8
Green
0.5A SINGLE CHANNEL CURRENT-LIMITED POWER SWITCH
Description
The AP2145 and AP2155 are integrated high-side power switches
optimized for Universal Serial Bus (USB) and other hot-swap
applications. The family of devices complies with USB 2.0 and
available with both polarities of Enable input. They offer current and
thermal limiting and short circuit protection as well as controlled rise
time and under-voltage lockout functionality. A 7ms deglitch capability
on the open-drain Flag output prevents false over-current reporting
and does not require any external components.
All devices are available in SO-8 and MSOP-8EP packages.
Features
Single USB Port Power Switches
Over-Current and Thermal Protection
0.8A Accurate Current Limiting
Reverse Current Blocking
90m On-Resistance
Input Voltage Range: 2.7V - 5.5V
0.6ms Typical Rise Time
Very Low Shutdown Current: 1µA (max)
Fault Report (FLG) with Blanking Time (7ms typ)
ESD Protection: 6kV HBM, 400V MM
Active High (AP2155) or Active Low (AP2145) Enable
Ambient Temperature Range -40°C to +85°C
SO-8 and MSOP-8EP (Exposed Pad): Available in “Green”
Molding Compound (No Br, Sb)
Lead-Free Finish; RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
UL Recognized, File Number E322375
IEC60950-1 CB Scheme Certified
Notes: 1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
Pin Assignments
SO-
1
EN
FLG
2
3
GND
4
NC
(Top View)
MSOP-8EP
1
EN
2
FLG
NC
3
4
(Top View)
GND
Applications
Consumer electronics – LCD TV & Monitor, Game Machines
Communications – Set-Top-Box, GPS, Smartphone
Computing – Laptop, Desktop, Servers, Printers, Docking Station,
HUB
AP2145/ AP2155
8
OUT
7
6
OUT
5
NC
8
7
6
5
IN
OUT
IN
OUT
NC
Typical Applications Circuit
Power Supply
IN
2.7V t o 5. 5V
10k
10uF
0.1uF
FLG
EN
ON
OFF
AP2145/ AP2155
Document number: DS32031 Rev. 3 - 2
1 of 13
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GND
OUT
0.1uF
120uF
Load
March 2013
© Diodes Incorporated
Available Options
Part Number Channel
AP2145 1 Active Low 0.8A 0.5A
AP2155 1 Active High 0.8A 0.5A
Enable Pin
(EN)
Current Limit
(typ)
Recommended Maximum
Continuous Load Current
Pin Descriptions
Pin Name
Pin Number
SO-8 MSOP-8EP
Function
EN 1 1 Enable input, active low (AP2145) or active high (AP2155)
FLG 2 2 Over-current and over-temperature fault report; open-drain flag is active low w hen triggered.
GND 3 3 Ground
NC
OUT
IN
4, 5 4, 5 No internal connection
6, 8 6, 8 Voltage output pin (all OUT pins mu st be tied toge ther externally )
7 7 Voltage input pin
Exposed Pad:
Exposed Pad — Exposed Pad
It should be externally connected to GND plane and thermal mass for enhanced thermal impedance.
It should not be used as electrical ground conduction path.
Functional Block Diagram
AP2145/ AP2155
AP2145, AP2155
Current
Sense
Current
Limit
Deglitch
GND
EN
IN
UVLO
Driver
Thermal
Sense
Absolute Maximum Ratings (@T
= +25°C, unless otherwise specified.)
A
Symbol Parameter Ratings Unit
ESD HBM Human Body Model ESD Protection 6 kV
ESD MM Machine Model ESD Protection 400 V
VIN
V
OUT
V
EN , VFLG
T
I
LOAD
J(MAX)
TST
Caution: Stresses greater than the 'Absolute Maximum Ratings' specified above, may cause permanent damage to the device. These are stress ratings only;
functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability may be
affected by exposure to absolute maximum rating conditions for extended periods of time.
