Diodes AP2141D, AP2151D User Manual

Description

The AP2141D and AP2151D are integrated high-side power switches
optimized for Universal Serial Bus (USB) and other hot-swap
applications. The family of devices complies with USB 2.0 and is
available with both polarities of Enable input. They offer current and
thermal limiting and short circuit protection as well as controlled rise
time and under-voltage lockout functionality. A 7ms deglitch capability
on the open-drain Flag output prevents false over-current reporting and
does not require any external components.

All devices are available in SOT25, SO-8, MSOP-8EP, and
U-DFN2018-6 packages.

Features

 Single USB Port Power Switches with Output Discharge
 Over-Current and Thermal Protection
 0.8A accurate Current Limiting
 Fast Transient Response
 Reverse Current Blocking
 90m On-Resistance
 Input Voltage Range: 2.7V - 5.5V
 0.6ms Typical Rise Time
 Very Low Shutdown Current: 1µA (max)
 Fault Report (FLG) with Blanking Time (7ms typ)
 ESD Protection: 4kV HBM, 300V MM
 Active High (AP2151D) or Active Low (AP2141D) enable
 Ambient Temperature Range -40°C to +85°C
 SOT25, SO-8, MSOP-8EP (Exposed Pad), and U-DFN2018-6:

Available in “Green” Molding Compound (No Br, Sb)

 Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
 Halogen and Antimony Free. “Green” Device (Note 3)

 UL Recognized, File Number E322375
 IEC60950-1 CB Scheme Certified

Applications

0.5 SINGLE CHANNEL CURRENT-LIMITED

POWER SWITCH WITH OUTPUT DISCHARGE

Pin Assignments

GND

IN

IN

EN

OUT

GND

FLG

( Top View )

1

2

3

4

( Top View )

1

2

3

AP2141D/ AP2151D

8

NC

7

OUT

6

OUT

5

FLG

SO-8

5

IN

4

EN

SOT25

 Consumer Electronics – LCD TV & Monitor, Game Machines
 Communications – Set-Top-Box, GPS, Smartphone
 Computing – Laptop, Desktop, Servers, Printers, Docking Station,

HUB

Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.

2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.

3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.

AP2141D/ AP2151D

Document number: DS32242 Rev. 4 - 2

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Typical Applications Circuit

AP2151D Enable Active High

AP2141D/ AP2151D

Power Supply

IN

OUT

2.7V to 5.5V

10k

10uF

0.1uF

0.1uF
120uF

FLG

ON

EN

GND

OFF

Part Number Channel Enable Pin (EN)

AP2141D 1 Active Low 0.8A 0.5A
AP2151D 1 Active High 0.8A 0.5A

Current Limit

(Typical)

Pin Descriptions

Pin

Name

GND 1 1 2 1 Ground

IN

EN 4 4 4 3 Enable Input, active low (AP2141D) or active high (A P2151D).

FLG 5 5 3 4

OUT

NC

Exposed tab - Exposed tab - Exposed tab

SO-8 MSOP-8EP SOT25 U-DFN2018-6

2, 3 2, 3 5 2 Voltage Input Pin. (all IN pins must be tied together externally )

6, 7 6, 7 1 5, 6 Voltage Output Pin (all OUT pins must be tied together externally ).

8 8 N/A N/A No Internal Connection; recommend tie to OUT pins.

AP2141D/ AP2151D

Document number: DS32242 Rev. 4 - 2

Pin Number

Descriptions

Over-current and over-temperature fault report; open-drain flag is active low w hen
triggered.

Exposed pad. Internally connected to GND.
It should be externally connected to GND and thermal mass for enhanced

thermal impedance.
It should not be used as electrical ground conduction path.

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Load

Recommended Maximum
Continuous Load Current

May 2013

© Diodes Incorporated

Functional Block Diagram

AP2141D/ AP2151D

IN

UVLO

Current

Sense

Discharge

OUT

Control

EN

Driver

Thermal

Current

Limit

FLG

Deglitch

Sense

GND

Absolute Maximum Ratings (@T

= +25°C, unless otherwise specified.)

