Diodes 2N7002T User Manual

Page 1
Product Summary
I
V
(BR)DSS
60V
R
7.5 @ V
DS(ON)
GS
= 5V
D
TA = 25°C
115mA
Description and Applications
This new generation MOSFET has been designed to minimize the on­state resistance (R performance, making it ideal for high efficiency power management
applications.
DC-DC Converters
Power management functions
Battery Operated Systems and Solid-State Relays
Drivers: Relays, Solenoids, Lamps, Hammers, Displays,
Memories, Transistors, etc
) and yet maintain superior switching
DS(on)
SOT523
Top View
Drain
Gate
Equivalent Circuit
N-CHANNEL ENHANCEMENT MODE MOSFET
Features
Low On-Resistance
Low Gate Threshold Voltage
Low Input Capacitance
Fast Switching Speed
Low Input/Output Leakage
Ultra-Small Surface Mount Package
Totally Lead Free, Full RoHS Compliant (Note 1)
Halogen and Antimony Free. "Green" Device (Notes 2 and 3)
Qualified to AEC-Q101 Standards for High Reliability
echanical Data
Case: SOT523
Case Material: Molded Plastic. “Green” Molding Compound. UL
Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Matte Tin Finish annealed over Alloy 42 leadframe
(Lead Free Plating). Solderable per MIL-STD-202, Method 208
Terminal Connections: See Diagram
Weight: 0.002 grams (approximate)
D
GS
Source
Top View
2N7002T
Ordering Information (Note 4)
Part Number Qualification Case Packaging
2N7002T-7-F Commercial SOT523 3,000/Tape & Reel
2N7002T-13-F Commercial SOT523 10,000/Tape & Reel
2N7002TQ-7-F Automotive SOT523 3,000/Tape & Reel
2N7002TQ-13-F Automotive SOT523 10,000/Tape & Reel
Notes: 1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. No purposely added lead. Halogen and Antimony free
2. Halogen and Antimony free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.
3. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb
4. For packaging details, go to our website at http://www.diodes.com.
Fire Retardants
2O3
Marking Information
Date Code Key
Year 2005 2006 2007 2008 2009 2010 2011 2012
Code S T U V W X Y Z
Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec
Code 1 2 3 4 5 6 7 8 9 O N D
72
YM
2N7002T
Document number: DS30301 Rev. 14 - 2
72 = Product Type Marking Code YM = Date Code Marking Y = Year (ex: T = 2006) M = Month (ex: 9 = September)
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Page 2
θ
)
j
)
)
)
Maximum Ratings @T
= 25°C unless otherwise specified
A
Characteristic Symbol Value Units
Drain-Source Voltage Drain-Gate Voltage R
1.0MΩ V
GS
Gate-Source Voltage Continuous Pulsed Drain Current (Note 5) Continuous Continuous @ 100°C Pulsed
Thermal Characteristics @T
= 25°C unless otherwise specified
A
Characteristic Symbol Value Units
Total Power Dissipation (Note 5) Thermal Resistance, Junction to Ambient Operating and Storage Temperature Range
V
V
Pd
R
T
j, TSTG
DSS DGR
GSS
I
D
JA
2N7002T
60 V 60 V
±20 ±40 115
73
800
V
mA
150 mW 833 °C/W
-55 to +150 °C
Electrical Characteristics @T
= 25°C unless otherwise specified
A
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 6)
Drain-Source Breakdown Voltage Zero Gate Voltage Drain Current @ TC = 25°C
@ TC = 125°C
Gate-Body Leakage
BV
I
DSS
I
GSS
DSS
60
⎯ ⎯ ⎯ ⎯
V
1.0
µA
500 ±10 nA
VGS = 0V, ID = 10μA V
DS
V
GS
= 60V, V = ±20V, V
GS
DS
= 0V
= 0V
ON CHARACTERISTICS (Note 6)
Gate Threshold Voltage Static Drain-Source On-Resistance @ Tj = 25°C
@ T
= 125°C On-State Drain Current Forward Transconductance
V
GS(th
R
DS (ON)
I
D(ON
gFS
1.0
2.0
4.4
0.5 1.0 80
2.0 V
7.5
13.5
V
= VGS, ID = 250μA
DS
V
= 5.0V, ID = 0.05A
GS
Ω
VGS = 10V, ID = 0.5A
A
VGS = 10V, VDS = 7.5V
mS
V
=10V, ID = 0.2A
DS
DYNAMIC CHARACTERISTICS (Note 7)
Input Capacitance Output Capacitance Reverse Transfer Capacitance
C
iss
C
oss
C
rss
22 50 pF 11 25 pF
2.0 5.0 pF
V
= 25V, VGS = 0V, f = 1.0MHz
DS
SWITCHING CHARACTERISTICS (Note 7)
Turn-On Delay Time Turn-Off Delay Time
Notes: 5. Device mounted on FR-4 PC board, with minimum recommended pad layout, single sided.
