Page 1
T
AP2101/AP2111
2A SINGLE CHANNEL CURRENT-LIMITED POWER SWITCH
Description
The AP2101 and AP2111 are integrated high-side power switches
optimized for Universal Serial Bus (USB) and other hot-swap
applications. The family of devices complies with USB 2.0 and
available with both polarities of Enable input. They offer current and
thermal limiting and short circuit protection as well as controlled rise
time, under-voltage lockout and auto-discharge functionalities. A
7ms deglitch capability on the open-drain Flag output prevents false
over-current reporting and does not require any external components.
All devices are available in SO-8 and MSOP-8EP packages.
Features
• Single USB port power switches with auto-discharge
• Short-circuit current and thermal protection
• 2.45A accurate current limiting
• Fast transient response time: 5s
• 90m
• Reverse Current Blocking
• Input voltage range: 2.7V – 5.5V
• 0.6ms typical rise time
• Very low shutdown current: 1A (max)
• Fault report (FLG) with blanking time (7ms typ)
• ESD protection: 4kV HBM, 300V MM
• Active low (AP2101) or active high (AP2111) enable
• Ambient temperature range: -35°C to 85°C
• SO-8 and MSOP-8EP (Exposed Pad): Available in “Green”
• UL Recognized, File Number E322375
• IEC60950-1 CB Scheme Certified
Notes: 1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied.
2. See http://www.diodes.com for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.
on-resistance
Molding Compound (No Br, Sb)
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
Pin Assignments
( Top View )
GND
IN
IN
EN
GND
IN
IN
EN
1
2
3
4
SO-8
( Top View )
1
2
3
4
MSOP-8EP
8
NC
7
OUT
6
OU
5
FLG
NC
8
7
OUT
6
OUT
5
FLG
Applications
• Consumer electronics – LCD TV & Monitor, Game Machines
• Communications – Set-Top-Box, GPS, Smartphone
• Computing – Laptop, Desktop, Servers, Printers, Docking Station,
HUB
Typical Applications Circuit
AP2111 Enable Active High
Power Supply
2.7V to 5.5V
10k
OFF
10uF
ON
0.1uF
IN
FLG
EN
GND
OUT
0.1uF
120uF
Load
AP2101/AP2111
Document number: DS32015 Rev. 3 - 2
1 of 14
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January 2013
© Diodes Incorporated
Page 2
AP2101/AP2111
Available Options
Part Number Channel
Enable Pin
(EN)
AP2101 1 Active Low 2.45A 2.0A
AP2111 1 Active High 2.45A 2.0A
Current Limit
(Typical)
Recommended Maximum
Continuous Load Current
Pin Descriptions
Pin
Name
Pin Number
SO-8 MSOP-8EP
Functions
GND 1 1 Ground
IN
2, 3 2, 3 Voltage input pin (all IN pins must be tied together externally)
EN 4 4 Enable input, active low (AP2101) or active high (AP2111)
FLG 5 5 Over-current and over-temperature fault report; open-drain flag is active low when triggered
OUT
NC
6, 7 6, 7 Voltage output pin (all OUT pins must be tied together externally)
8 8 No internal connection; recommend tie to OUT pins
Exposed pad.
Exposed tab — Exposed tab
It should be connected to GND and thermal mass for enhanced thermal impedance.
It should not be used as electrical ground conduction path.
Functional Block Diagram
IN
UVLO
EN
Absolute Maximum Ratings (@T
Current
Sense
Driver
Thermal
Sense
= +25°C, unless otherwise specified.)
A
Current
Limit
Discharge
Control
Deglitch
OUT
FLG
GND
Symbol Parameter Ratings Units
ESD HBM Human Body Model ESD Protection 4 kV
ESD MM Machine Model ESD Protection 300 V
VIN
V
OUT
V
EN , VFLG
T
I
LOAD
J(MAX)
TST
Caution: Stresses greater than the 'Absolute Maximum Ratings' specified above, may cause permanent damage to the device. These are stress ratings only;
Semiconductor devices are ESD sensitive and may be damaged by exposure to ESD events. Suitable ESD precautions should be taken when handling
and transporting these devices
Note: 4. UL Recognized Rating from -30°C to 70°C (Diodes qualified
functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability may be
affected by exposure to absolute maximum rating conditions for extended periods of time.
