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0.5A DUAL CHANNEL CURRENT-LIMITED POWER SWITCH
Description
The AP2142 and AP2152 are integrated high-side power switches
optimized for Universal Serial Bus (USB) and other hot-swap
applications. The family of devices complies with USB 2.0 and
available with both polarities of Enable input. They offer current and
thermal limiting and short circuit protection as well as controlled rise
time and under-voltage lockout functionality. A 7ms deglitch capability
on the open-drain Flag output prevents false over-current reporting
and does not require any external components.
All devices are available in SO-8 and MSOP-8EP packages.
Features
Pin Assignments
GND
IN
EN
IN
( Top View )
1
2
3
4
( Top View )
SO-8
AP2142/ AP2152
8
NC
7
OUT
6
OUT
5
FLG
• Dual USB port power switches
• Over-current and thermal protection
• 0.8A accurate current limiting
• Reverse Current Blocking
• 115m on-resistance
• Input voltage range: 2.7V – 5.5V
• 0.6ms typical rise time
• Very low shutdown current: 1uA (max)
• Fault report (FLG) with blanking time (7ms typ)
• ESD protection: 4.5KV HBM, 350V MM
• Active high (AP2152) or active low (AP2142) enable
• Ambient temperature range -40ºC to 85°C
• SO-8 and MSOP-8EP (Exposed Pad): Available in “Green”
Molding Compound (No Br, Sb)
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
• UL Recognized, File Number E322375
• IEC60950-1 CB Scheme Certified
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
Applications
• Consumer electronics – LCD TV & Monitor, Game Machines
• Communications – Set-Top-Box, GPS, Smartphone
• Computing – Laptop, Desktop, Servers, Printers, Docking Station,
GND
HUB
IN
EN
1
2
IN
3
4
MSOP-8EP
NC
8
7
OUT
6
OUT
5
FLG
Typical Applications Circuit
AP2152 Enable Active High
Power Supply
2.7V to 5.5V
10k
10k
AP2142/ AP2152
Document number: DS31571 Rev. 6 - 2
OFF
10uF
ON
IN
0.1uF
FLG1
FLG2
EN1
EN2
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GND
OUT1
OUT2
0.1uF
0.1uF
68uF
68uF
Load
Load
© Diodes Incorporated
January 2013
Page 2
AP2142/ AP2152
Available Options
Part Number Channel
Enable Pin
(EN)
AP2142 2 Active Low 0.8A 0.5A
AP2152 2 Active High 0.8A 0.5A
Current Limit
(typ)
Recommended Maximum
Continuous Load Current
Pin Descriptions
Pin
Name
Pin Number
SO-8 MSOP-8EP
Function
GND 1 1 Ground
IN
2 2 Voltage input pin
EN1 3 3 Switch 1 enable input, active low (AP2142) or active high (AP2152)
EN2 4 4 Switch 2 enable input, active low (AP2142) or active high (AP2152)
FLG2 5 5 Switch 2 over-current and over-temperature fault report; open-drain flag is active low when triggered
OUT2
OUT1
6 6 Switch 2 voltage output pin
7 7 Switch 1 voltage output pin
FLG1 8 8 Switch 1 over-current and over-temperature fault report; open-drain flag is active low when triggered
Exposed Tab — Exposed Tab
Exposed pad. It should be connected to GND and thermal mass for enhanced thermal impedance.
It should not be used as electrical ground conduction path.
Functional Block Diagram
AP2142, AP2152
Thermal
Sense
FLG1
EN1
IN
EN2
AP2142/ AP2152
Document number: DS31571 Rev. 6 - 2
UVLO
UVLO
Driver
Driver
Thermal
Sense
Current
Limit
Current
Sense
Current
Sense
Current
Limit
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Deglitch
Deglitch
GND
GND
OUT1
OUT2
FLG2
January 2013
© Diodes Incorporated
Page 3
AP2142/ AP2152
Absolute Maximum Ratings (@T
= +25°C, unless otherwise specified.)
