AP1534 consists of step-down switching regulator with PWM
control. These devices include a reference voltage source,
oscillation circuit, error amplifier, internal PMOS.
AP1534 provides low-ripple power, high efficiency, and
excellent transient characteristics. The PWM control circuit is
able to vary the duty ratio linearly from 0 up to 99%. This
converter also contains an error amplifier circuit as well as a
soft-start circuit that prevents overshoot at startup. An
enable function, an over current protect function and a short
circuit protect function are built inside, and when OCP or
SCP happens, the operation frequency will be reduced from
300KHz to 50KHz. Also, an internal compensation block is
built in to minimize external component count.
With the addition of an internal P-channel Power MOS, a
coil, capacitors, and a diode connected externally, these ICs
can function as step-down switching regulators. They serve
as ideal power supply units for portable devices when
coupled with the SO-8 mini-packages, providing such
outstanding features as low current consumption. Since this
converter can accommodate an input voltage up to 18V, it is
also suitable for the operation via an AC adapter.
Pin Assignments
1
FB
2
EN
OCSET
3
V
4
CC
(Top View)
AP1534
SO-8
AP1534
V
8
SS
V
7
SS
Output
6
Output
5
Features
• Input voltage: 3.6V to 18V
• Output voltage: 0.8V to V
• Duty ratio: 0% to 99% PWM control
• Oscillation frequency: 300KHz typical
• Current limit, Enable function
• Thermal Shutdown function
• Built-in internal SW P-channel MOS
• SO-8: Available in “Green” Molding Compound
(No Br, Sb)
•Lead Free Finish/RoHS Compliant (Note 1)
Notes: 1. EU Directive 2002/95/EC (RoHS). All applicable RoHS exemptions applied. Please visit our website at
http://www.diodes.com/products/lead_free.html.
CC
Applications
• PC Motherboard
• LCD Monitor
• Graphic Card
• DVD-Video Player
• Telecom Equipment
• ADSL Modem
• Printer and other Peripheral Equipment
• Microprocessor Core Supply
Typical Application Circuit
OCSET
Vcc
OCSET
EN
AP1534
Output
FB
V
SS
V
IN
C
IN
470uF
R
5.6K
CVcc
0.1uF
OCSET
C
Option
R
EN
100K
C
EN
0.1uF
22uH
L1
C
Optional
D1
B240A
(Note 2)
C
R
A
6.8K
R
B
1.3K
V
OUT
+
-
+
C
0.1uF470uF
-
=5V/2A
C
OUT
Notes: 2. Suggested DIODES Power Schottky P/N: B240/B340 series.
OCSET 3 Add an external resistor to set max output current
VCC
Output 5, 6
VSS
4 IC power supply pin
Switch Pin. Connect external inductor/diode here.
Minimize trace area at this pin to reduce EMI
7, 8 GND Pin
Functional Block Diagram
AP1534
Output
Oscillation
Circuit
Vcc
PWM-Switched
Control Circuit
Thermal
Shutdown
EN
EN
Reference Voltage
Source
100uA
OCSET
+
FB
-
VssV
Absolute Maximum Ratings
Symbol Parameter Rating Unit
ESD HBM Human Body Model ESD Protection 4.5 KV
ESD MM Machine Model ESD Protection 150 V
VCC
VFB
VEN
V
OUT
PD
TJ
T
ST
Caution: The absolute maximum ratings are rated values exceeding which the product could suffer physical damage.
These values must therefore not be exceeded under any conditions.
VCC Pin Voltage
Feedback Pin Voltage
EN Pin Voltage
Switch Pin Voltage
Power Dissipation Internally limited mW
Operating Junction Temperature Range -40 to +125
Storage Temperature Range -65 to +150
Notes: 3. Test condition for SO-8: Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
For better thermal performance, larger copper pad for heatsink is needed.
Internal MOSFET R
DS(ON)
EFFI Efficiency
T
SHDN
T
HYS
θ
JA
θ
JC
Input Voltage 3.6 18 V
Output Current 0 2 A
Operating Ambient Temperature -20 85
= 12V, TA = 25°C, unless otherwise specified)
IN
Feedback Voltage
Feedback Bias Current
Switch Current -- 2.0 - - A
Current Consumption During Power Off
Line Regulation
Load Regulation
Oscillation Frequency Measure waveform at SW pin 240 300 400 KHz
Frequency of Current Limit or Short Circuit
Protect
EN Pin Input Voltage
EN Pin Input Leakage Current
OCSET Pin Bias Current -- 75 90 105 µA
DS(ON)
Thermal shutdown threshold - 150 - °C
Thermal shutdown hysteresis - 55 - °C
The AP1534 is a DC/DC converter that employs pulse
width modulation (PWM) scheme. Its pulse width varies
in the range of 0% to 99%, based on the output current
loading. The output ripple voltage caused by the PWM
high frequency switching can easily be reduced through
an output filter. Therefore, this converter provides a low
ripple output supply over a broad range of input voltage &
output current loading.