7. Guaranteed by design. Not subject to production testing.
6 .Short duration pulse test used to minimize self-heating effect.
2N7002T
Document number: DS30301 Rev. 14 - 2
t
D(ON
t
D(OFF
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7.0 20 ns 11 20 ns
VDD = 30V, ID = 0.2A, RL = 150Ω, V
GEN
= 10V, R
= 25Ω
GEN
April 2012
© Diodes Incorporated
Page 3
RAIN-SOUR
CE CUR
R
N
T
R
RAIN-SOUR
CE O
N
R
TAN
C
GATE THRESH
O
OLTAG
R DRAIN-SOUR
C
C
CAPACIT
N
C
F
R DR
OUR
C
ON-R
T
C
1.0
V = 10V
V = 7.0V
GS
V = 6.0V
GS
GS
0.9
0.8
(A) E
0.7
0.6
0.5
V = 5.0V
GS
V = 4.0V
GS
5
Ω
() E
4
ESIS
-
3
V = 3.0V
GS
2N7002T
0.4
V = 4.0V
0.3
0.2
D
I, D
0.1 0
012
V , DRAIN-SO URCE VOLTAG E ( V)
DS
Fig. 1 On-Region Characteristics
2.5
E (V)
2.0
V = 3.0V
GS
V = 2.5V
GS
3
4
5
2
, D
V = 5.0V
DS(ON)
GS
1
00.2
V = .0VGS6
0.4
I , DRAIN-SOURCE CURRENT (A)
D
Fig. 2 On-Resistance Variation with Gate Voltage
and Drain-Source Current
3.0
I = 250µA
D
2.5
V = 10V
GS
I = 500mA
D
GS
V = .0V
7
GS
0.6
V = VGS10
0.8
1.0
E
2.0
1.5
LD V
1.5
1.0
,
1.0
DS(ON)
0.5
GS(th)
V,
0
-50 -25
0
T , JUNCTION TEMPERA TURE ( C)
J
25
50 75
Fig. 3 Gate Threshold Variation with Temperature
60
50
)
40
E (p A
30
100
f = 1MHz
125
150
°
ON-RESISTANCE (NORMALIZED)
0.5
0
-50
-25 0 T , JUNCTION TEMPERATURE ( C)
J
25 50
75
Fig. 4 On-Resistance Variation with Temperature
5.0
Ω
()
4.5
E AN
4.0
3.5
ESIS
3.0
E
2.5
I = 50mA
D
100 125 150
°
2.0
20
,
10
0
C
iss
C
oss
C
rss
0 5 10 15 20 25 30
V , DRAIN-SOURCE VOLTAGE (V)
DS
Fig. 5 Typical Capacitance
1.5
AIN-S
1.0
0.5
DS(ON),
0
0
2
V , GATE-SOURCE VOLTAGE (V)
GS
468
10
Fig. 6 On-Resistance vs. Gate-Source Voltage
2N7002T
Document number: DS30301 Rev. 14 - 2
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Page 4
Package Outline Dimensions
K
J
Suggested Pad Layout
Z
A
G
H
D
Y
X
2N7002T
Dim Min Max Typ
A 0.15 0.30 0.22
C
B
N
L
E
M
Dimensions Value (in mm)
C
B 0.75 0.85 0.80 C 1.45 1.75 1.60 D G 0.90 1.10 1.00 H 1.50 1.70 1.60
K 0.60 0.80 0.75 L 0.10 0.30 0.22 M 0.10 0.20 0.12 N 0.45 0.65 0.50
α
Z 1.8 X 0.4 Y 0.51 C 1.3 E 0.7
SOT523
J 0.00 0.10 0.05
0° 8°
All Dimensions in mm
0.50
2N7002T
Document number: DS30301 Rev. 14 - 2
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IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document o r products described herein in such applica tions shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorize d application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2012, Diodes Incorporated
www.diodes.com
2N7002T
2N7002T
Document number: DS30301 Rev. 14 - 2
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