Product Summary
I
V
(BR)DSS
60V
R
7.5Ω @ V
DS(ON)
GS
= 5V
D
TA = 25°C
115mA
Description and Applications
This new generation MOSFET has been designed to minimize the onstate resistance (R
performance, making it ideal for high efficiency power management
applications.
• DC-DC Converters
• Power management functions
• Battery Operated Systems and Solid-State Relays
• Drivers: Relays, Solenoids, Lamps, Hammers, Displays,
Memories, Transistors, etc
) and yet maintain superior switching
DS(on)
SOT523
Top View
Drain
Gate
Equivalent Circuit
N-CHANNEL ENHANCEMENT MODE MOSFET
Features
• Low On-Resistance
• Low Gate Threshold Voltage
• Low Input Capacitance
• Fast Switching Speed
• Low Input/Output Leakage
• Ultra-Small Surface Mount Package
• Totally Lead Free, Full RoHS Compliant (Note 1)
• Halogen and Antimony Free. "Green" Device (Notes 2 and 3)
• Qualified to AEC-Q101 Standards for High Reliability
echanical Data
• Case: SOT523
• Case Material: Molded Plastic. “Green” Molding Compound. UL
Flammability Classification Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020
• Terminals: Matte Tin Finish annealed over Alloy 42 leadframe
(Lead Free Plating). Solderable per MIL-STD-202, Method 208
• Terminal Connections: See Diagram
• Weight: 0.002 grams (approximate)
D
GS
Source
Top View
2N7002T
Ordering Information (Note 4)
Part Number Qualification Case Packaging
2N7002T-7-F Commercial SOT523 3,000/Tape & Reel
2N7002T-13-F Commercial SOT523 10,000/Tape & Reel
2N7002TQ-7-F Automotive SOT523 3,000/Tape & Reel
2N7002TQ-13-F Automotive SOT523 10,000/Tape & Reel
Notes: 1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. No purposely added lead. Halogen and Antimony free
2. Halogen and Antimony free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
3. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb
4. For packaging details, go to our website at http://www.diodes.com.
Fire Retardants
2O3
Marking Information
Date Code Key
Year 2005 2006 2007 2008 2009 2010 2011 2012
Code S T U V W X Y Z
Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec
Code 1 2 3 4 5 6 7 8 9 O N D
72
YM
2N7002T
Document number: DS30301 Rev. 14 - 2
72 = Product Type Marking Code
YM = Date Code Marking
Y = Year (ex: T = 2006)
M = Month (ex: 9 = September)
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April 2012
© Diodes Incorporated
Maximum Ratings @T
= 25°C unless otherwise specified
A
Characteristic Symbol Value Units
Drain-Source Voltage
Drain-Gate Voltage R
≤ 1.0MΩ V
GS
Gate-Source Voltage Continuous
Pulsed
Drain Current (Note 5) Continuous
Continuous @ 100°C
Pulsed
Thermal Characteristics @T
= 25°C unless otherwise specified
A
Characteristic Symbol Value Units
Total Power Dissipation (Note 5)
Thermal Resistance, Junction to Ambient
Operating and Storage Temperature Range
V
V
Pd
R
T
j, TSTG
DSS
DGR
GSS
I
D
JA
2N7002T
60 V
60 V
±20
±40
115
73
800
V
mA
150 mW
833 °C/W
-55 to +150 °C
Electrical Characteristics @T
= 25°C unless otherwise specified
A
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 6)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current @ TC = 25°C
@ TC = 125°C
Gate-Body Leakage
BV
I
DSS
I
GSS
DSS
60
⎯ ⎯
⎯ ⎯
⎯ ⎯
V
1.0
µA
500
±10 nA
VGS = 0V, ID = 10μA
V
DS
V
GS
= 60V, V
= ±20V, V
GS
DS
= 0V
= 0V
ON CHARACTERISTICS (Note 6)
Gate Threshold Voltage
Static Drain-Source On-Resistance @ Tj = 25°C
@ T
= 125°C
On-State Drain Current
Forward Transconductance
V
GS(th
R
DS (ON)
I
D(ON
gFS
1.0
⎯
2.0
⎯
4.4
0.5 1.0
80
⎯ ⎯
2.0 V
7.5
13.5
⎯
V
= VGS, ID = 250μA
DS
V
= 5.0V, ID = 0.05A
GS
Ω
VGS = 10V, ID = 0.5A
A
VGS = 10V, VDS = 7.5V
mS
V
=10V, ID = 0.2A
DS
DYNAMIC CHARACTERISTICS (Note 7)
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
C
iss
C
oss
C
rss
⎯
22 50 pF
11 25 pF
⎯
2.0 5.0 pF
⎯
V
= 25V, VGS = 0V, f = 1.0MHz
DS
SWITCHING CHARACTERISTICS (Note 7)
Turn-On Delay Time
Turn-Off Delay Time
Notes: 5. Device mounted on FR-4 PC board, with minimum recommended pad layout, single sided.
7. Guaranteed by design. Not subject to production testing.
6 .Short duration pulse test used to minimize self-heating effect.
2N7002T
Document number: DS30301 Rev. 14 - 2
t
⎯
D(ON
t
⎯
D(OFF
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7.0 20 ns
11 20 ns
VDD = 30V, ID = 0.2A,
RL = 150Ω, V
GEN
= 10V, R
= 25Ω
GEN
April 2012
© Diodes Incorporated