A
Symbol Parameter Rating Unit
ESD HBM Human Body Model ESD Protection 3 kV
ESD MM Machine Model ESD Protection 300 V
VIN
V
OUT
V
EN , VFLG
T
I
LOAD
J(MAX)
TST
Caution: Stresses greater than the 'Absolute Maximum Ratings' specified above, may cause permanent damage to the device. These are stress ratings only;
Note: 4. UL Recognized Rating from -30°C to +70°C (Diodes qualified
functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability may be
affected by exposure to absolute maximum rating conditions for extended periods of time.
Semiconductor devices are ESD sensitive and may be damaged by exposure to ESD events. Suitable ESD precautions should be taken when handling
and transporting these devices
Input Voltage 6.5 V
Output Voltage
VIN + 0.3
V
Enable Voltage 6.5 V
Maximum Continuous Load Current Internal Limited A
Maximum Junction Temperature 150 °C
Storage Temperature Range (Note 4) -65 to 150 °C
T
from -65°C to +150°C)
ST
Recommended Operating Conditions (@T
Symbol Parameter Min Max Units
V
IN
I
OUT
V
IL
V
IH
T
A
AP2142/ AP2152
Document number: DS31571 Rev. 6 - 2
Input voltage 2.7 5.5 V
Output Current 0 500 mA
EN Input Logic Low Voltage 0 0.8 V
EN Input Logic High Voltage 2
Operating Ambient Temperature -40 85
= +25°C, unless otherwise specified.)
A
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V
IN
V
°C
January 2013
© Diodes Incorporated
Page 4
AP2142/ AP2152
Electrical Characteristics (@T
= +25°C, VIN = +5V, unless otherwise specified.)
A
Symbol Parameter Test Conditions Min Typ Max Unit
V
UVLO
I
SHDN
I
LEAK
I
REV
R
DS(ON)
I
SHORT
I
LIMIT
I
V
V
I
SINK
T
D(ON)
T
D(OFF)
R
T
Blank
T
SHDN
T
θJA
Notes: 5. Test condition for SO-8: Device mounted on FR-4 2-layer board, 2oz copper, with minimum recommended pad layout.
6. Test condition for MSOP-8EP: Device mounted on FR-4 2-layer board, 2oz copper, with minimum recommended pad on top layer and 3 vias to bottom
layer ground plane.
Input UVLO
Input Shutdown Current
Input Quiescent Current, Dual
I
Q
R
= 1k
LOAD
Disabled, I
Enabled, I
OUT
OUT
= 0
= 0
Input Leakage Current Disabled, OUT grounded 1 µA
Reverse Leakage Current
Switch on-resistance
Short-circuit current limit
Over-Load Current Limit
Current limiting trigger threshold
Trig
EN Input Logic Low Voltage
IL
EN Input Logic High Voltage
IH
EN Input leakage
Output turn-on delay time
Output turn-on rise time
TR
Output turn-off delay time
Output turn-off fall time
TF
FLG output FET on-resistance
FLG
FLG blanking time
Thermal shutdown threshold
Thermal shutdown hysteresis 25
HYS
Thermal Resistance Junction-to-Ambient
