Diodes 2DA1797 User Manual

ECB

Features

 Epitaxial Planar Die Construction

 Ideally Suited for Automated Assembly Processes

 Ideal for Medium Power Switching or Amplification Applications

 Complementary NPN Type Available (2DC4672)

 Totally Lead-Free & Fully RoHS compliant (Notes 1 & 2)
 Halogen and Antimony Free. “Green” Device (Note 3)
 Qualified to AEC-Q101 Standards for High Reliability
 PPAP Capable (Note 4)

SOT89

NEW PRODUCT

Top View

B

Device symbol

2DA1797

50V PNP SURFACE MOUNT TRANSISTOR

Mechanical Data

 Case: SOT89

 Case Material: Molded Plastic, "Green” Molding Compound.

UL Flammability Classification Rating 94V-0

 Moisture Sensitivity: Level 1 per J-STD-020

 Terminals: Finish — Matte Tin. Solderable per MIL-STD-202,

Method 208

 Weight: 0.052 grams (approximate)

C

E

C

Top View

Pin-Out

Ordering Information (Notes 4 & 5)

Part Number Compliance Marking Reel size (inches) Tape width (mm) Quantity per reel

2DA1797-13 AEC-Q101 1797 13 12 2,500

2DA1797Q-13 Automotive 1797 13 12 2,500

Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.

2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.

3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.

4. Automotive products are AEC-Q101 qualified and are PPAP capable. Automotive, AEC-Q101 and standard products are electrically and thermally the
same, except where specified. For more information, please refer to http://www.diodes.com/quality/product_compliance_definitions/.

5. For packaging details, go to our website at http://www.diodes.com/products/packages.html.

Marking Information

YWW

1797

1797 = Product Type Marking Code
YWW = Date Code Marking
Y = Last digit of year (ex: 8 = 2008)
WW = Week code (01 – 53)

2DA1797

Document number: DS31619 Rev. 4 - 2

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





Absolute Maximum Ratings (@T

Characteristic Symbol Value Unit

Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Peak Pulse Current
Continuous Collector Current

Thermal Characteristics (@T

Characteristic Symbol Value Unit

Power Dissipation (Note 6)
Thermal Resistance, Junction to Ambient Air (Note 6)
Power Dissipation (Note 7)
Thermal Resistance, Junction to Ambient Air (Note 7)

Thermal Resistance, Junction to Lead (Note 8)
Operating and Storage Temperature Range

NEW PRODUCT

ESD Ratings (Note 9)

= +25°C, unless otherwise specified.)

A

= +25°C, unless otherwise specified.)

A

2DA1797

V

CBO

V

CEO

V

EBO

I

CM

I

C

P

D

R

JA

P

D

R

JA

R

JL

T

, T

J

STG

-50 V

-50 V

-6 V

-6 A

-3 A

0.9 W

139 °C/W

2 W

62.5 °C/W

5.3 °C/W

-55 to +150 °C

Characteristic Symbol Value Unit JEDEC Class

Electrostatic Discharge - Human Body Model ESD HBM 4,000 V 3A

Electrostatic Discharge - Machine Model ESD MM 400 V C

Notes: 6. Device mounted on FR-4 PCB with minimum recommended pad layout.

7. Device mounted on FR-4 PCB with 1 inch

8. Thermal resistance from junction to solder-point (on the exposed collector pad).

9. Refer to JEDEC specification JESD22-A114 and JESD22-A115.

2

copper pad layout.

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P

P

O

R

P

TIO

A

SIE

E

M

A

E

SIS

A

C

E

Thermal Characteristics and Derating Information (@T

2.0

FR-4 PCB

2

1 inch copper pad

100 125

75

Ambient Temperature

150

NEW PRODUCT

N (W)

A

DISSI

WE

,

D

1.6

1.2

0.8

0.4

0

0

FR-4 PCB
Minimum
recommended pad

25 50

T , AMBIENT TEMPERATURE (°C)

A

Fig. 1 Power Dissipation vs.

= +25°C, unless otherwise specified.)

A

10

V

CE(sat)

Limited

1

DC

1s

100m

Single Pulse

T

=25°C

Collector Current (A)

C

10m

-I

amb

100m 1 10

100ms

10ms

-VCE Collector-Emitter Voltage (V)

Safe Operating Area

1ms

2DA1797

100µs

1

D = 0.7

0.1

0.01

D = Single Pulse

D = 0.5

D = 0.3

D = 0.1

D = 0.05

D = 0.02

D = 0.01

D = 0.005

D = 0.9

R (t) = r(t) *



JA

R = 126°C/W

JA

P(pk)

t

1

t

2

T - T = P * R (t)

JA JA12

Duty Cycle, D = t /t

R

JA

N
T

L R

R

NT TH

N

r(t), TR

0.001

0.00001 0.0001 0.001 0.01 0.1 1 10 100 1,000
t , PULSE DURATION TIME (s)

1

Fig. 10 Transient Thermal Response

2DA1797

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C

O

CTO

R CUR

RENT

C CUR

REN

T GAIN

C

O

CTO

R

T

TER

T

TER TUR

O

OLT

G

Electrical Characteristics (@T

= +25°C, unless otherwise specified.)

