Diodes 2N7002DW User Manual

Product Summary
I
max
D
V
R
(BR)DSS
60V
DS(ON)
7.5 @ V
max
= 5V
GS
TA = +25°C
0.23A
Description
This MOSFET has been designed to minimize the on-state resistance
) and yet maintain superior switching performance, making it
(R
DS(ON)
ideal for high efficiency power management applications.
Applications
Motor Control
Power Management Functions
SOT363
Top View Top View
2N7002DW
DUAL N-CHANNEL ENHANCEMENT MODE MOSFET
Features
Dual N-Channel MOSFET
Low On-Resistance
Low Gate Threshold Voltage
Low Input Capacitance
Fast Switching Speed
Low Input/Output Leakage
Ultra-Small Surface Mount Package
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Notes 3 & 4)
Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
Case: SOT363
Case Material: Molded Plastic. “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Matte Tin Finish annealed over Alloy 42 leadframe
(Lead Free Plating). Solderable per MIL-STD-202, Method 208
Terminal Connections: See Diagram
Weight: 0.006 grams (approximate)
D
2
S
2
Internal Schematic
S
G
1
1
D
G
1
2
Ordering Information (Note 5)
Part Number Compliance Case Packaging
2N7002DW-7-F Standard SOT363 3,000/Tape & Reel
2N7002DWQ-7-F Automotive SOT363 3,000/Tape & Reel
2N7002DW-13-F Standard SOT363 10,000/Tape & Reel
2N7002DWQ-13-F Automotive SOT363 10,000/Tape & Reel
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.
4. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb
5. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Fire Retardants.
2O3
Marking Information
Date Code Key
Year 1998 1999 2000 2001 2002 2003 2004 2011 2012 2013 2014 2015 2016 2017
Code J K L M N P R Y Z A B C D E
Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec
Code 1 2 3 4 5 6 7 8 9 O N D
K72
YM
YM
K72
K72
2N7002DW
Document number: DS30120 Rev. 16 - 2
YM
YM
www.diodes.com
K72 = Product Type Marking Code YM = Date Code Marking for SAT (Shanghai Assembly/ Test site) YM = Date Code Marking for CAT (Chengdu Assembly/ Test site)
K72
Y or Y = Year (ex: A = 2013) M = Month (ex: 9 = September)
1 of 5
November 2013
© Diodes Incorporated
)
)
)
2N7002DW
Maximum Ratings (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Value Units
Drain-Source Voltage
Drain-Gate Voltage R
1.0MΩ V
GS
Gate-Source Voltage
Continuous Drain Current (Note 7) VGS = 5V
Steady
State
Maximum Continuous Body Diode Forward Current (Note 7)
Pulsed Drain Current (10µs pulse, duty cycle = 1%)
Continuous
Pulsed
= +25°C
T
A
T
= +70°C
A
= +100°C
T
A
V
DSS
DGR
V
GSS
V
GSS
I
D
I
S
I
DM
60 V
60 V
±20 V
±40 V
0.23
0.18
A
0.14
0.53 A
0.8 A
Thermal Characteristics (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Value Units
T
= +25°C
A
Total Power Dissipation (Note 6)
TA = +70°C
TA = +100°C
Thermal Resistance, Junction to Ambient (Note 6)
Total Power Dissipation (Note 7)
Steady state
T
= +25°C
A
TA = +70°C
TA = +100°C
Thermal Resistance, Junction to Ambient (Note 7)
Steady state
Thermal Resistance, Junction to Case (Note 7) Steady state
Operating and Storage Temperature Range
P
R
P
R
R
T
J, TSTG
D
JA
θ
D
JA
θ
JC
θ
0.31
0.2
W
0.12
410 °C/W
0.4
0.25
W
0.15
318 °C/W
135 °C/W
-55 to +150 °C
Electrical Characteristics (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 8)
Drain-Source Breakdown Voltage Zero Gate Voltage Drain Current @ TC = +25°C
@ T
= +125°C
C
Gate-Body Leakage
BV
I
DSS
I
GSS
DSS
60 70
1.0
500
±10 nA
V
µA
V
V
V
= 0V, ID = 10µA
GS
= 60V, VGS = 0V
DS
= ±20V, VDS = 0V
GS
ON CHARACTERISTICS (Note 8)
Gate Threshold Voltage
Static Drain-Source On-Resistance @ TJ = +25°C @ T
= +125°C
J
On-State Drain Current Forward Transconductance Diode Forward Voltage
V
GS(th
R
DS (ON)
I
D(ON
g
V
FS
SD
1.0
0.5 1.0 80
3.2
4.4
2.0 V
7.5
13.5
Ω
A
mS
0.78 1.5 V
V
= VGS, ID = 250µA
DS
= 5.0V, ID = 0.05A
V
GS
V
= 10V, ID = 0.5A
GS
V
= 10V, VDS = 7.5V
GS
V
=10V, ID = 0.2A
DS
V
= 0V, IS = 115mA
GS
DYNAMIC CHARACTERISTICS (Note 9)
Input Capacitance Output Capacitance Reverse Transfer Capacitance
C
iss
C
oss
C
rss
22 50 pF 11 25 pF
2.0 5.0 pF
V f = 1.0MHz
= 25V, VGS = 0V
DS
SWITCHING CHARACTERISTICS (Note 9)
Turn-On Delay Time
Turn-Off Delay Time
Notes: 6. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
7.
8. Short duration pulse test used to minimize self-heating effect.
9. Guaranteed by design. Not subject to product testing.
Device mounted on FR-4 substrate PC board, 2oz copper, with thermal vias to bottom layer 1inch square copper plate.
2N7002DW
Document number: DS30120 Rev. 16 - 2
t
D(on
t
D(off)
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www.diodes.com
7.0 20
11.0 20
ns
V
= 30V, ID = 0.2A,
DD
R
= 150Ω, V
L
R
= 25Ω
GEN
November 2013
© Diodes Incorporated
GEN
= 10V,
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