +70°C (Diodes qualified TST from -65°C to +150°C)
Input Voltage 6.5 V Output Voltage
VIN +0.3
V Enable Voltage 6.5 V Maximum Continuous Load Current Internal Limited A Maximum Junction Temperature 150 °C Storage Temperature Range (Note 4) -65 to +150 °C
Recommended Operating Conditions (@T
= +25°C, unless otherwise specified.)
A
Symbol Parameter Min Max Units
V
I
OUT
V V
T
IN
IL
IH
A
Input voltage 2.7 5.5 V Output Current 0 500 mA
Low-Level Input Voltage on EN or EN High-Level Input Voltage on EN or EN
2 0 0.8 V
V
IN
Operating Ambient Temperature -40 +85
V
C
AP2146/AP2156
Document number: DS31813 Rev. 3 - 2
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Page 4
AP2146/AP2156
Electrical Characteristics (@T
Symbol Parameter Test Conditions Min Typ Max Unit
V
I
SHDN
I
LEAK
I
R
DS(ON)
I
SHORT
I
LIMIT
I
T
SHORT
V
I
SINK
T
D(ON)
T
D(OFF)
R
T
Blank
T
SHDN
T
Notes: 5. Test condition for SO-8: Device mounted on FR-4 2-layer board, 2oz copper, with minimum recommended pad layout.
6. Test condition for MSOP-8EP: Device mounted on FR-4 2-layer board, 2oz copper, with minimum recommended pad on top layer and 3 vias to bottom layer ground plane.
Input UVLO
UVLO
Input Shutdown Current Input Quiescent Current, Dual
I
Q
Input Leakage Current Disabled, OUT grounded 1 µA Reverse Leakage Current
REV
Switch on-resistance
Short-circuit current limit Over-Load Current Limit Current limiting trigger threshold
Trig
Short-circuit response time EN Input Logic Low Voltage
V
IL
EN Input Logic High Voltage
IH
EN Input leakage Output turn-on delay time Output turn-on rise time
TR
Output turn-off delay time Output turn-off fall time
TF
FLG output FET on-resistance
FLG
FLG blanking time Thermal shutdown threshold Thermal shutdown hysteresis 25
HYS
Thermal Resistance Junction-to-Ambient
JA
= +25°C, CIN = 10µF, VIN = +5V, unless otherwise specified.)
A
R
= 1k
LOAD
Disabled, I Enabled, I
Disabled, VIN = 0V, V
= 5V, I
V
IN
VIN = 3.3V, I
= 0
OUT
= 0
OUT
= 5V, I
OUT
= 0.5A, -40°C  TA  +85°C
OUT
= 0.5A, -40°C  TA  +85°C
OUT
REV
at VIN
MSOP-8EP 90 135 m SO-8 100 135 m
Enabled into short circuit, CL = 68µF VIN = 5V, V
= 4.8V, CL = 120µF, -40°C TA  +85°C
OUT
VIN = VEN, Output Current Slew rate (<100A/WS), CL = 22µF V
= 0V to I
OUT
V
= 2.7V to 5.5V
IN
V
= 2.7V to 5.5V
IN
= 5V
V
EN
CL=1µF, R CL=1µF, R CL=1µF, R CL=1µF, R I
=10mA
FLG
C
=10µF, CL = 68µF
IN
Enabled, R
LOAD LOAD LOAD LOAD
LOAD
OUT
= 10 = 10 = 10 = 10
= 1k
= I
(short applied to output), CL = 22µF
LIMIT
SO-8 (Note 5) 110 MSOP-8EP (Note 6) 60 oC/W
1.6 1.9 2.5 V
0.5 1 µA 95 140 µA
1 µA
120 160 m
0.7 A
0.6 0.8 1.0 A
1.0 A 20 µs
0.8 V
2 V
1 µA
0.05 ms
0.6 1.5 ms
0.01 ms
0.05 0.1 ms 20 40
4 7 15 ms
140
C C
o
C/W
AP2146/AP2156
Document number: DS31813 Rev. 3 - 2
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Page 5
Typical Performance Characteristics
AP2146/AP2156
Ven 1 5V/div
Vout 1 2V/div
V
EN
V
OUT
50%
T
D(ON)
T
10%
50%
R
90%
T
Figure 1 Voltage Waveforms: AP2146 (left), AP2156 (right)
Channel 1 Turn-On Delay and Rise Time
V
D(OFF)
90%
10%
EN
T
F
V
OUT
50%
T
D(ON)
All Enable Plots are for AP2146 Active Low
Channel 1 Turn-Off Delay and Fall Time
Ven 1 5V/div
Vout 1 2V/div
CL=1uF TA=25°C RL=10
T
10%
50%
T
R
90%
D(OFF)
90%
10%
T
F
CL=1uF TA=25°C RL=10
Channel 2 Turn-On Delay and Rise Time
Ven 2 5V/div
Vout 2 2V/div
AP2146/AP2156
Document number: DS31813 Rev. 3 - 2
500µs/div
500µs/div
Channel 2 Turn-Off Delay and Fall Time
Ven 2 5V/div
CL=1uF TA=25°C RL=10
March 2013
© Diodes Incorporated
500µs/div
Vout 2 2V/div
CL=1uF TA=25°C RL=10
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500µs/div
Page 6
Typical Performance Characteristics (cont.)