A

Symbol Parameter Ratings Unit

ESD HBM Human Body Model ESD Protection 4 kV

ESD MM Machine Model ESD Protection 300 V

VIN

V

OUT

V

EN , VFLG

T

I

LOAD
J(MAX)

TST

Caution: Stresses greater than the 'Absolute Maximum Ratings' specified above, may cause permanent damage to the device. These are stress ratings only;

Semiconductor devices are ESD sensitive and may be damaged by exposure to ESD events. Suitable ESD precautions should be taken when handling
and transporting these devices

Note: 4. UL Recognized Rating from -30°C to +70°C (Diodes qualified T

functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability may be
affected by exposure to absolute maximum rating conditions for extended periods of time.

Input Voltage 6.5 V
Output Voltage

VIN +0.3

V
Enable Voltage 6.5 V
Maximum Continuous Load Current Internal Limited A
Maximum Junction Temperature 150 °C
Storage Temperature Range (Note 4) -65 to +150 °C

from -65°C to +150°C)

ST

Recommended Operating Conditions (@T

= +25°C, unless otherwise specified.)

A

Symbol Parameter Min Max Unit

V

I

OUT

T

VIH
VIL

IN

A

Input voltage 2.7 5.5 V
Output Current 0 500 mA
Operating Ambient Temperature -40 +85

High-Level Input Voltage on EN or
Low-Level Input Voltage on EN or

EN

EN

2.0
0 0.8 V

V

IN

C

V

AP2141D/ AP2151D

Document number: DS32242 Rev. 4 - 2

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AP2141D/ AP2151D

Electrical Characteristics (@T

Symbol Parameter Test Conditions Min Typ Max Unit

V

I

SHDN

I

I

R

DS(ON)

I

SHORT

I
I

I

t

D(ON)

t

D(OFF)

R

t

BLANK

R

T

T

Notes: 5. The discharge function is active when the device is disabled (when enable is de-asserted). The discharge function offers a resistive discharge path
for the external storage capacitor.

6. Device mounted on FR-4 substrate PCB, 2oz copper, with minimum recommended pad layout.

7. Device mounted on 2” x 2” FR-4 substrate PCB, 2oz copper, with minimum recommended pad on top layer and thermal vias to bottom layer ground
plane.

Input UVLO 1.6 1.9 2.5 V

UVLO

Input Shutdown Current
Input Quiescent Current

I

Q

Input Leakage Current Disabled, OUT grounded 0.1 1 µA

LEAK

Reverse Leakage Current

REV

Switch On-Resistance

Short-Circuit Current Limit
Over-Load Current Limit

LIMIT

Current limiting trigger threshold

TRIG

EN Input leakage

SINK

Output turn-on delay time
Output turn-on rise time

tR

Output turn-off delay time
Output turn-off fall time

tF

FLG output FET on-resistance

FLG

FLG blanking time
Discharge resistance (Note 5)

DIS

Discharge Time

t

DIS

Thermal Shutdown Threshold

SHDN

Thermal Shutdown Hysteresis 25

HYS

Thermal Resistance Junction-to-



JA

Ambient

= +25°C, VIN = +5V, unless otherwise specified.)

A

Disabled, I
Enabled, I

Disabled, VIN = 0V, V

OUT

OUT

= 0

= 0

OUT

= 5V, I

REV

at VIN

SOT25, MSOP-8,

V
I

OUT

IN

= 5V,

= 0.5A

T

A

= +25°C

MSOP-8EP, SO-8
U-DFN2018-6

-40°C  TA  +85°C
= +25C

VIN = 3.3V, I

0.5A

T

=

OUT

A

-40°C  TA  +85°C

Enabled into short circuit, CL = 22µF
VIN = 5V, V

= 4.0V, CL = 120µF, -40°C  TA  +85°C

OUT

Output Current Slew Rate (<100A/s) , CL = 22µF
V

= 5V

EN

CL = 1µF, R
CL = 1µF, R
CL = 1µF, R
CL = 1µF, R

=10mA

I

FLG

LOAD
LOAD
LOAD
LOAD

= 10
= 10
= 10

= 10

CIN = 10µF, CL = 22µF
VIN = 5V, disabled, I
CL = 1µF, VIN = 5V, disabled to V
Enabled, R

