Diodes AF15N50 User Manual

Page 1
50V N-Channel MOSFET AF15N50
Data Sheet
General Description
This N-Channel MOSFET has been designed specifically to improve the overall efficiency and to minimize switch node ringing of DC-DC converters using either synchronous or conventional switching PWM controllers. It has been optimized for low gate charge, low R diode reverse recovery performance.
The AF15N50 is available in PDFN-5×6-8 package.
, fast switching speed and body
DS(ON)
Features
Typ R
Typ R
• RoHS Compliant
=14.32m @ VGS=10V, ID=15A
DS(ON)
=16.36m @ VGS=4.5V, ID=15A
DS(ON)
Applications
Primary Switch in Isolated DC-DC
• Synchronous Rectifier
• Load Switch
Option 1 Option 2
Figure 1. Package Type of AF15N50
PDFN-5×6-8
Aug. 2013 Rev. 1. 0
BCD Semiconductor Manufacturing Limited
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Data Sheet
50V N-Channel MOSFET AF15N50
Pin Configuration
DNP Package (PDFN-5×6-8)
Option 1 Option 2
Internal Structure
Figure 2. Pin Configuration of AF15N50 (Top View)
Figure 3. Internal Structure of AF15N50
Aug. 2013 Rev. 1. 0
BCD Semiconductor Manufacturing Limited
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Data Sheet
50V N-Channel MOSFET AF15N50
Ordering Information
AF15N50 -
Circuit Type G1: Green
Package DNP:
PDFN-5×6-8 TR: Tape & Reel
Package Part Number Marking ID Packing Type
PDFN-5×6-8 AF15N50DNPTR-G1 15N50DNP-G1 Tape & Reel
BCD Semiconductor's Pb-free products, as designated with "G1" suffix in the part number, are RoHS compliant and green.
Absolute Maximum Ratings (Note 1)
TC=25°C, unless otherwise specified.
Parameter Symbol Value Unit
Drain to Source Voltage VDS 50 V
T
=25ºC 15
Continuous Drain Current ID
Pulsed Drain Current IDM 60 A Gate to Source Voltage VGS ±12 V Power Dissipation PD 31 W
C
TC=100ºC 15
A
Operating T em perature Range TOP -55 to 150 ºC Storage Temperature Range T
Note 1: Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “Recommended Operating Conditions” is not implied. Exposure to “Absolute Maximum Ratings” for extended periods may affect device reliability.
-55 to 150 ºC
STG
Aug. 2013 Rev. 1. 0
BCD Semiconductor Manufacturing Limited
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Data Sheet
50V N-Channel MOSFET AF15N50
Recommended Operating Conditions
Parameter Symbol Condition Value Unit
Thermal Resistance (Note 2) Thermal Resistance
Note 2: Device mounted on FR-4 substrate PC boar d, 2 oz cop pe r, wi t h 1i n ch sq uare pad.
JA
JC
Junction to
Ambient
Junction to Case 4
50
C/W C/W
Electrical Characteristics
TC=25°C, unless otherwise specified.
Static Characteristics
Parameters Symbol Conditions Min Typ Max Unit
Drain to Source Breakdown Voltage
Gate Threshold Voltage V Zero Gate Voltage
Drain Current Gate to Source Leakage Current
Drain to Source On-state Resistance
V
R
VGS=0V, ID=0.25mA 50 V
DSS(BR)
VDS=VGS, ID=0.25mA 0.5 0.9 2 V
GS(TH)
VDS=50V, VGS=0V 1
I
DSS
VGS=10V, VDS=0V ±10
I
GSS
V
=10V, ID=15A 10 14.32 20
GS
DS(ON)
VGS=4.5V, ID=15A 12 16.36 30
Aug. 2013 Rev. 1. 0
BCD Semiconductor Manufacturing Limited
A
A
m
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Data Sheet
50V N-Channel MOSFET AF15N50
Electrical Characteristics (Continued)
TC=25°C, unless otherwise specified.
Dynamic Characteristics
Parameters Symbol Conditions Min Typ Max Unit
V
=0V, VDS=18V,
Input Capacitance C
Output Capacitance C
Reverse Transfer Capacitance
GS
f=1MHz
iss
VGS=0V, VDS=25V, f=1MHz V
=0V, VDS=18V,
GS
f=1MHz
oss
VGS=0V, VDS=25V, f=1MHz V
=0V, VDS=18V,
GS
f=1MHz
C
rss
VGS=0V, VDS=25V, f=1MHz
1350
pF
1316
110
pF
97
95
pF
85
Turn-on Delay Time t Rise Time tr 14.85 Turn-off Delay Time t
d(on)
=10V, ID=15A,
V
GS
=25V, RG=6
V
35.452
d(off)
DD
4.162
ns
Fall Time tf 31.108 Gate to Source Charge Qgs
Gate to Drain Charge (Miller Charger)
Q
gd
=0V to 10V,
V
5.7
GS
=25V, ID=15A
V
DD
3.2
nC
Total Gate Charge Qg 15.2 Gate Resistance Rg 0.85
Aug. 2013 Rev. 1. 0
BCD Semiconductor Manufacturing Limited
Page 6
Data Sheet
50V N-Channel MOSFET AF15N50
Typical Performance Characteristics
TC=25°C, unless otherwise noted.