Channel 1 Turn-On Delay and Rise Time
AP2146/AP2156
Channel 1 Turn-Off Delay and Fall Time
Ven 1 5V/div
Vout 1 2V/div
Ven 2 5V/div
Vout 2 2V/div
500µs/div
Channel 2 Turn-On Delay and Rise Time
500µs/div
Channel 1 Short Circuit Current,
Device Enabled Into Short
CL=100uF TA=25°C RL=10
CL=100uF TA=25°C RL=10
Ven 1 5V/div
Vout 1 2V/div
Ven 2 5V/div
Vout 2 2V/div
500µs/div
Channel 2 Turn-Off Delay and Fall Time
500µs/div
Channel 2 Short Circuit Current,
Device Enabled Into Short
CL=100uF TA=25°C RL=10
CL=100uF TA=25°C R
=10
L
Ven 1 5V/div
Iout 1 200mA/div
AP2146/AP2156
Document number: DS31813 Rev. 3 - 2
500µs/div
VIN=5V TA=25°C CL=22uF
Ven 2 5V/div
Iout 2 200mA/div
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500µs/div
VIN=5V TA=25°C CL=22uF
March 2013
© Diodes Incorporated
Page 7
Typical Performance Characteristics (cont.)
Channel 1 Inrush Current
AP2146/AP2156
Channel 2 Inrush Current
Ven 1 5V/div
Iout 1 200mA/div
Vflag 1 2V/div
Iout 1 1A/div
CL=100uF
CL=470uF
C
=220uF
L
1ms/div
Channel 1
1 Ω Load Connected to Enabled Device
VIN=5V TA=25°C RL=10
VIN=5V TA=25°C CL=22uF
Ven 2 5V/div
=100uF
C
Iout 2 200mA/div
C
=220uF
L
L
CL=470uF
VIN=5V TA=25°C RL=10
1ms/div
Channel 1
2Ω Load Connected to Enabled Device
VIN=5V TA=25°C
Vflag 1 2V/div
Iout 1 1A/div
CL=22uF
1 Ω Load Connected to Enabled Device
Vflag 2 2V/div
Iout 2 1A/div
AP2146/AP2156
Document number: DS31813 Rev. 3 - 2
2ms/div
2ms/div
Channel 2
Channel 2
2Ω Load Connected to Enabled Device
2ms/div
VIN=5V TA=25°C CL=22uF
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Vflag 2 2V/div
Iout 2 1A/div
2ms/div
VIN=5V TA=25°C CL=22uF
March 2013
© Diodes Incorporated
Page 8
Typical Performance Characteristics (cont.)
Channel 1
Short Circuit with Blanking Time and Recovery
AP2146/AP2156
Channel 2
Short Circuit with Blanking Time and Recovery
Vout 5V/div
Vflag 5V/div
Iout 1A/div
Vflag 5V/div
Iout 200mA/div
Ven 5V/div
Vin 5V/div
20ms/div
Channel 1 Power On
VIN=5V TA=25°C CL=22uF
TA=25°C CL=22uF RL=10
Vout 5V/div
Vflag 5V/div
Iout 1A/div
Vflag 5V/div
Iout 200mA/div
Ven 5V/div
Vin 5V/div
VIN=5V TA=25°C CL=22uF
20ms/div
Channel 2 Power On
TA=25°C CL=22uF RL=10
Channel 1 UVLO Increasing
Vin 2V/div
Iout 200mA/div
AP2146/AP2156
Document number: DS31813 Rev. 3 - 2
1ms/div
1ms/div
TA=25°C CL=22uF RL=10
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Vin 2V/div
Iout 200mA/div
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1ms/div
Channel 1 UVLO Decreasing
10ms/div
TA=25°C CL=22uF
=
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© Diodes Incorporated
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Typical Performance Characteristics (cont.)
