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AP2145
User Manual
13 pgs451.71 Kb0

Diodes AP2145, AP2155 User Manual

8
Green
Description
The AP2145 and AP2155 are integrated high-side power switches optimized for Universal Serial Bus (USB) and other hot-swap applications. The family of devices complies with USB 2.0 and available with both polarities of Enable input. They offer current and thermal limiting and short circuit protection as well as controlled rise time and under-voltage lockout functionality. A 7ms deglitch capability on the open-drain Flag output prevents false over-current reporting and does not require any external components.
All devices are available in SO-8 and MSOP-8EP packages.
Features
Single USB Port Power Switches Over-Current and Thermal Protection 0.8A Accurate Current Limiting Reverse Current Blocking 90m On-Resistance Input Voltage Range: 2.7V - 5.5V 0.6ms Typical Rise Time Very Low Shutdown Current: 1µA (max) Fault Report (FLG) with Blanking Time (7ms typ) ESD Protection: 6kV HBM, 400V MM Active High (AP2155) or Active Low (AP2145) Enable Ambient Temperature Range -40°C to +85°C SO-8 and MSOP-8EP (Exposed Pad): Available in “Green”
Molding Compound (No Br, Sb)
Lead-Free Finish; RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)  UL Recognized, File Number E322375  IEC60950-1 CB Scheme Certified
Notes: 1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.
Pin Assignments
SO-
1
EN
FLG
2
3
GND
4
NC
(Top View)
MSOP-8EP
1
EN
2
FLG
NC
3 4
(Top View)
GND
Applications
Consumer electronics – LCD TV & Monitor, Game Machines  Communications – Set-Top-Box, GPS, Smartphone  Computing – Laptop, Desktop, Servers, Printers, Docking Station,
HUB
AP2145/ AP2155
8
OUT
7
6
OUT
5
NC
8 7 6
5
IN
OUT IN OUT NC
Typical Applications Circuit
Power Supply
IN
2.7V t o 5. 5V
10k
10uF
0.1uF
FLG
EN
ON
OFF
AP2145/ AP2155
Document number: DS32031 Rev. 3 - 2
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GND
OUT
0.1uF 120uF
Load
March 2013
© Diodes Incorporated
Available Options
Part Number Channel
AP2145 1 Active Low 0.8A 0.5A AP2155 1 Active High 0.8A 0.5A
Enable Pin
(EN)
Current Limit
(typ)
Recommended Maximum Continuous Load Current
Pin Descriptions
Pin Name
Pin Number
SO-8 MSOP-8EP
Function
EN 1 1 Enable input, active low (AP2145) or active high (AP2155)
FLG 2 2 Over-current and over-temperature fault report; open-drain flag is active low w hen triggered.
GND 3 3 Ground
NC
OUT
IN
4, 5 4, 5 No internal connection 6, 8 6, 8 Voltage output pin (all OUT pins mu st be tied toge ther externally )
7 7 Voltage input pin
Exposed Pad:
Exposed Pad — Exposed Pad
It should be externally connected to GND plane and thermal mass for enhanced thermal impedance.
It should not be used as electrical ground conduction path.
Functional Block Diagram
AP2145/ AP2155
AP2145, AP2155
Current
Sense
Current
Limit
Deglitch
GND
EN
IN
UVLO
Driver
Thermal
Sense
Absolute Maximum Ratings (@T
= +25°C, unless otherwise specified.)
A
Symbol Parameter Ratings Unit
ESD HBM Human Body Model ESD Protection 6 kV
ESD MM Machine Model ESD Protection 400 V
VIN
V
OUT
V
EN , VFLG
T
I
LOAD J(MAX)
TST
Caution: Stresses greater than the 'Absolute Maximum Ratings' specified above, may cause permanent damage to the device. These are stress ratings only; functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability may be affected by exposure to absolute maximum rating conditions for extended periods of time. Semiconductor devices are ESD sensitive and may be damaged by exposure to ESD events. Suitable ESD precautions should be taken when handling and transporting these devices
Note: 4. UL Recognized Rating from -30°C to +70°C (Diodes qualified T
AP2145/ AP2155
Document number: DS32031 Rev. 3 - 2
Input Voltage 6.5 V Output Voltage
VIN +0.3
V Enable Voltage 6.5 V Maximum Continuous Load Current Internal Limited A Maximum Junction Temperature 150 °C Storage Temperature Range (Note 4) -65 to +150 °C
from -65°C to +150°C)
ST
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OUT
FLG
March 2013
© Diodes Incorporated
AP2145/ AP2155
Recommended Operating Conditions (@T
= +25°C, unless otherwise specified.)
A
Symbol Parameter Min Max Unit
V
I
OUT
VIL
VIH
T
IN
A
Input voltage 2.7 5.5 V Output Current 0 500 mA EN Input Logic Low Voltage 0 0.8 V EN Input Logic High Voltage 2.0
VIN
Operating Ambient Temperature -40 85
V
C
Electrical Characteristics (@T
= +25°C, VIN = +5.0V, unless otherwise specified.)