Input Voltage 6.5 V
Output Voltage
VIN +0.3
V
Enable Voltage 6.5 V
Maximum Continuous Load Current Internal Limited A
Maximum Junction Temperature 150 °C
Storage Temperature Range (Note 4) -65 to +150 °C
T
from -65°C to 150°C)
ST
AP2101/AP2111
Document number: DS32015 Rev. 3 - 2
2 of 14
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January 2013
© Diodes Incorporated
Page 3
AP2101/AP2111
Recommended Operating Conditions (@T
= +25°C, unless otherwise specified.)
A
Symbol Parameter Min Max Units
V
I
OUT
T
VIL
VIH
IN
A
Input voltage 2.7 5.5 V
Output Current 0 2.0 A
Operating Ambient Temperature -35 85
°C
EN Input Logic Low Voltage 0 0.8 V
EN Input Logic High Voltage 2
VIN
V
Electrical Characteristics (@T
= +25°C, VIN = +5.0V, unless otherwise specified.)
A
Symbol Parameter Test Conditions (Note 5) Min Typ Max Unit
V
UVLO
I
SHDN
I
LEAK
I
REV
R
DS(ON)
I
LIMIT
I
TRIG
I
SHORT
T
SHORT
V
V
I
SINK
T
D(ON)
T
D(OFF)
R
T
BLANK
R
T
SHDN
T
JA
Notes: 5. Pulse-testing techniques maintain junction temperature close to ambient temperature; thermal effects must be taken into account separately.
6. The discharge function is active when the device is disabled (when enable is de-asserted). The discharge function offers a resistive discharge path for
the external storage capacitor. This is suitable only to discharge filter capacitors for limited time and cannot dissipate steady state currents greater than
8mA.
7. Test condition for SO-8: Device mounted on FR-4, 2oz copper, with minimum recommended pad layout.
8. Test condition for MSOP-8EP: Device mounted on 2” x 2” FR-4 substrate PC board, 2oz copper, with minimum recommended pad on top layer and
thermal vias to bottom layer ground plane.
Input UVLO
Input Shutdown Current
Input Quiescent Current
I
Q
R
= 1k
LOAD
Disabled, I
Enabled, I
OUT
OUT
= 0
= 0
Input Leakage Current Disabled, OUT grounded 1 µA
Reverse Leakage Current
Switch On-Resistance
Over-Load Current Limit
Current Limiting Trigger Threshold
Short-Circuit Current Limit
Short-Circuit Response Time
EN Input Logic Low Voltage
IL
EN Input Logic High Voltage
IH
EN Input leakage
Output Turn-On Delay Time
Output Turn-On Rise Time
TR
Output Turn-Off Delay Time
Output Turn-Off Fall Time
TF
FLG Output FET On-Resistance
FLG
FLG Blanking Time
Discharge Resistance (Note 6)
DIS
Thermal Shutdown Threshold
Thermal Shutdown Hysteresis 25
HYS
Thermal Resistance Junction-toAmbient
Disabled, V
= 5V, I
V
IN
IN
OUT
= 0V, V
= 1.5A
OUT
= 5V, I
T
A
at VIN
REV
= +25°C
MSOP8-EP 90 115
SO-8 95 115
-40°C TA +85°C
= 25°C
T
VIN = 3.3V, I
V
= 5V, V
IN
= 1.5A
OUT
= 4.5V, CL=120µF
OUT
A
-40°C T
+85°C
A
Output Current Slew rate (<100A/s) , CL = 100µF
Enabled into short circuit, CL = 100µF
V
= 0V to I
OUT
V
= 2.7V to 5.5V
IN
V
= 2.7V to 5.5V
IN
V
= 5V
EN
CL = 1µF, R
CL = 1µF, R
CL = 1µF, R
CL = 1µF, R
I
=10mA, CL=100µF
FLG
C
= 10µF, CL = 100µF
IN
VIN = 5V, disabled, I
Enabled, R
LOAD
LOAD
LOAD
LOAD
LOAD
OUT
= 1k