LOAD

OUT

= 1k

= 1mA

OUT

< 0.5V

0.5 1 µA
45 70 µA

0.1 1 µA
95 115
90 110

140
120 140
170

0.6 A

0.6 0.8 1.0 A

1.0 A
1 µA

0.05 ms

0.6 1.5 ms

0.05 ms

0.05 0.1 ms
20 40 

4 7 15 ms

100 

0.6 ms
140

SOT25 (Note 6) 170
SO-8 (Note 6) 127
MSOP-8EP (Note 7) 67
U-DFN2018-6 (Note 7) 70

m

C
C

°C/W

AP2141D/ AP2151D

Document number: DS32242 Rev. 4 - 2

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Typical Performance Characteristics

AP2141D/ AP2151D

VEN
5V/div

V

OUT

2V/div

Figure 1 Voltage Waveforms: AP2141D (left), AP2151D (right)

All Enable Plots are for AP2151D Active High

Turn-On Delay and Rise Time

= 1uF

C

L

= +25°C

T

A

R

L

= 10

100µs/div

Turn-On Delay and Rise Time

V

EN

5V/div

V

OUT

2V/div

Turn-Off Delay and Fall Time

100µs/div

= 1uF

C

L

T

= +25°C

A

= 10

R

L

Turn-Off Delay and Fall Time

V

EN

5V/div

V

OUT

2V/div

AP2141D/ AP2151D

Document number: DS32242 Rev. 4 - 2

500µs/div

= 120µF

C

L

T

= +25°C

A

= 10

R

L

www.diodes.com

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V

EN

5V/div

V

OUT

2V/div

= 120µF

C

L

T

= +25°C

A

= 10

R

L

500µs/div

May 2013

© Diodes Incorporated

Typical Performance Characteristics (cont.)

Short Circuit Current, Device Enabled Into Short

VEN
5V/div

= 5V

V

I

OUT

200mA/div

IN

T

= +25°C

A

= 22µF

C

L

AP2141D/ AP2151D

Short Circuit with Blanking Time and Recovery

V

OUT

5V/div

V

FLAG

5V/div

I

OUT

1A/div

V

= 5V

IN

= +25°C

T

A

C

= 22µF

L

V

FLAG

2V/div

I

OUT

500mA/div

VFLAG
5V/div

100µs/div

3Ω Load Connected to Enabled Device

V
T
C

1ms/div

Power On Power Off

= 5V

IN

= +25°C

A

= 22µF

L

V

FLAG

2V/div

I

OUT

500mA/div

20ms/div

2Ω Load Connected to Enabled Device

V
T
C

1ms/div

= +25°C

T

A

= 120µF

C

L

R

= 10

L

= 5V

IN

= +25°C

A

= 22µF

L

VFLAG
5V/div

I

OUT

200mA/div

V

EN

5V/div

V

OUT

5V/div

AP2141D/ AP2151D

Document number: DS32242 Rev. 4 - 2

= +25°C

T

A

C

= 120µF

L

= 10

R

L

2ms/div 2ms/div

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I

OUT

200mA/div

V

EN

5V/div
V

OUT

5V/div

May 2013

© Diodes Incorporated

Typical Performance Characteristics (cont.)

V

IN

2V/div

I

OUT

200mA/div

UVLO Increasing

TA = +25°C
C

= 22µF

L

= 10

R

L

V

IN

2V/div

I

OUT

200mA/div

AP2141D/ AP2151D

UVLO Decreasing

T

= +25°C

A

C

= 22µF

L

= 10

R

L

V

OUT

2V/div

V

EN

2V/div

2ms/div

Discharge Time

No Load Resistance

= 470µF

C

L

C

= 120µF

L

C

= 22µF

L

100ms/div

T

A

V

IN

No Load
Resistance

= +25°C

= 5V

I

IN

200mA/div

V

EN

5V/div

20ms/div

Inrush Current

C

= 220µF

L

= 100µF

C

L

1ms/div

= 680µF

C

L

= 5V

V

IN

= +25°C

T

A

R

= 10

L

AP2141D/ AP2151D

Document number: DS32242 Rev. 4 - 2

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Typical Performance Characteristics (cont.)