A
Symbol Parameter Test Conditions Min Typ. Max Unit
V
I
SHDN
I
I
R
DS(ON)
I
SHORT
I I
T
SHORT
I
I
O-LEAK
T
T
D(OFF)
R
I
T
BlLANK
T
T
Notes: 5. Test condition for SO-8: Device mounted on FR-4, 2oz copper, with minimum recommended pad layout.
6. Test condition for MSOP-8EP: Device mounted on 2” x 2” FR-4 substrate PC board, 2oz copper, with minimum recommended pad on top layer and thermal vias to bottom layer ground plane.
Input UVLO
UVLO
R
LOAD
= 1k Input Shutdown Current Disabled, OUT = open 0.5 1 µA Input Quiescent Current Enabled, OUT = open 45 70 µA
I
Q
Input Leakage Current Disabled, OUT grounded -1 1 µA
LEAK
Reverse Leakage Current
REV
Switch On-Resistance
Short-Circuit Current Limit Over-Load Current Limit
LIMIT
Current Limiting Trigger Threshold
TRIG
Short-Circuit Response Time EN Input Logic Low Voltage
V
IL
EN Input Logic High Voltage
V
IH
EN Input Leakage
SINK
Output Leakage Current Disabled 1 µA Output Turn-On Delay Time
D(ON)
Output Turn-On Rise Time
TR
Output Turn-Off Delay Time Output Turn-Off Fall Time
TF
FLG Output FET On-Resistance
FLG
FLG Leakage Current
FLG
FLG Blanking Time Thermal Shutdown Threshold
SHDN
Thermal Shutdown Hysteresis 25
HYS
Thermal Resistance Junction-to-
JA
Ambient
Disabled, VIN= 0V, V
= 5V, I
V
IN
VIN = 3.3V, I
= 0.5A, -40°C  TA  +85°C
OUT
OUT
Enabled into short circuit, C V
= 5V, V
IN
-40°C T
OUT
+85°C
A
= 4.5V, C
Output Current Slew rate (<100A/s), C V
= 0V to I
OUT
C
= 100µF
L
V
= 2.7V to 5.5V
IN
V
= 2.7V to 5.5V
IN
= 5V
V
EN
CL = 1µF, R CL = 1µF, R CL = 1µF, R CL = 1µF, R
= 3.3V or 5V, C
V
IN
V
= 5V
FLG
OUT
LOAD LOAD LOAD LOAD
VIN = 3.3V or 5V, C Enabled, R
LOAD
OUT
= 5V, I
REV
at VIN
= 0.5A, -40°C  TA  +85°C
=10µF, CL = 100µF
IN
=10µF, CL = 100µF,
IN
= 10µF, CL = 22µF
IN
= I
(short applied to output),
LIMIT
= 10 = 10 = 10 = 10
= 10µF, I
IN
= 10µF, CL = 100µF
IN
= 10mA
FLG
= 1k
MSOP-8EP 90 140 m SO-8 95 140 m
SO-8 (Note 5) 110 MSOP-8EP (Note 6) 60
1.6 1.9 2.5 V
1 µA
120 160 m
0.7 A
0.6 0.8 1.0 A
1.0 A 10 µs
0.8 V
2 V
1 µA
0.05 ms
0.6 1.5 ms
0.01 ms
0.05 0.1 ms 20 40 1 µA
4 7 15 ms
135
C
C C/W C/W
AP2145/ AP2155
Document number: DS32031 Rev. 3 - 2
3 of 13
www.diodes.com
March 2013
© Diodes Incorporated
Typical Performance Characteristics
AP2145/ AP2155
Ven 5V/div
Vout 2V/div
V
EN
V
OUT
50%
T
D(ON)
T
10%
50%
T
R
90%
D(OFF)
90%
10%
T
F
V
EN
50%
T
T
D(ON)
V
OUT
10%
50%
T
R
90%
D(OFF)
90%
10%
T
F
Figure 1. Voltage Waveforms: AP2145 (left), AP2155 (right)
All Enable Plots are for AP2155 Active High
Turn-On Delay and Rise Time
500µs/div
CL=1µF TA= +25°C RL=10
Ven 5V/div
Vout 2V/div
Turn-Off Delay and Fall Time
CL=1µF TA= +25°C RL=10
500µs/div
Turn-On Delay and Rise Time
Turn-Off Delay and Fall Time
Ven 5V/div
Vout 2V/div
AP2145/ AP2155
Document number: DS32031 Rev. 3 - 2
500µs/div
CL=100µF TA= +25°C RL=10
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Ven 5V/div
Vout 2V/div
500µs/div
CL=100µF TA= +25°C RL=10
March 2013
© Diodes Incorporated
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