A

Characteristic Symbol Min Typ Max Unit Conditions

OFF CHARACTERISTICS

Collector-Base Breakdown Voltage
Collector-Emitter Breakdown Voltage (Note 10)
Emitter-Base Breakdown Voltage
Collector Cut-Off Current
Emitter Cut-Off Current
ON CHARACTERISTICS (Note 10)
Collector-Emitter Saturation Voltage
DC Current Gain
SMALL SIGNAL CHARACTERISTICS

Output Capacitance

Current Gain-Bandwidth Product

Notes: 10. Measured under pulsed conditions. Pulse width = 300μs. Duty cycle 2%.

Typical Electrical Characteristics (@T

NEW PRODUCT

= +25°C, unless otherwise specified.)

A

1.0

BV
BV
BV

V

CBO

CEO

EBO

I

CBO

I

EBO

CE(sat

h

FE

C

obo

f

T

-50

-50

 
 





-6

82



 
 
 

-0.1 μA

-0.1 μA

-100 -350 mV


27

160

270





1,000

2DA1797

V

IC = -50μA, IE = 0

V

IC = -1mA, IB = 0

V

IE = -50μA, IC = 0
VCB = -50V, IE = 0
VEB = -5V, IC = 0

IC = -1A, IB = -50mA

 VCE = -2V, IC = -500mA

= -10V, IE = 0,

V

pF

MHz

CB

f = 1MHz

= -2V, IC = -100mA,

V

CE

f = 100MHz

0.8

(A)

I = -5mA

B

0.6

I = -4mA

B

I = -3mA

0.4

B

LLE

I = -2mA

C

0.2

-I ,

B

I = -1mA

B

0

0 4 8 12 16 20

-V , COLLECTOR-EMITTER VOLTAGE (V)

CE

Fig. 3 Typical Collector Current

vs. Collector-Emitter Voltage

10

I/I = 10

CB

1

-EMI

VOLTAGE (V)

0.1

T = 150°C

A

T = 85°C

A

LLE

0.01

SATURATION

CE(SAT)

-V ,

T = 25°C

A

T = -55°C

A

T = 150°C

A

T = 85°C

A

T = 25°C

A

100

T = -55°C

A

FE

h, D

V = -4V

CE

10

1 10 100 1,000 10,000

-I , COLLECTOR CURRENT (mA)

Fig. 4 Typical DC Current Gai n vs. Collector Current

C

1.2

1.0

0.8

V = -4V

CE

T = -55°C

A

E (V)
A

N V

N-

0.6

T = 25°C

A

T = 85°C

A

0.4

T = 150°C

A

0.2

BE(ON)

0.001
1 10 100 1,000 10,000

-I , COLLECTOR CURRENT (mA)

Fig. 5 Typical Collector-Emitter Saturation Voltage

C

vs. Collector Current

2DA1797

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0

-V , BASE-EMI
1 10 100 1,000 10,000

-I , COLLECTOR CURRENT (mA)

C

Fig. 6 Typical Base-Emitter Turn-On Voltage

vs. Collector Current

November 2013

© Diodes Incorporated

T

TER

TURATIO

N VO

T

G

CAPACITAN

C

F

G

T

H PRODUCT

H

1.2
E (V)
A

L

1.0

I = 10

/I

CB

1,000

2DA1797

f = 1MHz

NEW PRODUCT

0.8

T = -55°C

A

0.6

T = 25°C

A

SA

T = 85°C

A

0.4

T = 150°C

A

0.2

0

1 10 100 1,000 10,000

BE(SAT)

-V , BASE-EMI

-I , COLLECTOR CURRENT (mA)

C

Fig. 7 Typical Base-Emitter Saturation Voltage

vs. Collector Current

1,000

z)

(M

100

)

E (p

C

ibo

100

C

obo

10

0.1 1 10 100
V , REVERSE VOLTAGE (V)

R

Fig. 8 Typical Capacitance Characteristics

10

AIN-BANDWID

T

f,

V = -2V

CE

f = 100MHz

1

0102030405060708090100

-I , COLLECTOR CURRENT (mA)

C

Fig. 9 Typical Gain-Bandwidth Product

vs. Collector Current

2DA1797

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Package Outline Dimensions

Please see AP02002 at http://www.diodes.com/datasheets/ap02002.pdf for latest version.

NEW PRODUCT

E

B1

D1

8° (4X)

D

0

0

2

.

0

R

1

H

L

B

e

A

C

H

Suggested Pad Layout

Please see AP02001 at http://www.diodes.com/datasheets/ap02001.pdf for the latest version.

Y3

Y

X (3x)

X1

X2 (2x)

Y1

Y4

Y2

C

2DA1797

SOT89

Dim Min Max

A 1.40 1.60
B 0.44 0.62

B1 0.35 0.54

C 0.35 0.44
D 4.40 4.60

D1 1.62 1.83

E 2.29 2.60

e 1.50 Typ

H 3.94 4.25

H1 2.63 2.93

L 0.89 1.20
All Dimensions in mm

Dimensions Value (in mm)

X 0.900
X1 1.733
X2 0.416

Y 1.300
Y1 4.600
Y2 1.475
Y3 0.950
Y4 1.125

C 1.500

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DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).

Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.

Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.

Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.

This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.

NEW PRODUCT

Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:

A. Life support devices or systems are devices or systems which:

1. are intended to implant into the body, or

labeling can be reasonably expected to result in significant injury to the user.

B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.

Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.

Copyright © 2013, Diodes Incorporated

www.diodes.com

2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the

IMPORTANT NOTICE

LIFE SUPPORT

2DA1797

2DA1797

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