= I
(short applied to output)
LIMIT
= 10
= 10
= 10
= 10
= 1mA
OUT
SO-8 (Note 7) 110
MSOP-8EP (Note 8) 60
1.6 1.9 2.5 V
0.5 1 µA
45 70 µA
0.05 µA
140
m
115 140
170
2.1 2.45 2.8 A
2.5 A
2.5 A
5 µs
0.8 V
2 V
1 µA
50 µs
0.6 1.5 ms
4 µs
0.03 0.1 ms
20 40
4 7 15 ms
290
140
°C
°C
°C/W
°C/W
AP2101/AP2111
Document number: DS32015 Rev. 3 - 2
3 of 14
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January 2013
© Diodes Incorporated
Page 4
Typical Performance Characteristics
AP2101/AP2111
Ven
5V/div
Vout
2V/div
V
EN
V
OUT
50%
T
D(ON)
T
10%
50%
T
R
90%
D(OFF)
90%
10%
T
F
V
EN
50%
T
T
D(ON)
V
OUT
10%
50%
T
R
90%
D(OFF)
90%
10%
T
F
Figure 1. Voltage Waveforms: AP2101 (left), AP2111 (right)
All Enable Plots are for AP2111 Active High
Turn-On Delay and Rise Time
CL = 1µF
TA = +25°C
RL = 5
Ven
5V/div
Vout
2V/div
Turn-Off Delay and Fall Time
CL = 1µF
TA = 25°C
RL = 5
400µs/div
400µs/div
Ven
5V/div
Vout
2V/div
Turn-On Delay and Rise Time
400µs/div
CL = 100µF
TA = +25°C
RL = 5
Ven
5V/div
Vout
2V/div
Turn-Off Delay and Fall Time
CL = 100µF
TA = +25°C
RL = 5
400µs/div
AP2101/AP2111
Document number: DS32015 Rev. 3 - 2
4 of 14
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© Diodes Incorporated
Page 5
Typical Performance Characteristics (cont.)
Short Circuit Current,
Device Enabled Into Short
AP2101/AP2111
Inrush Current
Ven
5V/div
Iout
500mA/div
Vflag
5V/div
Iout
1A/div
V
IN
TA = +25°C
CL = 100µF
500us/div
0.6 Ω Load Connected to Enabled Device
V
IN
TA = +25°C
CL = 100µF
= 5V
= 5V
Ven
5V/div
CL=100µF
Iout
500mA/div
CL=220µF
CL=470µF
1ms/div
Short Circuit with Blanking Time and Recovery
Vout
5V/div
Vflag
5V/div
Iout
2A/div
V
= 5V
IN
= +25°C
T
A
R
= 2.5
L
V
= 5V
IN
TA = +25°C
CL = 100µF
Power On
Vflag
5V/div
Iout
1A/div
Vin
5V/div
Vout
5V/div
AP2101/AP2111
Document number: DS32015 Rev. 3 - 2
2ms/div
50ms/div
Power Off
TA = +25°C
CL = 100µF
RL = 2.5
1ms/div
TA = +25°C
CL = 100µF
RL = 2.5
Vflag
5V/div
Iout
1A/div
Vin
5V/div
Vout
5V/div
10ms/div
5 of 14
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Page 6
Typical Performance Characteristics (cont.)
Vflag
5V/div
Iout
1A/div
Ven
5V/div
Device Enabled
V
= 5V
IN
TA = +25°C
CL = 100µF
RL = 2.5
Vflag
5V/div
Iout
1A/div
Ven
5V/div
Device Disabled
AP2101/AP2111
V
= 5V
IN
TA = +25°C
CL = 100µF
RL = 2.5
Vout
5V/div
Vin
2V/div
Iout
500mA/div
850
750
650
550
1ms/div
UVLO Increasing
1ms/div
Turn-On Time vs Input Voltage
TA = +25°C
CL = 100µF
RL = 2.5
Vout
5V/div
Vin
2V/div
Iout
500mA/div
55
50
45
40
1ms/div
UVLO Decreasing
10ms/div
Turn-Off Time vs Input Voltage
TA = +25°C
CL = 100µF
RL = 2.5
CL = 1µF
RL = 10
=+
°
450
Turn-On Time (us)
350
250
1.5 2 2.5 3 3.5 4 4.5 5 5.5 6
AP2101/AP2111
Document number: DS32015 Rev. 3 - 2
Input Voltage (V)
CL = 1µF
RL = 10
=+
°
6 of 14
www.diodes.com
35
Turn-Off Time (us)
30
25
1.5 2 2.5 3 3.5 4 4.5 5 5.5 6
Input Voltage (V)
© Diodes Incorporated
January 2013
Page 7
Typical Performance Characteristics (cont.)