14
12
10
8
6
, Drain Current (A)
D
I
4
2
0
-2 012345
VDS, Drain to Source Voltage (V)
10000
1000
100
Junction Capacitance (pF)
10
0 5 10 15 20 25 30 35 40
VDS, Drain to Source Voltage (V)
Figure 4. On Region Characteristics
Figure 5. Typical Junction Capacitance
0.05
0.04
0.03
0.02
0.01
, Drain to Source On-resistance ()
DS(ON)
R
0.00 234567891011
ID=15A
V
, Gate to Source Voltage (V)
GS
-55oC 25oC 85oC 125oC 150oC
100
10
1
0.1
0.01
, Source Current (A)
S
I
1E-3
1E-4
1E-5
0.0 0.2 0.4 0.6 0.8 1.0 1.2
VSD, Source to Drain Voltage (V)
Figure 6. Typical Transfer Characteristics Figure 7. Source to Drain Diode Forward Voltage
f=1MHz
C
Ave
iss
C
Ave
oss
C
Ave
rss
25oC 125oC
Aug. 2013 Rev. 1. 0
BCD Semiconductor Manufacturing Limited
Page 7
Data Sheet
50V N-Channel MOSFET AF15N50
Typical Performance Characteristics
TC=25°C, unless otherwise noted.
10
8
6
4
, Gate to Source Voltage (V)
2
GS
V
0
0 5 10 15 20 25 30 35
Qg, Gate Charge (nC)
Figure 8. Gate Charge Characteristics Figure 9. R
, Drain Current (A)
D
I
DC
100
PW=10s PW=1s PW=100ms PW=10ms PW=1ms
10
PW=100s
R
DS(ON)
1
T
=150oC
J(MAX)
0.1
0.01
0.01 0.1 1 10 100
TA=25oC Single Pulse DUT on 1*MRP Board VGS=10V
VDS, Drain to Source Voltage (V)
Figure 10. SOA, Safe Operation Area Figure 11. Normalized On-resistance vs. T
VDS=25V ID=15A
18
17
16
15
14
13
12
, Drain to Source On-resistance (m)
11
DS(ON)
R
10
0 2 4 6 8 101214161820
ID, Continuous Drain Current (A)
DS(ON)
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
Normalnized Drain to Source On-resistance (m)
-50 0 50 100 150
TJ, Junction Temperature (oC)
VGS=10V VGS=4.5V
vs. Continuous Drain Current
VGS=4V VGS=10V
I
=15A
D
J
Aug. 2013 Rev. 1. 0
BCD Semiconductor Manufacturing Limited
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Data Sheet
50V N-Channel MOSFET AF15N50
Mechanical Dimensions
PDFN-5×6-8 Unit: mm(inch)
1.000(0.039)
1.200(0.047)
5.600(0.220)
6.000(0.236)
0.060(0.002)
0.200(0.008)
1.20±0.10
DEPTH
4.700(0.185)
5.100(0.201)
+0
0.05
-0.05
D
0.100(0.004) MAX
Option 1
0.900(0.035)
1.100(0.043)
E
0.210(0.008)
0.340(0.013)
0.510(0.020) MIN
0.330(0.013)
0.510(0.020)
3.820(0.150)
4.020(0.158)
3.180(0.125)
3.540(0.139)
1.170(0.046)
1.370(0.054)
Option 1
0.510(0.020)
0.710(0.028)
0.510(0.020)
0.710(0.028)
8
12
Symbol
Option1 Option2
min(mm) max(mm)min(inch) max(inch)
--
5.150(BSC)
5.100
D
--
0.203(BSC)
min(mm) max(mm) min(inch) max(inch)
0.201
5.900
6.150(BSC)
6.100 0.232
E
0.240
0.242(BSC)
Option 2
1.000(0.039)
1.400(0.055)
3.700(0.146)
4.100(0.161)
3.280(0.129)
3.680(0.145)
Pin 1 Mark
Aug. 2013 Rev. 1. 0
BCD Semiconductor Manufacturing Limited
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BCD Semiconductor Manufacturing Limited
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BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifi-
BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifi-
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