Vin 2V/div
Channel 2 UVLO Increasing
TA=25°C CL=22uF RL=10
Vin 2V/div
AP2146/AP2156
Channel 2 UVLO Decreasing
TA=25°C CL=22uF RL=10
Iout 200mA/div
1ms/div
Iout 200mA/div
10ms/div
Channel 1 Enabled and Shorted with Channel 2 Disabled
Channel 1 Disabled and Channel 2 Enabled
Vout 1 5V/div
Vout 2 5V/div
Vflag 1 5V/div
Iout 2 500mA/div
TA=25°C CL=22uF
Ven1 5V/div
Vout 1 5V/div
Ven2 5V/div
Vout 2 5V/div
TA=25°C CL=22uF
100ms/div
50ms/div
AP2146/AP2156
Document number: DS31813 Rev. 3 - 2
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Typical Performance Characteristics (cont.)
Turn-On Time vs Input Voltage
800
700
600
500
400
300
Turn-On Time (us)
200
100
0
1.522.533.544.555.56
Input V o ltage (V)
CL=1uF RL=10
=25°C
T
AP2146/AP2156
Turn-O f f Ti m e vs I nput Voltage
31
31
30
30
29
29
Turn-Off Time (us)
28
28
1.5 2 2.5 3 3.5 4 4.5 5 5.5 6
Input Vo l tage (V)
CL=1uF RL=10
=25°C
T
Rise Time vs I nput Vol t age
600
500
400
300
200
Rise Time (us)
100
0
1.522.533.544.555.56
Input V o ltage (V)
CL=1uF RL=10
=
°
Supply Current, Output Enabled vs Ambient Temperature
65
60
55
Vin=5.5V
50
45
40
35
Supply Current, Output Enabled (uA)
30
-60 -40 -20 0 20 40 60 80 100
Vin=5.0V
Vin=3.3V
Ambient Temperature (°C)
Vin=2.7V
Fall Time vs Input Volt age
25
24
23
22
Fall Time (us )
21
20
19
1.5 2 2.5 3 3.5 4 4.5 5 5.5 6
Input Vo l tage (V)
CL=1uF RL=10
=
°
Supply Current, Output Disabl ed vs A m bient Temper at ure
1.60
1.40
1.20
1.00
0.80
0.60
0.40
0.20
Supply Current, Output Disabled (uA)
0.00
Vin=3.3V
Vin=2.7V
-45 -25 -5 15 35 55 75 95
Vin=5.0V
Ambient Tem peratu re (°C)
Vin=5.5V
AP2146/AP2156
Document number: DS31813 Rev. 3 - 2
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Typical Performance Characteristics (cont.)
Static Drai n-Source O n-St at e Resist ance vs A m bient
200 190 180
Vin=2.7V
170 160 150 140 130
Resistance (mΩ)
120
Static Drain-Source On-State
110 100
-60 -40 -20 0 20 40 60 80 100
Temperature
Vin=3.3V
Vin=5V
Ambient Temperature (°C)
AP2146/AP2156
Short-Cir cui t O ut put Curr ent vs A m bi ent Tem per at ure
710
700
690
680
670
660
650
640
Short-Circuit Output Current (mA)
630
Vin=2.7V Vin=3.3V Vin=5.0V
Vin=5.5V
-60 -40 -20 0 20 40 60 80 100
Ambient Temperature (°C)
Undervoltage Lockout vs Ambient Temperature
2.05
2.04
2.03
2.02
2.01
2.00
1.99
1.98
1.97
Undervoltage Lockout (V)
1.96
1.95
-60 -40 -20 0 20 40 60 80 100
UVLO Rising
UVLO Falling
Amb ient Temperature (°C)
Current Limit Response vs Peak Current
45 40 35 30 25 20 15 10
Current Limit Response (us)
5 0
2345678910
Peak Current (A)
VIN=5V TA=25°C C
=22uF
Threshold Tri p Curr ent v s I nput Vol t age
1.15
1.14
1.13
1.12
1.11
Threshold Trip Current (A)
1.10
2.8 3.3 3.8 4.3 4.8 5.3
Input Voltage (V)
TA=25°C CL=22uF
AP2146/AP2156
Document number: DS31813 Rev. 3 - 2
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AP2146/AP2156
Application Information
Power Supply Considerations
A 0.01-F to 0.1-F X7R or X5R ceramic bypass capacitor between IN and GND, close to the device, is recommended. Placing a high-value electrolytic capacitor on the input (10-F minimum) and output pin(s) is recommended when the output load is heavy. This precaution reduces power-supply transients that may cause ringing on the input. Additionally, bypassing the output with a 0.01-F to 0.1-F ceramic capacitor improves the immunity of the device to short-circuit transients.