Rise Time vs Input Voltage
650
600
550
500
450
Rise Time (us)
400
350
300
22.533.544.555.56
Input Voltage (V)
CL = 1µF
RL = 10
TA = +25°C
AP2101/AP2111
Fall Time vs Input Voltage
25
24
23
22
Fall Time (us)
21
20
19
22.533.544.555.56
Input Voltage (V)
CL = 1µF
RL = 10
=+
°
Supply Current, Output Enabled vs Ambient Temperature
52
47
Vin=5.5V
42
37
32
Supply Current, O utput Enabled (uA)
27
-60 -40 -20 0 20 40 60 80 100
Ambient Temperature (°C)
Vin=5.0V
Vin=3.3V
Static Drain-Source On-State Resistance vs Ambient
140
130
120
110
100
Resistan ce (mΩ)
90
80
Static Drain-Source On-St ate
70
-60 -40 -20 0 20 40 60 80 100
Temperature
Vin=3.3V
Vin=5.0V
Ambient Temperature (°C)
Supply Current, Output Disabled vs Ambient Temperature
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
Supply Current, O utput Disabled (uA)
0.0
-60 -40 -20 0 20 40 60 80 100
Short-Circuit Output Current vs Ambient Temperature
2.70
2.65
CL = 120µF
2.60
2.55
2.50
2.45
2.40
2.35
Short-Circuit Output Current (A)
2.30
-60 -40 -20 0 20 40 60 80 100
Vin=5.0V
Vin=3.3V
Ambient Temperature (°C)
Vin=3.3V
Ambient Temperature (°C)
Vin=5.5V
Vin=5.0V
AP2101/AP2111
Document number: DS32015 Rev. 3 - 2
7 of 14
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© Diodes Incorporated
Page 8
Typical Performance Characteristics (cont.)
Undervoltage Lockout vs Ambient Temperature
2.15
2.10
2.05
2.00
1.95
Undervoltage Lockout (V)
1.90
-60 -40 -20 0 20 40 60 80 100
UVLO Rising
UVLO Falling
Ambient Temperature (°C)
AP2101/AP2111
Threshold Trip Current vs Input Voltage
3.24
3.22
3.20
3.18
3.16
3.14
3.12
Threshold Trip Current (A)
3.10
3.08
2.8 3.3 3.8 4.3 4.8 5.3
Input Voltage (V)
TA = +25°C
CL = 68µF
Current Limit Response vs Peak Current
45
40
35
30
25
20
15
10
Current Limit Response (us)
5
0
024681012
Peak C urre nt (A)
V
= 5V
IN
TA = +25°C
AP2101/AP2111
Document number: DS32015 Rev. 3 - 2
8 of 14
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January 2013
© Diodes Incorporated
Page 9
AP2101/AP2111
Application Information
Power Supply Considerations
A 0.1-F to 1-F X7R or X5R ceramic bypass capacitor between IN and GND, close to the device, is recommended. Placing a high-value
electrolytic capacitor on the input (10-F minimum) and output pin(s) is recommended when the output load is heavy. This precaution reduces
power-supply transients that may cause ringing on the input. Additionally, bypassing the output with a 0.01-F to 0.1-F ceramic capacitor
improves the immunity of the device to short-circuit transients.
Over-Current and Short Circuit Protection
An internal sensing FET is employed to check for over-current conditions. Unlike current-sense resistors, sense FETs do not increase the series
resistance of the current path. When an overcurrent condition is detected, the device maintains a constant output current and reduces the output
voltage accordingly. Complete shutdown occurs only if the fault stays long enough to activate thermal limiting.