Semiconductor devices are ESD sensitive and may be damaged by exposure to ESD events. Suitable ESD precautions should be taken when handling
and transporting these devices
Note: 4. UL Recognized Rating from -30°C to +70°C (Diodes qualified T
AP2145/ AP2155
Document number: DS32031 Rev. 3 - 2
Input Voltage 6.5 V
Output Voltage
VIN +0.3
V
Enable Voltage 6.5 V
Maximum Continuous Load Current Internal Limited A
Maximum Junction Temperature 150 °C
Storage Temperature Range (Note 4) -65 to +150 °C
from -65°C to +150°C)
ST
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OUT
FLG
March 2013
© Diodes Incorporated
AP2145/ AP2155
Recommended Operating Conditions (@T
= +25°C, unless otherwise specified.)
A
Symbol Parameter Min Max Unit
V
I
OUT
VIL
VIH
T
IN
A
Input voltage 2.7 5.5 V
Output Current 0 500 mA
EN Input Logic Low Voltage 0 0.8 V
EN Input Logic High Voltage 2.0
VIN
Operating Ambient Temperature -40 85
V
C
Electrical Characteristics (@T
= +25°C, VIN = +5.0V, unless otherwise specified.)
A
Symbol Parameter Test Conditions Min Typ. Max Unit
V
I
SHDN
I
I
R
DS(ON)
I
SHORT
I
I
T
SHORT
I
I
O-LEAK
T
T
D(OFF)
R
I
T
BlLANK
T
T
Notes: 5. Test condition for SO-8: Device mounted on FR-4, 2oz copper, with minimum recommended pad layout.
6. Test condition for MSOP-8EP: Device mounted on 2” x 2” FR-4 substrate PC board, 2oz copper, with minimum recommended pad on top layer
and thermal vias to bottom layer ground plane.
Input UVLO
UVLO
R
LOAD
= 1k
Input Shutdown Current Disabled, OUT = open 0.5 1 µA
Input Quiescent Current Enabled, OUT = open 45 70 µA
I
Q
Input Leakage Current Disabled, OUT grounded -1 1 µA
LEAK
Reverse Leakage Current
REV
Switch On-Resistance
Short-Circuit Current Limit
Over-Load Current Limit
LIMIT
Current Limiting Trigger Threshold
TRIG
Short-Circuit Response Time
EN Input Logic Low Voltage
V
IL
EN Input Logic High Voltage
V
IH
EN Input Leakage
SINK
Output Leakage Current Disabled 1 µA
Output Turn-On Delay Time
D(ON)
Output Turn-On Rise Time
TR
Output Turn-Off Delay Time
Output Turn-Off Fall Time
TF
FLG Output FET On-Resistance
FLG
FLG Leakage Current
FLG
FLG Blanking Time
Thermal Shutdown Threshold
SHDN
Thermal Shutdown Hysteresis 25
HYS
Thermal Resistance Junction-to-
JA
Ambient
Disabled, VIN= 0V, V
= 5V, I
V
IN
VIN = 3.3V, I
= 0.5A, -40°C TA +85°C
OUT
OUT
Enabled into short circuit, C
V
= 5V, V
IN
-40°C T
OUT
+85°C
A
= 4.5V, C
Output Current Slew rate (<100A/s), C
V
= 0V to I
OUT
C
= 100µF
L
V
= 2.7V to 5.5V
IN
V
= 2.7V to 5.5V
IN
= 5V
V
EN
CL = 1µF, R
CL = 1µF, R
CL = 1µF, R
CL = 1µF, R
= 3.3V or 5V, C
V
IN
V
= 5V
FLG
OUT
LOAD
LOAD
LOAD
LOAD
VIN = 3.3V or 5V, C
Enabled, R
LOAD
OUT
= 5V, I
REV
at VIN
= 0.5A, -40°C TA +85°C
=10µF, CL = 100µF
IN
=10µF, CL = 100µF,
IN
= 10µF, CL = 22µF
IN
= I