Over-Current and Short Circuit Protection
An internal sensing FET is employed to check for over-current conditions. Unlike current-sense resistors, sense FETs do not increase the series resistance of the current path. When an overcurrent condition is detected, the device maintains a constant output current and reduces the output voltage accordingly. Complete shutdown occurs only if the fault stays long enough to activate thermal limiting.
Three possible overload conditions can occur. In the first condition, the output has been shorted to GND before the device is enabled or before V has been applied. The AP2146/AP2156 senses the short circuit and immediately clamps output current to a certain safe level namely I
LIMIT
IN
.
In the second condition, an output short or an overload occurs while the device is enabled. At the instance the overload occurs, highe r curr ent m ay flow for a very short period of time before the current limit function can react. After the current limit function has tripped (reached the over-current trip threshold), the device switches into current limiting mode and the current is clamped at I
In the third condition, the load has been gradually increased beyond the recommended operating current. The current is permitted to rise until the current-limit threshold (I
) is reached or until the thermal limit of the device is exceeded. The AP2146/AP2156 is capable of delivering current up
TRIG
to the current-limit threshold without damaging the device. Once the threshold has been reached, the device switches into its current limiting mode and is set at I
LIMIT
.
Note that when the output has been shorted to GND at extremely low temperature (< -30 pin is recommended. A correct capacitor type with capacitor voltage rating and temperature characteristics must be properly chosen so that capacitance value does not drop too low at the extremely low temperature operation. A recommended capacitor should have temperature characteristics of less than 10% variation of capacitance change when operated at extremely low temp. Our recommended aluminum electrolytic capacitor type is Panasonic FC series.
FLG Response
When an over-current or over-temperature shutdown condition is encountered, the FLG open-drain output goes a ctive low after a nominal 7-ms deglitch timeout. The FLG output remains low until both over-current and over-temperature conditions are removed. Connecting a heavy capacitive load to the output of the device can cause a momentary over-current condition, which does not trigger the FLG due to the 7-ms deglitch timeout. The AP2146/AP2156 is designed to eliminate false over-current reporting without the need of external components to remove unwanted pulses.
Power Dissipation and Junction Temperature
The low on-resistance of the internal MOSFET allows the small surface-mount packages to pass large current. Using the maximum operating ambient temperature (T
= R
P
D
DS(ON)
× I2
) and R
A
, the power dissipation can be calculated by:
DS(ON)
Finally, calculate the junction temperature:
= PD x R
T
J
JA
+ TA
Where:
= Ambient temperature C
T
A
R
= Thermal resistance
JA
= Total power dissipation
P
D
Thermal Protection
Thermal protection prevents the IC from damage when heavy-overload or short-circuit faults are present for extended periods of time. The AP2146/AP2156 implements a thermal sensing to monitor the operating junction temperature of the power distribution switch. Once the die temperature rises to approximately 140°C due to excessive power dissipation in an over-current or short-circuit condition the internal thermal sense circuitry turns the power switch off, thus preventing the power switch from damage. Hysteresis is built into the thermal sense circuit allowing the device to cool down approximately 25°C before the switch turns back on. The switch continues to cycle in this manner until the load fault or input power is removed. The FLG open-drain output is asserted when an over-temperature shutdown or over-current occurs with 7-ms deglitch.
AP2146/AP2156
Document number: DS31813 Rev. 3 - 2
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.
LIMIT
o
C), a minimum 120-F electrolytic capacitor on the output
March 2013
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Page 13
AP2146/AP2156
Application Information (cont.)
Under-Voltage Lockout (UVLO)
Under-voltage lockout function (UVLO) keeps the internal power switch from being turned on until the power supply has reached at least 1.9V, even if the switch is enabled. Whenever the input voltage falls below approximately 1.9V, the power switch is quickly turned off. This facilitates the design of hot-insertion systems where it is not possible to turn off the power switch before input power is removed.
Host/Self-Powered HUBs
Hosts and self-powered hubs (SPH) have a local power supply that powers the embedded functions and the downstream ports (see F igure 2). This power supply must provide from 5.25V to 4.75V to the board side of the downstream connection unde r both full-load and no-load conditions. Hosts and SPHs are required to have current-limit protection and must report over-current conditions to the USB controller. Typical SPHs are desktop PCs, monitors, printers, and stand-alone hubs.