Three possible overload conditions can occur. In the first condition, the output has been shorted to GND before the device is enabled or before
VIN has been applied. The AP2101/AP2111 senses the short circuit and immediately clamps output current to a certain safe level namely I
LIMIT
.
In the second condition, an output short or an overload occurs while the device is enabled. At the instance the overload occurs, higher current
may flow for a very short period of time before the current limit function can react. After the current limit function has tripped (reached the over-
current trip threshold), the device switches into current limiting mode and the current is clamped at I
LIMIT
.
In the third condition, the load has been gradually increased beyond the recommended operating current. The current is permitted to rise until the
current-limit threshold (I
) is reached or until the thermal limit of the device is exceeded. The AP2101/AP2111 is capable of delivering current
TRIG
up to the current-limit threshold without damaging the device. Once the threshold has been reached, the device switches into its current limiting
mode and is set at I
LIMIT
.
To protect against short circuit to GND at extremely low temperature (< -30°C), a minimum 120-F electrolytic capacitor on the output pin is
recommended. A correct capacitor type with capacitor voltage rating and temperature characteristics must be properly chosen so that
capacitance value does not drop too low at the extremely low temperature operation. A recommended capacitor should have temperature
characteristics of less than 10% variation of capacitance change when operated at extremely low temp. Our recommended aluminum electrolytic
capacitor type is Panasonic FC series.
At low input voltage condition (V
< 3V), the short circuit protection current may rise as high as twice the typical value.
IN
FLG Response
When an over-current or over-temperature shutdown condition is encountered, the FLG open-drain output goes active low after a nominal 7-ms
deglitch timeout. The FLG output remains low until both over-current and over-temperature conditions are removed. Connecting a heavy
capacitive load to the output of the device can cause a momentary over-current condition, which does not trigger the FLG due to the 7-ms deglitch
timeout. The AP2101/AP2111 is designed to eliminate false over-current reporting without the need of external components to remove unwanted
pulses.
Power Dissipation and Junction Temperature
The low on-resistance of the internal MOSFET allows the small surface-mount packages to pass large current. Using the maximum operating
ambient temperature (T
= R
P
D
DS(ON)
Finally, calculate the junction temperature:
T
= PD x R
J
Where:
T
= Ambient temperature °C
A
R
= Thermal resistance
JA
θ
P
= Total power dissipation
D
AP2101/AP2111
Document number: DS32015 Rev. 3 - 2
θ
× I
JA
A
2
+ TA
) and R
, the power dissipation can be calculated by:
DS(ON)
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January 2013
© Diodes Incorporated
Page 10
AP2101/AP2111
Application Information (cont.)
Thermal Protection
Thermal protection prevents the IC from damage when heavy-overload or short-circuit faults are present for extended periods of time. The
AP2101/AP2111 implements a thermal sensing to monitor the operating junction temperature of the power distribution switch. Once the die
temperature rises to approximately 140°C due to excessive power dissipation in an over-current or short-circuit condition the internal thermal
sense circuitry turns the power switch off, thus preventing the power switch from damage. Hysteresis is built into the thermal sense circuit allowing
the device to cool down approximately 25°C before the switch turns back on. The switch continues to cycle in this manner until the load fault or
input power is removed. The FLG open-drain output is asserted when an over-temperature shutdown or over-current occurs with 7-ms deglitch.
Under-Voltage Lockout (UVLO)
Under-voltage lockout function (UVLO) keeps the internal power switch from being turned on until the power supply has reached at least 1.9V,
even if the switch is enabled. Whenever the input voltage falls below approximately 1.9V, the power switch is quickly turned off. This facilitates the
design of hot-insertion systems where it is not possible to turn off the power switch before input power is removed.
Host/Self-Powered HUBs
Hosts and self-powered hubs (SPH) have a local power supply that powers the embedded functions and the downstream ports. This power supply
must provide from 5.25V to 4.75V to the board side of the downstream connection under both full-load and no-load conditions. Hosts and SPHs
are required to have current-limit protection and must report over-current conditions to the USB controller. Typical SPHs are desktop PCs,
monitors, printers, and stand-alone hubs.