(short applied to output),
LIMIT
= 10
= 10
= 10
= 10
= 10µF, I
IN
= 10µF, CL = 100µF
IN
= 10mA
FLG
= 1k
MSOP-8EP 90 140 m
SO-8 95 140 m
SO-8 (Note 5) 110
MSOP-8EP (Note 6) 60
1.6 1.9 2.5 V
1 µA
120 160 m
0.7 A
0.6 0.8 1.0 A
1.0 A
10 µs
0.8 V
2 V
1 µA
0.05 ms
0.6 1.5 ms
0.01 ms
0.05 0.1 ms
20 40
1 µA
4 7 15 ms
135
C
C
C/W
C/W
AP2145/ AP2155
Document number: DS32031 Rev. 3 - 2
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March 2013
© Diodes Incorporated
Typical Performance Characteristics
AP2145/ AP2155
Ven
5V/div
Vout
2V/div
V
EN
V
OUT
50%
T
D(ON)
T
10%
50%
T
R
90%
D(OFF)
90%
10%
T
F
V
EN
50%
T
T
D(ON)
V
OUT
10%
50%
T
R
90%
D(OFF)
90%
10%
T
F
Figure 1. Voltage Waveforms: AP2145 (left), AP2155 (right)
All Enable Plots are for AP2155 Active High
Turn-On Delay and Rise Time
500µs/div
CL=1µF
TA= +25°C
RL=10
Ven
5V/div
Vout
2V/div
Turn-Off Delay and Fall Time
CL=1µF
TA= +25°C
RL=10
500µs/div
Turn-On Delay and Rise Time
Turn-Off Delay and Fall Time
Ven
5V/div
Vout
2V/div
AP2145/ AP2155
Document number: DS32031 Rev. 3 - 2
500µs/div
CL=100µF
TA= +25°C
RL=10
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Ven
5V/div
Vout
2V/div
500µs/div
CL=100µF
TA= +25°C
RL=10
March 2013
© Diodes Incorporated
Typical Performance Characteristics (cont.)
Ven
5V/div
Iout
200mA/div
Short Circuit Current,
Device Enabled Into Short
VIN= 5V
TA= +25°C
CL=100µF
Ven
5V/div
Iin
200mA/div
C
=100µF
L
C
=220µF
L
Inrush Current
CL=470µF
AP2145/ AP2155
=5V
V
IN
T
= +25°C
A
RL=10
Vflag
2V/div
Iout
500mA/div
Vout
5V/div
Vflag
5V/div
Iout
1A/div
500µs/div
3 Ω Load Connected to Enabled Device
VIN=5V
TA= +25°C
CL=100µF
2ms/div
Short Circuit with Blanking Time and Recovery
V
=5V
IN
= +25°C
T
A
C
=100µF
L
Vflag
2V/div
Iout
500mA/div
Vflag
5V/div
Iout
200mA/div
Vin
5V/div
Vout
5V/div
1ms/div
2 Ω Load Connected to Enabled Device
VIN=5V
TA= +25°C
CL=100µF
2ms/div
Power On
TA= +25°C
=100µF
C
L
RL=10
AP2145/ AP2155
Document number: DS32031 Rev. 3 - 2
50ms/div
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Vout
5V/div
1ms/div
March 2013
© Diodes Incorporated
Typical Performance Characteristics (cont.)
Vflag
5V/div
Iout
200mA/div
Power Off
TA= +25°C
=100µF
C
L
R
=10
L
Vflag
5V/div
Iout
200mA/div
AP2145/ AP2155
Device Enabled
Vin
5V/div
Vout
5V/div
Vflag
5V/div
Iout
200mA/div
Ven
5V/div
Vout
5V/div
Vin
2V/div
10ms/div
Device Disabled
1ms/div
UVLO Decreasing
T
= +25°C
A
CL=100µF
RL=10
TA= +25°C
=100µF
C
L
RL=10
Ven
5V/div
Vout
5V/div
Vin
2V/div
Iout
200mA/div
1ms/div
UVLO Increasing
1ms/div
TA= +25°C
=100µF
C
L
R
=10
L
TA= +25°C
CL=100µF
RL=10
Iout
200mA/div
AP2145/ AP2155
Document number: DS32031 Rev. 3 - 2
10ms/div
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© Diodes Incorporated
Typical Performance Characteristics (cont.)