Disabled, VIN = 0V, V
= 5V, I
V
IN
VIN = 3.3V, I
= 0.5A, -40°C TA +85°C
OUT
= 0.5A, -40°C TA 85°C
OUT
OUT
= 5V, I
REV
at VIN
MSOP-8EP 115 150 m
SO-8 120 160 m
Enabled into short circuit, CL = 68µF
VIN = 5V, V
= 4.8V, CL = 68µF, -40°C TA +85°C
OUT
VIN = VEN, Output Current Slew rate (<100A/WS), CL = 68µF
V
= 2.7V to 5.5V
IN
V
= 2.7V to 5.5V
IN
V
= 5V
EN
CL=1µF, R
CL=1µF, R
CL=1µF, R
CL=1µF, R
I
=10mA
FLG
C
=10µF, CL = 68µF
IN
Enabled, R
LOAD
LOAD
LOAD
LOAD
LOAD
= 10
= 10
= 10
= 10
= 1k
SO-8 (Note 5) 110
MSOP-8EP (Note 6) 60 oC/W
1.6 1.9 2.5 V
0.5 1 µA
100 160 µA
1 µA
140 180 m
0.6 A
0.6 0.8 1.0 A
1.0 A
0.8 V
2 V
1 µA
0.05 ms
0.6 1.5 ms
0.01 ms
0.05 0.1 ms
30 50
4 7 15 ms
140
AP2142/ AP2152
Document number: DS31571 Rev. 6 - 2
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© Diodes Incorporated
°C
°C
o
C/W
Page 5
Typical Performance Characteristics
AP2142/ AP2152
V
EN
V
OUT
50%
T
D(ON)
T
10%
50%
T
R
90%
D(OFF)
90%
10%
T
F
V
EN
50%
T
T
D(ON)
V
OUT
10%
50%
T
R
90%
D(OFF)
90%
10%
T
F
Figure 1. Voltage Waveforms: AP2142 (left), AP2152 (right)
All Enable Plots are for AP2142 Active Low
Channel 1 Turn-Off Delay and Fall Time
CL = 1µF
TA = +25°C
RL = 10
Ven 1
5V/div
Vout 1
2V/div
Channel 1 Turn-On Delay and Rise Time
CL = 1µF
TA = +25°C
RL = 10
Ven 1
5V/div
Vout 1
2V/div
Channel 2 Turn-On Delay and Rise Time
Ven 2
5V/div
Vout 2
2V/div
AP2142/ AP2152
Document number: DS31571 Rev. 6 - 2
500µs/div
500µs/div
Ven 2
5V/div
Vout 2
2V/div
CL=1µF
TA = +25°C
RL = 10
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500µs/div
Channel 2 Turn-Off Delay and Fall Time
500µs/div
CL = 1µF
TA = +25°C
RL = 10
January 2013
© Diodes Incorporated
Page 6
Typical Performance Characteristics (cont.)
Channel 1 Turn-On Delay and Rise Time
AP2142/ AP2152
Channel 1 Turn-Off Delay and Fall Time
Ven 1
5V/div
Vout 1
2V/div
CL = 100µF
TA = +25°C
RL = 10
500µs/div
Ven 1
5V/div
Vout 1
2V/div
CL = 100µF
TA = +25°C
RL = 10
500µs/div
Channel 2 Turn-Off Delay and Fall Time
500µs/div
Channel 2 Short Circuit Current,
Device Enabled Into Short
CL = 100µF
TA = +25°C
R
= 10
L
Ven 2
5V/div
Vout 2
2V/div
Channel 2 Turn-On Delay and Rise Time
500µs/div
Channel 1 Short Circuit Current,
Device Enabled Into Short
CL = 100µF
TA = +25°C
RL = 10
Ven 2
5V/div
Vout 2
2V/div
Ven 1
5V/div
Iout 1
200mA/div
AP2142/ AP2152
Document number: DS31571 Rev. 6 - 2
500µs/div
V
= 5V
IN
TA = +25°C
CL = 22µF
Ven 2
5V/div
Iout 2
200mA/div
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500µs/div
V
= 5V
IN
TA = +25°C
CL = 22µF
January 2013
© Diodes Incorporated
Page 7
Typical Performance Characteristics (cont.)