Turn-O n Time vs Input Volt a ge

800

700

600

500

400

300

Turn-On Time (us)

200

100

0

1.5 2 2.5 3 3.5 4 4.5 5 5.5 6

Input Voltage (V)

CL = 1µF
R

= 10

L

= +25°C

T

A

AP2141D/ AP2151D

Turn-Off Time vs Input Voltage

31

31

30

30

29

29

Turn-Off Time (us)

28

28

1.5 2 2.5 3 3.5 4 4.5 5 5.5 6

Input Voltage (V)

CL = 1µF
R
T

= 10

L

= +25°C

A

Rise Tim e vs Input Voltage

600

500

400

300

200

Rise Time (us)

100

0

1.5 2 2.5 3 3.5 4 4.5 5 5.5 6

Input Voltage (V)

CL = 1µF

= 10

R

L

T

= +25°C

A

Supply Current , Out put Enabled vs Am bi e nt Tem per a t ur e

65

60

55

50

45

40

35

Supply Current, Output Enab led (uA)

30

= 5.5V

V

-60 -40 -20 0 20 40 60 80 100

= 5.0V

V

V

Ambient Tem perature (°C)

= 3.3V

V

= 2.7V V

Fall Time vs I n put Vol t ag e

25

24

23

22

Fall Time (us)

21

20

19

1.5 2 2.5 3 3.5 4 4.5 5 5.5 6

Input Voltage (V)

CL = 1µF
R

= 10

L

= +25°C

T

A

Supply Current, O ut put Disabl ed vs A m bi ent Temper at ure

1.60

1.40

1.20

1.00

0.80

0.60

0.40

0.20

Supply Current, Output Disabled (uA)

0.00

V

= 2.7V

-45 -25 -5 15 35 55 75 95

V

= 3.3V

Amb ient Temperature ( °C)

= 5.0V

V

= 5.5V

AP2141D/ AP2151D

Document number: DS32242 Rev. 4 - 2

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Typical Performance Characteristics (cont.)

Static Drain- Source On- St ate Resi stance vs A m bi ent

200
190
180

V

170
160
150
140
130

Resistance (mΩ)

120

Static Drain-Source On-State

110
100

= 2.7V

-60 -40 - 20 0 20 40 60 80 100

Temperature

V

= 3.3V

V

= 5V

Amb ient Temperature (°C)

AP2141D/ AP2151D

Short-Circuit Out put Curre nt vs Ambient Temper at ur e

710

700

V

690

680

670

660

650

640

Short-Circuit Output Current (mA)

630

= 2.7V

-60 -40 -20 0 20 40 60 80 100

= 3.3V

V

Amb ient Temperat ure (°C)

= 5V

V

V

= 5V

V

= 5.5V

Undervoltage Lockout vs A mbient Temperat ur e

2.05

2.04

2.03

2.02

2.01

2.00

1.99

1.98

1.97

Undervoltage Lockout (V)

1.96

1.95

-60 -40 -20 0 20 40 60 80 100

UVLO Rising

UVLO Falling

Ambient Temperature (°C)

AP2141D/ AP2151D

Document number: DS32242 Rev. 4 - 2

Threshold Tri p Cur r ent vs Input Volt age

1.15

1.14

1.13

1.12

1.11

Threshold Trip Current (A)

1.10

2.8 3.3 3.8 4.3 4.8 5.3

Input Voltage (V)

TA = +25°C

= 22µF

C

L

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AP2141D/ AP2151D

Application Information

The AP2141D and AP2151D are integrated high-side power switches optimized for Universal Serial Bus (USB) that require protection functions. The
power switches are equipped with a driver that controls the gate voltage and incorporates slew-rate limitation. This, along with the various protection
features and special functions, makes these power switches ideal for hot-swap or hot-plug applications.

Protection Features:

Under-Voltage Lockout (UVLO)

Under-voltage lockout function (UVLO) guarantees that the internal power switch is initially off during start-up. The UVLO functions onl y when the
switch is enabled. Even if the switch is enabled, the switch is not turned ON until the power supply has reached at least 1.9V. Whenever the input
voltage falls below approximately 1.9V, the power switch is turned off. This facilitates the design of hot-insertion systems where it is not possible to
turn off the power switch before input power is removed.

