Diodes 2DC2412R User Manual
Features
Epitaxial Planar Die Construction
Ideal for Medium Power Amplification and Switching
Totally Lead-Free & Fully RoHS compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
SOT23
B
Top View
2DC2412R
50V NPN SMALL SIGNAL SURFACE MOUNT TRANSISTOR
Mechanical Data
Case: SOT23
Case Material: molded plastic, “Green” molding compound
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Finish – Matte Tin Plated Leads, Solderable per
MIL-STD-202, Method 208
Weight: 0.008 grams (approximate)
C
E
Device Symbol
Top View
Pin-Out
Ordering Information (Notes 4)
Product Marking Reel size (inches) Tape width (mm) Quantity per reel
2DC2412R-7 N8E 7 8 3,000
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. For packaging details, go to our website at http”//www.diodes.com/products/packages.html
Marking Information
Date Code Key
Year 2010 2011 2012 2013 2014 2015 2016 2017
Code X Y Z A B C D E
Month Jan Feb Mar Apr May Jun Jul
Code 1 2 3 4 5 6 7
N8E
YW
N8E = Product Type Marking Code
YM = Date Code Marking
Y = Year (ex: Y = 2011)
M = Month (ex: 9 = September)
Aug Sep Oct Nov Dec
8 9 O N D
2DC2412R
Document number: DS31241 Rev. 3 - 2
1 of 6
www.diodes.com
February 2013
© Diodes Incorporated
2DC2412R
Maximum Ratings (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Value Unit
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Continuous Collector Current
V
CBO
V
CEO
V
EBO
I
C
60 V
50 V
7.0 V
150 mA
Thermal Characteristics (@T
= +25°C, unless otherwise specified.)
A
Characteristic Symbol Value Unit
Power Dissipation
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Leads (Note 7)
Operating and Storage Temperature Range
Notes: 5. For the device mounted on minimum recommended pad layout FR4 PCB with high coverage of single sided 1oz copper, in still air conditions.
6. For the device mounted on 15mm x 15mm x 1.6mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions.
7. Thermal resistance from junction to solder-point (at the end of the leads).
(Note 5)
(Note 6) 350
(Note 5)
(Note 6) 357
R
R
T
J,TSTG
P
θJA
θJL
D
310
403
350 °C/W
-55 to +150 °C
mW
°C/W
2DC2412R
Document number: DS31241 Rev. 3 - 2
2 of 6
www.diodes.com
February 2013
© Diodes Incorporated
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