Channel 1 Inrush Current
AP2142/ AP2152
Channel 2 Inrush Current
Ven 1
5V/div
Iout 1
200mA/div
Vflag 1
2V/div
Iout 1
1A/div
CL = 100µF
CL = 470µF
CL = 220µF
1ms/div
Channel 1
1 Ω Load Connected to Enabled Device
V
= 5V
IN
TA = +25°C
= 10
R
L
V
= 5V
IN
TA = +25°C
CL = 22µF
Ven 2
5V/div
Iout 2
200mA/div
CL = 100µF
CL = 470µF
CL = 220µF
V
= 5V
IN
TA = +25°C
= 10
R
L
1ms/div
Channel 1
2Ω Load Connected to Enabled Device
V
= 5V
IN
TA = +25°C
Vflag 1
2V/div
Iout 1
1A/div
CL = 22µF
1 Ω Load Connected to Enabled Device
Vflag 2
2V/div
Iout 2
1A/div
AP2142/ AP2152
Document number: DS31571 Rev. 6 - 2
2ms/div
2ms/div
Channel 2
Channel 2
2Ω Load Connected to Enabled Device
V
2ms/div
= 5V
IN
TA = +25°C
CL = 22µF
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Vflag 2
2V/div
Iout 2
1A/div
2ms/div
V
= 5V
IN
TA = +25°C
CL = 22µF
January 2013
© Diodes Incorporated
Page 8
Typical Performance Characteristics (cont.)
Short Circuit with Blanking Time and Recovery
Vout
5V/div
Vflag
5V/div
Channel 1
V
= 5V
IN
TA = +25°C
CL = 22µF
Short Circuit with Blanking Time and Recovery
Channel 2
Vout
5V/div
Vflag
5V/div
AP2142/ AP2152
V
= 5V
IN
TA = +25°C
CL = 22µF
Iout
1A/div
Vflag
5V/div
Iout
200mA/div
Ven
5V/div
Vin
5V/div
Vin
2V/div
20ms/div
Channel 1 Power On
1ms/div
Channel 1 UVLO Increasing
TA = +25°C
CL = 22µF
RL = 10
TA = +25°C
CL = 22µF
RL = 10
Iout
1A/div
Vflag
5V/div
Iout
200mA/div
Ven
5V/div
Vin
5V/div
Vin
2V/div
20ms/div
Channel 2 Power On
TA=25°C
CL=22uF
RL=10
1ms/div
Channel 1 UVLO Decreasing
TA = +25°C
CL = 22µF
=
Iout
200mA/div
AP2142/ AP2152
Document number: DS31571 Rev. 6 - 2
1ms/div
Iout
200mA/div
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10ms/div
January 2013
© Diodes Incorporated
Page 9
Typical Performance Characteristics (cont.)
Vin
2V/div
Channel 2 UVLO Increasing
TA = +25°C
CL = 22µF
RL = 10
Vin
2V/div
AP2142/ AP2152
Channel 2 UVLO Decreasing
TA = +25°C
CL = 22µF
RL = 10
Iout
200mA/div
Channel 1 Enabled and Shorted with Channel 2 Disabled
Vout 1
5V/div
Vout 2
5V/div
Vflag 1
5V/div
Iout 2
500mA/div
AP2142/ AP2152
Document number: DS31571 Rev. 6 - 2
1ms/div
100ms/div
TA = +25°C
CL = 22µF
Iout
200mA/div
Ven1
5V/div
Vout 1
5V/div
Ven2
5V/div
Vout 2
5V/div
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10ms/div
Channel 1 Disabled and Channel 2 Enabled
TA = +25°C
CL = 22µF
50ms/div
© Diodes Incorporated
January 2013
Page 10
Typical Performance Characteristics (cont.)