Turn-On Time vs Input Voltage
800
700
600
500
400
300
Turn-On Time (us)
200
100
0
1.522.533.544.555.56
Input V o ltage (V)
CL=1µF
RL=10
=+25°C
T
AP2145/ AP2155
Turn-O f f Ti m e vs I nput Voltage
31
31
30
30
29
29
Turn-Off Time (us)
28
28
1.5 2 2.5 3 3.5 4 4.5 5 5.5 6
Input Vo l tage (V)
CL=1µF
RL=10
TA= +25°C
Rise Time vs I nput Vol t age
600
500
400
300
200
Rise Time (us)
100
0
1.522.533.544.555.56
Input V o ltage (V)
CL=1µF
RL=10
T
=+25°C
Vin=5.5V
Vin=5.0V
Vin=3.3V
Fall Time vs I nput Vol tage
25
24
23
22
Fall Time (us )
21
20
19
1.5 2 2.5 3 3.5 4 4.5 5 5.5 6
Input Vo l tage (V)
Supply Curr ent , Out put Di sa bled vs Am bient Tem per a t ur e
1.60
1.40
1.20
1.00
0.80
0.60
0.40
0.20
Supply Current, Output Disabled (uA)
0.00
Vin=3.3V
Vin=2.7V
-45 -25 -5 15 35 55 75 95
Vin=5.0V
Ambient Temperatur e (°C)
Vin=5.5V
CL=1µF
RL=10
T
=+25°C
AP2145/ AP2155
Document number: DS32031 Rev. 3 - 2
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© Diodes Incorporated
Typical Performance Characteristics (cont.)
Static Drai n- Source On-State Resist ance vs Ambient
145
135
125
115
105
95
Resistance (mΩ)
85
75
Static Drain-Source On-State
65
-60 -40 -20 0 20 40 60 80 100
Undervoltage Lockout vs Ambient Temperatur e
2.05
2.04
2.03
2.02
2.01
2.00
1.99
1.98
1.97
Undervoltage Lockout (V)
1.96
1.95
-60 -40 -20 0 20 40 60 80 100
Temperature
Vin=3.3V
Vin=5V
Ambient Temperature (°C)
UVLO Rising
UVLO Falling
Ambient Tempera ture (°C)
AP2145/ AP2155
Short-Cir cui t O ut put Curr ent vs A m bi ent Tem per at ure
750
745
740
735
730
725
Short-Circuit Output Current (A)
720
-60 -40 -20 0 20 40 60 80 100
1.15
1.14
1.13
1.12
1.11
Threshold Trip Current (A)
1.10
2.8 3.3 3.8 4.3 4.8 5.3
Vin=3.3V
Vin=5V
Ambient Temperature (°C)
Threshold Tri p Curr ent v s I nput Vol t age
TA= +25°C
CL=22µF
Input Voltage (V)
Current Limit Response vs Peak Current
45
40
35
30
25
20
15
10
Current Limit Response (us)
5
0
2345678910
AP2145/ AP2155
Document number: DS32031 Rev. 3 - 2
VIN=5V
TA= +25°C
=
Peak Current (A)
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AP2145/ AP2155
Application Information
Power Supply Considerations
A 0.1-F to 1-F X7R or X5R ceramic bypass capacitor between IN and GND, close to the device, is recommended. Placing a high-value
electrolytic capacitor on the input and output pin(s) is recommended when the output load is heavy. This precaution reduces power-supply
transients that may cause ringing on the input. Additionally, bypassing the output with a 0.01-F to 0.1-F ceramic capacitor improves the immunity
of the device to short-circuit transients.
Over-Current and Short Circuit Protection
An internal sensing FET is employed to check for over-current conditions. Unlike current-sense resistors, sense FETs do not increase the series
resistance of the current path. When an overcurrent condition is detected, the device maintains a constant output current and reduces the output
voltage accordingly. Complete shutdown occurs only if the fault stays long enough to activate thermal limiting.
