The AP1506 series are monolithic IC designed for a stepdown DC/DC converter, and own the ability of driving a 3A
load without external transistor. Due to reducing the number
of external components, the board space can be saved easily.
The external shutdown function can be controlled by logic
level and then come into standby mode. The internal
compensation makes feedback control have good line and
load regulation without external design. Regarding protected
function, thermal shutdown is to prevent over temperature
operating from damage, and current limit is to prevent over
current operating of the output switch. If current limit function
occurred and V
frequency will be reduced. The AP1506 series operate at a
switching frequency of 150KHz thus allowing smaller sized
filter components than what would be needed with lower
frequency switching regulators. Other features include a
guaranteed +
input voltage and output load conditions, and +
oscillator frequency. The output version included fixe d 3.3V,
5V, 12V, and an adjustable type. The packages are available
in a standard 5-lead TO263 and TO220.
is down to 0.5V below, the switching
FB
4% tolerance on output voltage under specified
15% on the
Pin Assignments
( Top View )
Metal Tab GND
TO263-5L
( Top View )
TO220-5L/TO220-5L(R)
5 SD
4 FB
3 Gnd
2 Output
1 V
IN
5 SD
4 FB
3 Gnd
2 Output
1 V
IN
Features
Applications
• Output Voltage: 3.3V, 5V, 12V and Adjustable Output
Version
• Adjustable Version Output Voltage Range, 1.23V to
18V+4%
• 150KHz +15% Fixed Switching Frequency
• Voltage Mode Non-Synchronous PWM Control
• Thermal-Shutdown and Current-Limit Protection
• ON/OFF Shutdown Control Input
• Operating Voltage can be up to 22V
• Output Load Current: 3A
• Lead Free packages: TO263-5L and TO220-5L(R)
• TO263-5L and TO220-5L(R): Available in “Green”
Molding Compound (No Br, Sb)
• Low Power standby mode
• Built-in Switching Transistor On Chip
• Lead Free Finish/RoHS Compliant (Note 1)
Notes: 1. EU Directive 2002/95/EC (RoHS). All applicable RoHS exemptions applied. Please visit our website at
This is the positive input supply for the IC switching regulator. A suitable input bypass capacitor must be
presented at this pin to minimize voltage transients and to supply the switching currents needed by the regulator.
Ground
Circuit ground.
Output
Internal switch. The voltage at this pin switches between (+V
of approximately V
/ VIN. To minimize coupling to sensitive circuitry, the PC board copper area connected to
OUT
this pin should be kept to a minimum.
Feedback (FB)
Senses the regulated output voltage to complete the feedback loop.
ON/OFF (SD)
Allows the switching regulator circuit to be shutdown using logic level signals thus dropping the total input supply
current to approximately 150uA. Pulling this pin below a threshold voltage of approximately 1.3V turns the
regulator on, and pulling this pin above 1.3V (up to a maximum of 18V) shuts the regulator down. If this shutdown
feature is not needed, the ON / OFF pin can be wired to the ground pin.
Thermal Considerations
The AP1506 is available in two packages: a 5-pin TO220 and a 5-pin surface mount TO263.
The TO220 package needs a heat sink under most conditions. The size of the heat sink depends on the input
voltage, the output voltage, the load current and the ambient temperature. The AP1506 junction temperature rises
above ambient temperature for a 3A load and different input and output voltages. The data for these curves was
taken with the AP1506 (TO220 package) operating as a buck-switching regulator in an ambient temperature of
o
25
C (still air). These temperature rise numbers are all approximate and there are many factors that can affect
these temperatures. Higher ambient temperatures require more heat sinking.
The TO263 surface mount package tab was designed to be soldering to the copper on a printed circuit board. The
copper and the board are the heat sink for this package and the other heat producing components, such as the
catch diode and inductor. The PC board copper area that the package is soldered to should be at least 0.8 in
and ideally should have 2 or more square inches of 2 oz. Additional copper area improves the thermal
characteristics, but with copper areas greater than approximately 6 in
dissipation are realized. If further thermal improvements are needed, double sided, multi-layer PC board with large
copper areas and/or airflow will be recommended.
The AP1506 (TO263 package) junction temperature rises above ambient temperature with a 2A load for various
input and output voltages. This data was taken with the circuit operating as a buck-switching regulator with all
components mounted on a PC board to simulate the junction temperature under actual operating conditions. This
curve can be used for a quick check for the approximate junction temperature for various conditions, but be aware
that there are many factors that can affect the junction temperature. When load currents higher than 3A are used,
double sided or multi-layer PC boards with large copper areas and/or airflow might be needed, especially for high
ambient temperatures and high output voltages.
For the best thermal performance, wide copper traces and generous amounts of printed circuit board copper
should be used in the board layout (Once exception to this is the output (switch) pin, which should not have large
areas of copper). Large areas of copper provide the best transfer of heat (lower thermal resistance) to the
surrounding air, and moving air lowers the thermal resistance even further.
Package thermal resistance and junction temperature rise numbers are all approximate, and there are many
factors that will affect these numbers. Some of these factors include board size, shape, thickness, position,
location, and even board temperature. Other factors are: trace width, total printed circuit copper area, copper
thickness, single or double-sided, multi-layer board and the amount of solder on the board. The effectiveness of
the PC board to dissipate heat also depends on the size, quantity and spacing of other components on the board,
as well as whether the surrounding air is still or moving. Furthermore, some of these components such as the
catch diode will add heat to the PC board and the heat can vary as the input voltage changes. For the inductor,
depending on the physical size, type of core material and the DC resistance, it could either act as a heat sink
taking heat away from the board, or it could add heat to the board.
AP1506-XXK5L-13 K5 TO263-5L NA NA 800/Tape & Reel -13
AP1506-XXK5G-13 K5 TO263-5L NA NA 800/Tape & Reel -13
AP1506-XXT5L-U T5 TO220-5L 50 -U NA NA
AP1506-XXT5G-U T5 TO220-5L 50 -U NA NA
AP1506-XXT5RL-U T5R TO220-5L(R)50 -U NA NA
AP1506-XXT5RG-U T5R TO220-5L(R)50 -U NA NA
Notes: 4. Pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which can be found on our website at
http://www.diodes.com/datasheets/ap02001.pdf.
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