Over-Current and Short Circuit Protection

An internal sensing FET is employed to check for over-current conditions. Unlike current-sense resistors, sense FETs do not increase the series
resistance of the current path. When an overcurrent condition is detected, the device maintains a constant output current and reduces the output
voltage accordingly. Complete shutdown occurs only if the fault stays long enough to activate thermal limiting.

The different overload conditions and the corresponding response of the AP2141D/2151D are outlined below:

S.NO Conditions Explanation Behavior of the AP2141D/2151D

1 Short circuit condition at start-up

Short-circuit or Overcurrent

2

condition

Gradual increase from nominal

3

operating current to I

Note that when the output has been shorted to GND at extremely low temperature (< -20oC), a minimum 120 F electrolytic capacitor on the output
pin is recommended. A correct capacitor type with capacitor voltage rating and temperature characteristics must be properly chosen so that
capacitance value does not drop too low at the extremely low temperature operation. A recommended capacitor should have temperature
characteristics of less than 10% variation of capacitance change when operated at extremely low temp. Our recommended aluminum electrolytic
capacitor type is Panasonic FC series.

LIMIT

Output is shorted before input
voltage is applied or before the
part is enabled

Short-Circuit or Overload condition
that occurs when the part is
enabled.

Load increases gradually until the
current-limit threshold.(I

TRIG

)

Thermal Protection

Thermal protection prevents the IC from damage when the die temperature exceeds safe margins. This mainly occurs when heavy-overload or short­circuit faults are present for extended periods of time. The AP2141D/AP2151D implements thermal sensing to monitor the operating junction
temperature of the power distribution switch. Once the die temperature rises to approximately 140°C, the Thermal protection feature gets activated
as follows: The internal thermal sense circuitry turns the power switch off and the FLG output is asserted thus preventing the power switch from
damage. Hysteresis in the thermal sense circuit allows the device to cool down to approximately 25°C before the out put is turned bac k on. The built­in thermal hysteresis feature avoids undesirable oscillations of the thermal protection circuit. The switch continues to cycle in this manner until the
load fault is removed, resulting in a pulsed output. The FLG open-drain output is asserted when an over-current occurs with 7-ms deglitch.

Reverse Current Protection

In a normal MOSFET switch, current can flow in reverse direction (from the output side to the input side) when the output side voltage is higher than
the input side, even when the switch is turned off. A reverse-current blocking feature is implemented in the AP21x1 series to prevent such back
currents. This circuit is activated by the difference between the output voltage and the input voltage. When the switch is disabled, this feature blocks
reverse current flow from the output back to the input.

AP2141D/ AP2151D

Document number: DS32242 Rev. 4 - 2

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The IC senses the short circuit and immediately clamps output
current to a certain safe level namely I

At the instance the overload occurs, higher current may flow for
a very short period of time before the current limit function can
react.

After the current limit function has tripped (reached the over­current trip threshold), the device switches into current limiting

mode and the current is clamped at I
The current rises until I

has been reached, the device switches into its current limiting
mode and is set at I

or thermal limit. Once the threshold

TRIG

.

LIMIT

LIMIT.

LIMIT

.

May 2013

© Diodes Incorporated

AP2141D/ AP2151D

Application Information (cont.)

Special Functions:

Discharge Function

When enable is de-asserted, the discharge function is active. The output capacitor is discharged through an inte rnal NMOS that has a discharge
resistance of 100. Hence, the output voltage drops down to zero. The time taken for discharge is dependent on the RC time constant of t he
resistance and the output capacitor.

FLG Response

The FLG open-drain output goes active low for any of the two conditions: Over-Current or Over-Tem perature. The tim e from when a fa ult condition is
encountered to when the FLG output goes low is 7-ms (typ). The FLG output remains low until both over-current and over-temperature conditions
are removed. Connecting a heavy capacitive load to the output of the device can cause a momentary Over-current con dition, which does not trigger
the FLG due to the 7-ms deglitch timeout. The 7-ms timeout is also applicable for Over-current recovery and Thermal recovery. The
AP2141D/AP2151D are designed to eliminate erroneous Over-current reporting without the need for external components, such as an RC delay
network.