Generic Hot-Plug Applications
In many applications it may be necessary to remove modules or pc boards while the main unit is still operating. These are considered hot-plug
applications. Such implementations require the control of current surges seen by the main power supply and the card being inserted. The most
effective way to control these surges is to limit and slowly ramp the current and voltage being applied to the card, similar to the way in which a
power supply normally turns on. Due to the controlled rise times and fall times of the AP2101/AP2111, these devices can be used to provide a
softer start-up to devices being hot-plugged into a powered system. The UVLO feature of the AP2101/AP2111 also ensures that the switch is off
after the card has been removed, and that the switch is off during the next insertion.
By placing the AP2101/AP2111 between the VCC input and the rest of the circuitry, the input power reaches these devices first after insertion.
The typical rise time of the switch is approximately 1ms, providing a slow voltage ramp at the output of the device. This implementation controls
system surge current and provides a hot-plugging mechanism for any device.
AP2101/AP2111
Document number: DS32015 Rev. 3 - 2
10 of 14
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© Diodes Incorporated
Page 11
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G-13
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S
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Packagi
SO-8
MSOP-8
( To
g
P
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AP2101/
13” Tape a
Quantit
2500/Tape &
2500/Tape &
Reel
Reel
d Reel
Part Num
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-1
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P2111
Par
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7 :
Logo
Numbe
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AP2
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Pa
6 :
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AP21
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Document numbe
111
: DS32015 Rev. 3
- 2
Y
W X E
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ww.diodes.co
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MSOP-8-E
Y : Year : 0
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A~Z : 27~5
52 and 53
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a~z : 1~26 we
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© Diodes Incorporat
January 201
3
d
Page 12
Package Outline Dimensions (All dimensions in mm.)
Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.
(1) SO-8
(2) MSOP-8EP
e
D
D
b
E1
A2
E
A1
Detail ‘A’
h
°
45
A3
A
L
0.254
Gauge Plane
Seating Plane
7°~9
°
Detail ‘A’
AP2101/AP2111
Document number: DS32015 Rev. 3 - 2
x
y
1
e
A1
A
D
E
8Xb
A2
E2
A3
D1
E3
E1
Gauge Plane
Seating Plane
See Detail C
0.25
4
X
1
c
4
X
1
0
°
0
°
L
Detail C
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a
AP2101/AP2111
Dim Min Max
Dim Min Max Typ
A - 1.10 A1 0.05 0.15 0.10
A2 0.75 0.95 0.86
A3 0.29 0.49 0.39
b 0.22 0.38 0.30
c 0.08 0.23 0.15
D 2.90 3.10 3.00
D1 1.60 2.00 1.80
E 4.70 5.10 4.90
E1 2.90 3.10 3.00
E2 1.30 1.70 1.50
E3 2.85 3.05 2.95
e - - 0.65
L 0.40 0.80 0.60
a 0° 8° 4°
x - - 0.750
y - - 0.750
All Dimensions in mm
SO-8
A - 1.75
A1 0.10 0.20
A2 1.30 1.50
A3 0.15 0.25
b 0.3 0.5
D 4.85 4.95
E 5.90 6.10
E1 3.85 3.95
e 1.27 Typ
h - 0.35
L 0.62 0.82
0° 8°
θ
All Dimensions in mm
MSOP-8EP
January 2013
© Diodes Incorporated
Page 13
Suggested Pad Layout
Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.
(1) SO-8
X
C2
Y
(2) MSOP-8-EP
AP2101/AP2111
Document number: DS32015 Rev. 3 - 2
G
Y2
C1
X C
Y
Y1
X1
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Dimensions Value (in mm)
X 0.60
Y 1.55
C1 5.4
C2 1.27
Dimensions
C 0.650
G 0.450
X 0.450
X1 2.000
Y 1.350
Y1 1.700
Y2 5.300
Value
(in mm)
AP2101/AP2111
January 2013
© Diodes Incorporated
Page 14
AP2101/AP2111
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www.diodes.com
IMPORTANT NOTICE
LIFE SUPPORT
AP2101/AP2111
Document number: DS32015 Rev. 3 - 2
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January 2013
© Diodes Incorporated
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