Turn-On Time vs In put V oltage
800
700
600
500
400
300
Turn-On Time (us)
200
100
0
1.522.533.5 44.555.56
Input Voltage (V)
CL = 1µF
RL = 10
= +25°C
T
AP2142/ AP2152
Turn-Off Time vs Input Voltage
31
31
30
30
29
29
Turn-Off Time (us)
28
28
1.5 2 2. 5 3 3.5 4 4. 5 5 5.5 6
Input Voltage (V)
CL = 1µF
RL = 10
=+25°C
T
Rise Time vs Input Voltage
600
500
400
300
200
Rise Time (us)
100
0
1.522.533.5 44.555.56
Input Voltage (V)
CL = 1µF
RL = 10
=+
°
Supply Current, Output Enabled vs Ambient Temperature
65
60
55
50
45
40
35
Supply Current, O utput Enabled (uA)
30
Vin=5.5V
-60 - 40 -20 0 20 40 60 80 10 0
Vin=5.0V
Vin=2.7V
Vin=3.3V
Ambient Te mperature (°C)
Fall Time vs Input Voltage
25
24
23
22
Fall Time (us)
21
20
19
1.5 2 2. 5 3 3.5 4 4. 5 5 5.5 6
Input Voltage (V)
CL = 1µF
RL = 10
=+
°
Supply Current, Output D isabled vs Ambient Temperature
1.60
1.40
1.20
1.00
0.80
Vin=3.3V
0.60
Vin=2.7V
0.40
0.20
Supply Current, Output Disabled (uA)
0.00
-45 -25 -5 15 35 55 75 95
Vin=5.0V
Ambient Temperature (°C)
Vin=5.5V
AP2142/ AP2152
Document number: DS31571 Rev. 6 - 2
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Typical Performance Characteristics (cont.)
Static Drain-Source On-State Resistance vs Ambient
200
190
180
170
160
150
140
130
Resistance (mΩ)
120
Static Drain-Source On-State
110
100
Vin=2.7V
-60 -40 -20 0 20 40 60 80 100
Temperature
Vin=3.3V
Vin=5V
Ambient Temperature (°C)
AP2142/ AP2152
Short-Circuit Output Current vs Ambient Temperature
710
700
Vin=2.7V Vin=3.3V
690
680
670
660
650
640
Short-Circuit Output C urrent (mA)
630
-60 -40 -20 0 20 40 60 80 100
Ambient Temperature (°C)
Vin=5.0V
Vin=5.5V
Undervoltage Lockout vs Ambient Temperature
2.05
2.04
2.03
2.02
2.01
2.00
1.99
1.98
1.97
Undervoltage Lockout (V)
1.96
1.95
-60 -40 -20 0 20 40 60 80 100
Current Limit Response vs Peak C urrent
45
40
35
30
25
20
15
10
Curr ent Limit Response (us)
5
0
2345678910
UVLO Rising
UVLO Falling
Ambient Temperature (°C)
Peak Current (A)
V
= 5V
IN
TA = +25°C
C
= 22µF
Threshold Trip Current vs Input Voltage
1.15
1.14
1.13
1.12
1.11
Threshold Trip Current (A)
1.10
2.8 3.3 3.8 4.3 4.8 5.3
Input Voltage (V)
TA = +25°C
CL = 22µF
AP2142/ AP2152
Document number: DS31571 Rev. 6 - 2
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AP2142/ AP2152
Application Information
Power Supply Considerations
A 0.01-F to 0.1-F X7R or X5R ceramic bypass capacitor between IN and GND, close to the device, is recommended. Placing a high-value
electrolytic capacitor on the input and output pin(s) is recommended when the output load is heavy. This precaution reduces power-supply
transients that may cause ringing on the input. Additionally, bypassing the output with a 0.01-F to 0.1-F ceramic capacitor improves the immunity
of the device to short-circuit transients.
Over-Current and Short Circuit Protection
An internal sensing FET is employed to check for over-current conditions. Unlike current-sense resistors, sense FETs do not increase the series
resistance of the current path. When an overcurrent condition is detected, the device maintains a constant output current and reduces the output
voltage accordingly. Complete shutdown occurs only if the fault stays long enough to activate thermal limiting.
Three possible overload conditions can occur. In the first condition, the output has been shorted to GND before the device is enabled or before V
has been applied. The AP2142/AP2152 senses the short circuit and immediately clamps output current to a certain safe level namely I
LIMIT
IN
.
In the second condition, an output short or an overload occurs while the device is enabled. At the instance the overload occurs, higher current may
flow for a very short period of time before the current limit function can react. After the current limit function has tripped (reached the over-current
trip threshold), the device switches into current limiting mode and the current is clamped at I
LIMIT
.