Three possible overload conditions can occur. In the first condition, the output has been shorted to GND before the device is enabled or before V
has been applied. The AP2145/AP2155 senses the short circuit and immediately clamps output current to a certain safe level namely I
LIMIT
IN
.
In the second condition, an output short or an overload occurs while the device is enabled. At the instance the overload occurs, highe r curr ent m ay
flow for a very short period of time before the current limit function can react. After the current limit function has tripped (reached the over-current
trip threshold), the device switches into current limiting mode and the current is clamped at I
LIMIT
.
In the third condition, the load has been gradually increased beyond the recommended operating current. The current is permitted to rise until the
current-limit threshold (I
) is reached or until the thermal limit of the device is exceeded. The AP2145/AP2155 is capable of delivering current up
TRIG
to the current-limit threshold without damaging the device. Once the threshold has been reached, the device switches into its current limiting mode
and is set at I
LIMIT
.
To protect against short circuit to GND at extremely low temperature (< -30°C), a minimum 120-F electrolytic capacitor on the output pin is
recommended. A correct capacitor type with capacitor voltage rating and temperature characteristics must be properly chosen so that capacitance
value does not drop too low at the extremely low temperature operation. A recommended capacitor should have tem perature charact eristics of less
than 10% variation of capacitance change when operated at extremely low temp. Our recommended aluminum electrolytic capacitor type is
Panasonic FC series.
FLG Response
When an over-current or over-temperature shutdown condition is encountered, the FLG open-drain output goes a ctive low after a nominal 7-ms
deglitch timeout. The FLG output remains low until both over-current and over-temperature conditions are removed. Connecting a heavy capacitive
load to the output of the device can cause a momentary over-current condition, which does not trigger the FLG due to the 7-ms deglitch timeout.
The AP2145/AP2155 is designed to eliminate false over-current reporting without the need of external components to remove unwanted pulses
.
Power Dissipation and Junction Temperature
The low on-resistance of the internal MOSFET allows the small surface-mount packages to pass large current. Using the maximum operating
ambient temperature (T
= R
P
D
DS(ON)
× I2
) and R
A
, the power dissipation can be calculated by:
DS(ON)
Finally, calculate the junction temperature:
T
= PD x R
J
JA
+ TA
Where:
= Ambient temperature C
T
A
R
= Thermal resistance
JA
P
= Total power dissipation
D
Thermal Protection
Thermal protection prevents the IC from damage when heavy-overload or short-circuit faults are present for extended periods of time. The
AP2145/AP2155 implements a thermal sensing to monitor the operating junction temperature of the power distribution switch. Once the die
temperature rises to approximately 140°C due to excessive power dissipation in an over-current or short-circuit condition the internal thermal sense
circuitry turns the power switch off, thus preventing the power switch from damage. Hysteresis is built into the thermal sense circuit allowing the
device to cool down approximately 25°C before the switch turns back on. The switch continues to cycle in this manner until the load fault or input
power is removed. The FLG open-drain output is asserted when an over-temperature shutdown or over-current occurs with 7-ms deglitch.
AP2145/ AP2155
Document number: DS32031 Rev. 3 - 2
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© Diodes Incorporated
3
AP2145/ AP2155
Application Information (cont.)
Under-Voltage Lockout (UVLO)
Under-voltage lockout function (UVLO) keeps the internal power switch from being turned on until the power supply has reached at least 1.9V, even
if the switch is enabled. Whenever the input voltage falls below approximately 1.9V, the power switch is quickly turned off. This facilitates the design
of hot-insertion systems where it is not possible to turn off the power switch before input power is removed.
Generic Hot-Plug Applications
In many applications it may be necessary to remove modules or pc boards while the main unit is still operating. These are considered hot-plug
applications. Such implementations require the control of current surges seen by the main power supply and the card being inserted. The most
effective way to control these surges is to limit and slowly ramp the current and voltage being applied to the card, similar to the way in which a
power supply normally turns on. Due to the controlled rise times and fall times of the AP2145/AP2155, these devices can be used to provide a
softer start-up to devices being hot-plugged into a powered system. The UVLO feature of the AP2145/AP2155 also ensures that the switch is off
after the card has been removed, and that the switch is off during the next insertion.