Under Voltage Lockout
The under voltage lockout circuit of the AP1534 assures
that the high-side MOSFET driver remains in the off state
whenever the supply voltage drops below 3.3V. Normal
operation resumes once V
Current Limit Protection
The current limit threshold is set by external resistor
R
connected from VCC supply to OCSET pin. The
OCSET
internal sink current I
resistor sets the voltage at OCSET pin. When the PWM
voltage is less than the voltage at OCSET, an overcurrent condition is triggered.
The current limit threshold is given by the following
equation:
where,
I×
=Δ
I
is the output peak current; R
PEAK
ON resistance; F
is the PWM frequency (300KHz
S
typical). Also, the inductor value will affect the ripple
current ΔI.
The above equation is recommended for input voltage
range of 5V to 18V. For input voltage lower than 5V or
ambient temperature over 100°C, higher R
recommended.
The recommended minimum R
summarized below:
VIN (V) V
OUT
4 1 6.8K
5 3.3 5.6K
12 5 3.9K
18 12 4.7K
AP1534
Document number: DS31314 Rev. 6 - 2
rises above 3.5V.
CC
(90uA typical) across this
OCSET
×=×
RIRI
OCSETOCSETDS(ON)PEAK
Δ
I)(
+>
II
VV
−
OUTIN
S
LF
×
(V) R
(MAX) OUTPEAK
V
DS (ON)
2
OUT
IN
V
is the MOSFET
OCSET
(Ω)
OCSET
OCSET
value is
PWM CONTROL 2A STEP-DOWN CONVERTER
Inductor Selection
For most designs, the operates with inductors of 22µH to
33µH. The inductor value can be derived from the
following equation:
Where ΔI
inductors lower ripple current and small value inductors
result in high ripple current. Choose inductor ripple
current approximately 15% of the maximum load current
2A, ∆I
should be at least equal to the maximum load current
plus half the ripple current to prevent core saturation
(2A+0.15A).
Input Capacitor Selection
This capacitor should be located close to the IC using
short leads and the voltage rating should be
approximately 1.5 times the maximum input voltage. The
RMS current rating requirement for the input capacitor of
a buck regulator is approximately 1/2 the DC load current.
A low ESR input capacitor sized for maximum RMS
current must be used. A 470µF low ESR capacitor for
most applications is sufficient.
Output Capacitor Selection
The output capacitor is required to filter the output
voltage and provides regulator loop stability. The
important capacitor parameters are the 100KHz
Equivalent Series Resistance (ESR), the RMS ripples
current rating, voltage rating and capacitance value. For
the output capacitor, the ESR value is the most important
parameter. The output ripple can be calculated from the
following formula.
is
www.diodes.com
The bulk capacitor’s ESR will determine the output ripple
voltage and the initial voltage drop after a high slew-rate
transient.
An aluminum electrolytic capacitor's ESR value is related
to the capacitance and its voltage rating. In most case,
higher voltage electrolytic capacitors have lower ESR
values. Most of the time, capacitors with much higher
voltage ratings may be needed to provide the low ESR
values required for low output ripple voltage.
6 of 9
V
V
−
IN
L×
=
f
S
is inductor Ripple Current. Large value
L
=0.3A. The DC current rating of the inductor
L
V×Δ=
RIPPLE
Page 7
Functional Description (cont.)
PWM CONTROL 2A STEP-DOWN CONVERTER
PCB Layout Guide
If you need low TC & TJ or large PD (Power Dissipation), The
dual SW pins (5 & 6) and V
SO-8 package are internally connected to die pad, The
evaluation board should be allowed for maximum copper
area at output (SW) pins.
1. Connect FB circuits (RA, RB, CC) as closely as
possible and keep away from inductor flux for pure
V
.
FB
2. Connect C
possible to get good power filter effect.
3. Connect R
possible.
4. Connect ground side of the CIN & D1 & C
as possible and use ground plane for best performance.
to Vcc and Vss pin as closely as
VCC
to Vcc and OCSET pin as closely as
OCSET
pins(7 & 8)on the
SS
as closely
OUT
Connect FB circuits closer and keep away from L1.
Top Side Layout Guide
AP1534
Bottom Side Layout Guide
Use vias to conduct the heat into the backside of PCB
layer. The heat sink at output (SW) pins should be
allowed for maximum solder-painted area.
Note: 4. Pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS
DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTA BILITY AND FITNESS FOR A
PARTICULAR PURPOSE (AND THEIR EQUIV ALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other
changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability
arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any
license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described
herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies
whose products are represented on Diodes Incorporated website, harml ess against all damages.
Diodes Incorporated does not warrant or accept any li ability whatsoever in respec t of any products purc hased through unauthorized
sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall
indemnify and hold Diodes Incorporated and its representatives harml ess against all claims, damages, expenses, and attorney fees
arising out of, directly or indirectly, any claim of personal inj ury or death ass oci ated with such unintended or unauthorized application.
Products described herein may be covered by one or more United Stat es, international or foreign patents pending. Product names
and markings noted herein may also be covered by one or more United States, international or foreign trademarks.
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without
the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with inst ruct i ons for us e provided
in the labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected
to cause the failure of the life support device or to affect its safety or eff ect i veness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or
systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements
concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems,
notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further,
Customers must fully indemnify Diodes Incorporated and its representatives against any damages arisi ng out of the use of Diodes
Incorporated products in such safety-critical, life support devices or systems.