In the third condition, the load has been gradually increased beyond the recommended operating current. The current is permitted to rise until the
current-limit threshold (I
) is reached or until the thermal limit of the device is exceeded. The AP2142/AP2152 is capable of delivering current up
TRIG
to the current-limit threshold without damaging the device. Once the threshold has been reached, the device switches into its current limiting mode
and is set at I
LIMIT
.
FLG Response
When an over-current or over-temperature shutdown condition is encountered, the FLG open-drain output goes active low after a nominal 7-ms
deglitch timeout. The FLG output remains low until both over-current and over-temperature conditions are removed. Connecting a heavy capacitive
load to the output of the device can cause a momentary over-current condition, which does not trigger the FLG due to the 7-ms deglitch timeout.
The AP2142/AP2152 is designed to eliminate false over-current reporting without the need of external components to remove unwanted pulses.
Power Dissipation and Junction Temperature
The low on-resistance of the internal MOSFET allows the small surface-mount packages to pass large current. Using the maximum operating
ambient temperature (T
= R
P
D
DS(ON)
× I2
) and R
A
, the power dissipation can be calculated by:
DS(ON)
Finally, calculate the junction temperature:
T
= PD x R
J
JA
θ
+ TA
Where:
= Ambient temperature °C
T
A
R
= Thermal resistance
JA
= Total power dissipation
P
D
Thermal Protection
Thermal protection prevents the IC from damage when heavy-overload or short-circuit faults are present for extended periods of time. The
AP2142/AP2152 implements a thermal sensing to monitor the operating junction temperature of the power distribution switch. Once the die
temperature rises to approximately 140°C due to excessive power dissipation in an over-current or short-circuit condition the internal thermal sense
circuitry turns the power switch off, thus preventing the power switch from damage. Hysteresis is built into the thermal sense circuit allowing the
device to cool down approximately 25°C before the switch turns back on. The switch continues to cycle in this manner until the load fault or input
power is removed. The FLG open-drain output is asserted when an over-temperature shutdown or over-current occurs with 7-ms deglitch.
AP2142/ AP2152
Document number: DS31571 Rev. 6 - 2
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Page 13
AP2142/ AP2152
Application Information (cont.)
Under-Voltage Lockout (UVLO)
Under-voltage lockout function (UVLO) keeps the internal power switch from being turned on until the power supply has reached at least 1.9V, even
if the switch is enabled. Whenever the input voltage falls below approximately 1.9V, the power switch is quickly turned off. This facilitates the design
of hot-insertion systems where it is not possible to turn off the power switch before input power is removed.
Host/Self-Powered HUBs
Hosts and self-powered hubs (SPH) have a local power supply that powers the embedded functions and the downstream ports (see Figure 2). This
power supply must provide from 5.25V to 4.75V to the board side of the downstream connection under both full-load and no-load conditions. Hosts
and SPHs are required to have current-limit protection and must report over-current conditions to the USB controller. Typical SPHs are desktop
PCs, monitors, printers, and stand-alone hubs.
Figure 2. Typical Two-Port USB Host / Self-Powered Hub
Generic Hot-Plug Applications
In many applications it may be necessary to remove modules or pc boards while the main unit is still operating. These are considered hot-plug
applications. Such implementations require the control of current surges seen by the main power supply and the card being inserted. The most
effective way to control these surges is to limit and slowly ramp the current and voltage being applied to the card, similar to the way in which a
power supply normally turns on. Due to the controlled rise times and fall times of the AP2142/AP2152, these devices can be used to provide a
softer start-up to devices being hot-plugged into a powered system. The UVLO feature of the AP2142/AP2152 also ensures that the switch is off
after the card has been removed, and that the switch is off during the next insertion.
By placing the AP2142/AP2152 between the V
typical rise time of the switch is approximately 1ms, providing a slow voltage ramp at the output of the device. This implementation controls system
surge current and provides a hot-plugging mechanism for any device.