By placing the AP2145/AP2155 between the V
typical rise time of the switch is approximately 1ms, providing a slow voltage ramp at the output of the device. This implementation controls system
surge current and provides a hot-plugging mechanism for any device.
input and the rest of the circuitry, the input power reaches these devices first after insertion. The
CC
Ordering Information
AP 21 X5XXG-1
Channel
4 : Active Low
5 : Active High
Part Number Package Code Packaging
AP21X5SG-13 S SO-8 2500/Tape & Reel -13
AP21X5MPG-13 MP MSOP-8EP 2500/Tape & Reel -13
PackageEnable
S : SO-8
MP : MSOP-8EP
Green
G : Green 13 : T ape & Reel5 : 1 Channel
13” Tape and Reel
Quantity Part Number Suffix
Marking Information
(1) SO-8
( Top view )
8765
Logo
Part Number
4 : Active Low
5 : Active High
AP21X X
YY WW X X
2
1
34
5 : 1 Channel
G : Green
: Year : 08, 09,10~
YY
: Week : 01~52; 52
WW
represents 52 and 53 week
X
: Internal Code
Packing
AP2145/ AP2155
Document number: DS32031 Rev. 3 - 2
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© Diodes Incorporated
Marking Information (cont.)
(2) MSOP-8EP
AP2145/ AP2155
Package Outline Dimensions (All dimensions in mm.)
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
Package Type: SO-8
(1)
e
b
D
E1
A2
E
A1
Detail ‘A’
h
°
45
A3
A
L
0.254
Gaug e Plane
Seating Plane
7°~9
°
Detail ‘A’
Dim Min Max
A - 1.75
A1 0.10 0.20
A2 1.30 1.50
A3 0.15 0.25
b 0.3 0.5
D 4.85 4.95
E 5.90 6.10
E1 3.85 3.95
e 1.27 Typ
h - 0.35
L 0.62 0.82
All Dimensions in mm
(2) Package Type: MSOP-8EP
D
x
E
E2
y
1
A
e
A1
D
AP2145/ AP2155
Document number: DS32031 Rev. 3 - 2
8Xb
A3
A2
D1
E3
E1
Gauge Plane
Seating Plane
See Detail C
4
0.25
4
X
1
0
°
Detail C
c
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X
1
0
°
a
L
Dim Min Max Typ
A - 1.10 A1 0.05 0.15 0.10
A2 0.75 0.95 0.86
A3 0.29 0.49 0.39
b 0.22 0.38 0.30
c 0.08 0.23 0.15
D 2.90 3.10 3.00
D1 1.60 2.00 1.80
E 4.70 5.10 4.90
E1 2.90 3.10 3.00
E2 1.30 1.70 1.50
E3 2.85 3.05 2.95
e - - 0.65
L 0.40 0.80 0.60
a 0° 8° 4°
x - - 0.750
y - - 0.750
All Dimensions in mm
SO-8
0 8
MSOP-8EP
© Diodes Incorporated
March 2013
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
(1) Package Type: SO-8
X
C1
C2
Dimensions Value (in mm)
X 0.60
Y 1.55
C1 5.4
C2 1.27
Y
(2) Package Type: MSOP-8EP
X C
G
Y2
AP2145/ AP2155
Document number: DS32031 Rev. 3 - 2
X1
Y
Y1
Dimensions
C 0.650
G 0.450
X 0.450
X1 2.000
Y 1.350
Y1 1.700
Y2 5.300
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Value
(in mm)
AP2145/ AP2155
March 2013
© Diodes Incorporated
AP2145/ AP2155
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INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
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all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorize d application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
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This document is written in English but may be translated into multiple languages for reference. Onl y the English version of this document is the
final and determinative format released by Diodes Incorporated.
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2013, Diodes Incorporated
www.diodes.com
IMPORTANT NOTICE
LIFE SUPPORT
AP2145/ AP2155
Document number: DS32031 Rev. 3 - 2
13 of 13
www.diodes.com
March 2013
© Diodes Incorporated
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