Power Supply Considerations

A 0.01-F to 0.1-F X7R or X5R ceramic bypass capacitor between IN and GND, close to the device, is recommended. This limits the input voltage
drop during line transients. Placing a high-value electrolytic capacitor on the input (10-F minimum) and output pin(s) is recommended when the
output load is heavy. This precaution also reduces power-supply transients that may cause ringing on the input. Additionally, bypassing the output
with a 0.01-F to 0.1-F ceramic capacitor improves the immunity of the device to short-circuit transients. This capacitor also prevents the output
from going negative during turn-off due to inductive parasitics.

Power Dissipation and Junction Temperature

The low on-resistance of the internal MOSFET allows the small surface-mount packages to pass large current. Using the maximum operating
ambient temperature (T

P

= R

D

The junction temperature can be calculated by:

Where:

DS(ON)

T

= PD x R

J

= Ambient temperature °C

T

A

= Thermal resistance

R

JA

P

= Total power dissipation

D

Generic Hot-Plug Applications

In many applications it may be necessary to remove modules or PC boards while the main unit is still operating. These are considered hot-plug
applications. Such implementations require the control of current surges as seen by the main power supply and the card being inserted. The most
effective way to control these surges is to limit and slowly ramp up the current and voltage being applied to th e card, similar to the way in which a
power supply normally turns on. Due to the controlled rise and fall times of the AP2141D/AP2151D, these devices can be used to provide a softer
start-up to devices being hot-plugged into a powered system. The UVLO feature of the AP2141D/ AP2151D also ensures that the switch is off after
the card has been removed, and that the switch is off during the next insertion.

By placing the AP2141D/AP2151D between the VCC input and the rest of the circuitry, the input power reaches these devices first after insertion.
The typical rise time of the switch is approximately 1ms, providing a slow voltage ramp at the output of the device. This implementation controls the
system surge current and provides a hot-plugging mechanism for any device.

JA



× I2

+ TA

) and R

A

, the power dissipation can be calculated by:

DS(ON)

AP2141D/ AP2151D

Document number: DS32242 Rev. 4 - 2

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Ordering Information

AP2141D/ AP2151D

Part Number Package Code Packaging

AP21X1DSG-13 S SO-8 2500/Tape & Reel -13

AP21X1DMPG-13 MP MSOP-8EP 2500/Tape & Reel -13

AP21X1DWG-7 W SOT25 3000/Tape & Reel -7

AP21X1DFMG-7 FM U-DFN2018-6 3000/Tape & Reel -7

Quantity Part Number Suffix

7”/13” Tape and Reel

Marking Information

(1) SO-8

( Top View )

8765

Logo

Part Number

4 : Active Low
5 : Active High

AP21X X D

YY WW X X

2

1

34

1 : 1 Channel
YY

: Year : 08, 09,10~

: Week : 01~52; 52

WW

represents 52 and 53 week
X

: Internal Code

G : Green

AP2141D/ AP2151D

Document number: DS32242 Rev. 4 - 2

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Marking Information (cont.)

(2) MSOP-8EP

AP2141D/ AP2151D

(3) SOT25

(4) U-DFN2018-6

( Top View )

5

7

4

XX : Identification code

: Year 0~9

Y

Y

W X

: Week : A~Z : 1~26 week;

W

XX

a~z : 27~52 week; z represents
52 and 53 week

X

1 2 3

: A~Z : Green

Device Package Type Identification Code

AP2141DW SOT25 JA
AP2151DW SOT25 JB

AP2141D/ AP2151D

Document number: DS32242 Rev. 4 - 2

Device Package type Identification Code

AP2141DFM U-DFN2018-6 JA
AP2151DFM U-DFN2018-6 JB

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Package Outline Dimensions (All dimensions in mm.)

Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.

(1) Package type: SO-8

(2) Package Type: MSOP-8EP

e

D

D

E1

E

A1

Detail ‘A’

h

°

45

A2

A3

A

b

L

0.254

Gaug e Plan e
Seating Plane

7°~9

°

Detail ‘A’