AP2142/ AP2152
Document number: DS31571 Rev. 6 - 2
input and the rest of the circuitry, the input power reaches these devices first after insertion. The
CC
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© Diodes Incorporated
Page 14
Ordering Information
AP2142/ AP2152
Part Number Package Code Packaging
AP21X2SG-13 S SO-8 2500/Tape & Reel -13
AP21X2MPG-13 MP MSOP-8EP 2500/Tape & Reel -13
Quantity Part Number Suffix
13” Tape and Reel
Marking Information
(1) SO-8
( Top view )
8765
(2) MSOP-8EP
Logo
Part Number
4 : Active Low
5 : Active High
AP21X X
YY WW X X
2
1
( Top view )
34
2 : 2 Channel
G : Green
: Year : 08, 09,10~
YY
: Week : 01~52; 52
WW
represents 52 and 53 week
: Internal Code
X
Part Number
4 : Active Low
5 : Active High
AP2142/ AP2152
Document number: DS31571 Rev. 6 - 2
Logo
87 65
Y W X E
AP21X X
234
1
14 of 17
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A~Z : Green
MSOP-8EP
Y : Year : 0~9
W : Week : A~Z : 1~26 week;
a~z : 27~52 week; z represents
52 and 53 week
2 : 2 Channel
January 2013
© Diodes Incorporated
Page 15
Package Outline Dimensions (All dimensions in mm.)
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
(1) Package type: SO-8
e
b
D
E1
A2
E
A1
Detail ‘A’
h
°
45
A3
A
L
0.254
Gauge Plane
Seating Plane
7°~9
°
Detail ‘A’
(2) Package type: MSOP-8EP
D
4
°
Detail C
X
1
0
°
a
L
x
y
E
E2
1
e
A1
A
D
8Xb
A3
A2
D1
E3
E1
Gauge Plane
Seating Plane
See Detail C
0.25
4
X
1
0
c
AP2142/ AP2152
Dim Min Max
Dim Min Max Typ
A1 0.05 0.15 0.10
A2 0.75 0.95 0.86
A3 0.29 0.49 0.39
D1 1.60 2.00 1.80
E1 2.90 3.10 3.00
E2 1.30 1.70 1.50
E3 2.85 3.05 2.95
All Dimensions in mm
SO-8
A - 1.75
A1 0.10 0.20
A2 1.30 1.50
A3 0.15 0.25
b 0.3 0.5
D 4.85 4.95
E 5.90 6.10
E1 3.85 3.95
e 1.27 Typ
h - 0.35
L 0.62 0.82
0° 8°
θ
All Dimensions in mm
MSOP-8EP
A - 1.10 -
b 0.22 0.38 0.30
c 0.08 0.23 0.15
D 2.90 3.10 3.00
E 4.70 5.10 4.90
e - - 0.65
L 0.40 0.80 0.60
a 0° 8° 4°
x - - 0.750
y - - 0.750
AP2142/ AP2152
Document number: DS31571 Rev. 6 - 2
15 of 17
www.diodes.com
January 2013
© Diodes Incorporated
Page 16
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
(1) Package type: SO-8
X
C1
C2
Dimensions Value (in mm)
X 0.60
Y 1.55
C1 5.4
C2 1.27
Y
(2) Package type: MSOP-8EP
X C
G
Y2
AP2142/ AP2152
Document number: DS31571 Rev. 6 - 2
X1
Y
Y1
Dimensions
C 0.650
G 0.450
X 0.450
X1 2.000
Y 1.350
Y1 1.700
Y2 5.300
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www.diodes.com
Value
(in mm)
AP2142/ AP2152
January 2013
© Diodes Incorporated
Page 17
AP2142/ AP2152
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2013, Diodes Incorporated
www.diodes.com
IMPORTANT NOTICE
LIFE SUPPORT
AP2142/ AP2152
Document number: DS31571 Rev. 6 - 2
17 of 17
www.diodes.com
January 2013
© Diodes Incorporated
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