68uF
68uF
Downstream
USB Ports
D+ D­V
BUS
GND
D+ D­V
BUS
GND
Power Supply
3.3V
USB
Controller
5V
0.1uF
7
2 1 3 4
IN
FLG1
EN1
FLG2
EN2
AP2146
GND
6
OUT1
OUT2
8
0.1uF
5
0.1uF
Figure 2 Typical Two-Port USB Host / Self-Powered Hub
Generic Hot-Plug Applications
In many applications it may be necessary to remove modules or pc boards while the main unit is still operating. These are considered hot-plug applications. Such implementations require the control of current surges seen by the main power supply and the card being inserted. The most effective way to control these surges is to limit and slowly ramp the current and voltage being applied to the card, similar to the way in which a power supply normally turns on. Due to the controlled rise times and fall times of the AP2146/AP2156, these devices can be used to provide a softer start-up to devices being hot-plugged into a powered system. The UVLO feature of the AP2146/AP2156 also ensures that the switch is off after the card has been removed, and that the switch is off during the next insertion.
By placing the AP2146/AP2156 between the V typical rise time of the switch is approximately 1ms, providing a slow voltage ramp at the output of the device. This implementation controls system surge current and provides a hot-plugging mechanism for any device.
AP2146/AP2156
Document number: DS31813 Rev. 3 - 2
input and the rest of the circuitry, the input power reaches these devices first after insertion. The
CC
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Page 14
Ordering Information
AP2146/AP2156
Part Number Package Code Packaging
AP21X6SG-13 S SO-8 2500/Tape & Reel -13
AP21X6MPG-13 MP MSOP-8EP 2500/Tape & Reel -13
Quantity Part Number Suffix
13” Tape and Reel
Marking Information
(1) SO-8
( Top view )
8765
(2) MSOP-8EP
Logo
Part Number
4 : Active Low 5 : Active High
AP21X X
YY WW X X
2
1
34
6 : 2 Channel
G : Green
: Year : 08, 09,10~
YY
: Week : 01~52; 52
WW
represents 52 and 53 week
: Internal Code
X
AP2146/AP2156
Document number: DS31813 Rev. 3 - 2
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Page 15
Package Outline Dimensions (All dimensions in mm.)
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
(1) Package type: SO-8
e
b
D
E1
A2
E
A1
Detail ‘A’
h
°
45
A3
A
L
0.254
Gaug e Plane Seating Plane
7°~9
°
Detail ‘A’
(2) Package type: MSOP-8EP
D
4
°
Detail C
X
1
0
°
a
L
x
y
E
E2
1
e
A1
A
D
8Xb
A3
A2
D1
E3
E1
Gauge Plane Seating Plane
c
See Detail C
0.25
4
X
1
0
AP2146/AP2156
Dim Min Max
Dim Min Max Typ
A1 0.05 0.15 0.10 A2 0.75 0.95 0.86 A3 0.29 0.49 0.39
D1 1.60 2.00 1.80 E1 2.90 3.10 3.00
E2 1.30 1.70 1.50 E3 2.85 3.05 2.95
All Dimensions in mm
SO-8
A - 1.75 A1 0.10 0.20 A2 1.30 1.50 A3 0.15 0.25
b 0.3 0.5 D 4.85 4.95 E 5.90 6.10
E1 3.85 3.95
e 1.27 Typ
h - 0.35
L 0.62 0.82
0 8

All Dimensions in mm
MSOP-8EP
A - 1.10 -
b 0.22 0.38 0.30 c 0.08 0.23 0.15 D 2.90 3.10 3.00
E 4.70 5.10 4.90
e - - 0.65 L 0.40 0.80 0.60 a 0° 8° 4° x - - 0.750 y - - 0.750
AP2146/AP2156
Document number: DS31813 Rev. 3 - 2
15 of 17
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March 2013
© Diodes Incorporated
Page 16
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
(1) Package type: SO-8
X
C1
C2
Dimensions Value (in mm)
X 0.60
Y 1.55 C1 5.4 C2 1.27
Y
(2) Package type: MSOP-8EP
X C
G
Y2
AP2146/AP2156
Document number: DS31813 Rev. 3 - 2
X1
Y
Y1
Dimensions
C 0.650 G 0.450 X 0.450
X1 2.000
Y 1.350 Y1 1.700 Y2 5.300
16 of 17
www.diodes.com
Value
(in mm)
AP2146/AP2156
March 2013
© Diodes Incorporated
Page 17
AP2146/AP2156
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A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2013, Diodes Incorporated
www.diodes.com
IMPORTANT NOTICE
LIFE SUPPORT
AP2146/AP2156
Document number: DS31813 Rev. 3 - 2
17 of 17
www.diodes.com
March 2013
© Diodes Incorporated
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