x

y

1

e

A1

A

D

E

8Xb

A2

E2

A3

D1

E3

E1

Gauge Plane
Seating Plane

See Detail C

0.25

4

X

1

c

0

°

4

X

Detail C

1

0

°

a

L

AP2141D/ AP2151D

Dim Min Max

Dim Min Max Typ

A1 0.05 0.15 0.10
A2 0.75 0.95 0.86
A3 0.29 0.49 0.39

D1 1.60 2.00 1.80
E1 2.90 3.10 3.00

E2 1.30 1.70 1.50
E3 2.85 3.05 2.95

SO-8

A - 1.75
A1 0.10 0.20
A2 1.30 1.50
A3 0.15 0.25

b 0.3 0.5

D 4.85 4.95

E 5.90 6.10
E1 3.85 3.95

e 1.27 Typ

h - 0.35

L 0.62 0.82

0 8



All Dimensions in mm

MSOP-8EP

A - 1.10 -

b 0.22 0.38 0.30
c 0.08 0.23 0.15
D 2.90 3.10 3.00

E 4.70 5.10 4.90

e - - 0.65
L 0.40 0.80 0.60
a 0° 8° 4°
x - - 0.750
y - - 0.750

All Dimensions in mm

AP2141D/ AP2151D

Document number: DS32242 Rev. 4 - 2

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Package Outline Dimensions (cont.) (All dimensions in mm.)

(3) Package Type: SOT25

A

B C

K

H

N

M

J

D

L

(4) Package Type: U-DFN2018-6

A

Pin#1 ID

A1

E

e

AP2141D/ AP2151D

Document number: DS32242 Rev. 4 - 2

D

D2

A3

SEATING PLANE

L

E2

z

b

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AP2141D/ AP2151D

SOT25

Dim Min Max Typ

A 0.35 0.50 0.38
B 1.50 1.70 1.60
C 2.70 3.00 2.80
D

 

H 2.90 3.10 3.00
J 0.013 0.10 0.05
K 1.00 1.30 1.10

L 0.35 0.55 0.40
M 0.10 0.20 0.15
N 0.70 0.80 0.75

0° 8°



All Dimensions in mm

U-DFN2018-6

Dim Min Max Typ

A 0.545 0.605 0.575

A1 0 0.05 0.02
A3

 

b 0.15 0.25 0.20

D 1.750 1.875 1.80

D2 1.30 1.50 1.40

e

 

E 1.95 2.075 2.00

E2 0.90 1.10 1.00

L 0.20 0.30 0.25
z



All Dimensions in mm



0.95



0.13

0.50

0.30

May 2013

© Diodes Incorporated

Suggested Pad Layout

Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.

(1) Package Type: SO-8

X

(2) Package Type: MSOP-8EP

C2

Y

X C

C1

Dimensions Value (in mm)

Y

G

Y2

X1

(3) Package Type: SOT25

Y1

C2C2

G

Z

Y

X

AP2141D/ AP2151D

Document number: DS32242 Rev. 4 - 2

C1

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AP2141D/ AP2151D

X 0.60

Y 1.55
C1 5.4
C2 1.27

Dimensions

C 0.650
G 0.450
X 0.450

X1 2.000

Y 1.350
Y1 1.700
Y2 5.300

Dimensions Value (in mm)

Z 3.20
G 1.60
X 0.55

Y 0.80
C1 2.40
C2 0.95

Value

(in mm)

May 2013

© Diodes Incorporated

Suggested Pad Layout (cont.)

Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.

(4) Package type: U-DFN2018-6

Y1

XC

Y

G

X1

Taping Orientation (Note 8)

For U-DFN2018-6

AP2141D/ AP2151D

Dimensions Value (in mm)

C 0.50
G 0.20
X 0.25

X1 1.60

Y 0.35

Y1 1.20

Note: 8. The taping orientation of the other package type can be found on our website at http://www.diodes.com/datasheets/ap02007.pdf

AP2141D/ AP2151D

Document number: DS32242 Rev. 4 - 2

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© Diodes Incorporated

AP2141D/ AP2151D

DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).

Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described he rein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.

Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorize d application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.

Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.

This document is written in English but may be translated into multiple languages for reference. Only the English ver sion of this document is the
final and determinative format released by Diodes Incorporated.

Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:

A. Life support devices or systems are devices or systems which:

1. are intended to implant into the body, or

2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the

labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the

failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and

acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.

Copyright © 2013, Diodes Incorporated

www.diodes.com

IMPORTANT NOTICE

LIFE SUPPORT

AP2141D/ AP2151D

Document number: DS32242 Rev. 4 - 2

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