Features
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Diodes Incorporated
2DC4672
50V NPN SURFACE MOUNT TRANSISTOR IN SOT89
Mechanical Data
BV
I
Low saturation voltage V
Complementary PNP type: 2DA1797
Totally Lead-Free & Fully RoHS compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
> 50V
CEO
= 3A High Continuous Current
C
CE(sat)
< 350mV @ 1A
Applications
Load Management Functions
Solenoid, Relay and Actuator Drivers
DC – DC Modules
SOT89
B
Case: SOT89
Case Material: Molded Plastic, “Green” Molding Compound
UL Flammability Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Finish - Matte Tin Plated Leads, Solderable per
MIL-STD-202, Method 208
Weight: 0.052 grams (Approximate)
C
E
Device Symbol Top View
Top View
Pin-Out
E
C
B
Ordering Information (Note 4)
Product Marking Reel size (inches) Tape width (mm) Quantity per reel
2DC4672-13 4672 13 12 2,500
2DC4672-13R 4672 13 12 4,000
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http”//www.diodes.com/products/packages.html
Marking Information
2DC4672
Document number: DS31636 Rev. 4 - 2
www.diodes.com
4672 = Product Type Marking Code
YWW = Date Code Marking
Y = Last digit of year (ex: 8 = 2008)
WW = Week code 01 - 53
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February 2013
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Maximum Ratings (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Value Unit
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Continuous Collector Current
Peak Pulse Current
Base Current
V
CBO
V
CEO
V
EBO
I
C
I
CM
I
B
60 V
50 V
7 V
3 A
6 A
500 mA
Thermal Characteristics (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Value Unit
Power Dissipation
Thermal Resistance, Junction to Ambient Air
Thermal Resistance, Junction to Leads (Note 7)
Operating and Storage Temperature Range
Notes: 5. For a device surface mounted on 15mm x 15mm x 0.6mm FR4 PCB with high coverage of single sided 1 oz copper, in still air conditions; the device is
measured when operating in steady state condition.
6. Same as note (5), except the device is mounted on 40mm x 40mm x 1.6mm FR4 PCB
7. Thermal resistance from junction to solder-point (on the exposed collector pad).
(Note 5)
(Note 6) 2
(Note 5)
(Note 6) 62.5
P
R
R
T
J,TSTG
θJA
θJL
D
1
125
W
°C/W
5.73 °C/W
-55 to +150 °C
Thermal Characteristics and Derating Information
2DC4672
1.0
0.8
0.6
0.4
0.2
0.0
0 25 50 75 100 125 150
Max Power Di ssipation (W)
Temperature (°C)
Derating Curve
100
Single Pulse. T
10
1
100µ 1m 10m 100m 1 10 100 1k
Max Power Dissipation (W)
Pulse Width (s)
Pulse Power Dissipation
amb
=25°C
120
100
80
D=0.5
60
40
D=0.2
20
0
100µ 1m 10m 100m 1 10 100 1k
Thermal R esistance (°C/W )
Pulse Width (s)
Single Pulse
D=0.05
D=0.1
Transient Thermal Impedance
2DC4672
Document number: DS31636 Rev. 4 - 2
2 of 6
www.diodes.com
February 2013
© Diodes Incorporated